JP5499789B2 - 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器 - Google Patents

固体撮像装置、固体撮像装置の駆動方法、及び、電子機器 Download PDF

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JP5499789B2
JP5499789B2 JP2010054140A JP2010054140A JP5499789B2 JP 5499789 B2 JP5499789 B2 JP 5499789B2 JP 2010054140 A JP2010054140 A JP 2010054140A JP 2010054140 A JP2010054140 A JP 2010054140A JP 5499789 B2 JP5499789 B2 JP 5499789B2
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signal
unit
charge
pixel
transistor
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Expired - Fee Related
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JP2010054140A
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Japanese (ja)
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JP2011188410A (ja
JP2011188410A5 (enExample
Inventor
昭彦 加藤
忠行 田浦
育弘 山村
真一 吉村
祐輔 大池
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Sony Corp
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Sony Corp
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Priority to JP2010054140A priority Critical patent/JP5499789B2/ja
Priority to US12/929,858 priority patent/US9060145B2/en
Priority to CN201110052453.5A priority patent/CN102196199B/zh
Publication of JP2011188410A publication Critical patent/JP2011188410A/ja
Publication of JP2011188410A5 publication Critical patent/JP2011188410A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H10F39/80373Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/53Control of the integration time
    • H04N25/532Control of the integration time by controlling global shutters in CMOS SSIS
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2010054140A 2010-03-11 2010-03-11 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器 Expired - Fee Related JP5499789B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010054140A JP5499789B2 (ja) 2010-03-11 2010-03-11 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器
US12/929,858 US9060145B2 (en) 2010-03-11 2011-02-22 Solid-state image taking apparatus, method for driving solid-state image taking apparatus and electronic apparatus
CN201110052453.5A CN102196199B (zh) 2010-03-11 2011-03-04 固态拍摄装置、驱动固态拍摄装置的方法以及电子设备

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JP2010054140A JP5499789B2 (ja) 2010-03-11 2010-03-11 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器

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JP2011188410A JP2011188410A (ja) 2011-09-22
JP2011188410A5 JP2011188410A5 (enExample) 2013-04-11
JP5499789B2 true JP5499789B2 (ja) 2014-05-21

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US (1) US9060145B2 (enExample)
JP (1) JP5499789B2 (enExample)
CN (1) CN102196199B (enExample)

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JP5885403B2 (ja) * 2011-06-08 2016-03-15 キヤノン株式会社 撮像装置
JP2013011662A (ja) * 2011-06-28 2013-01-17 Sony Corp 撮像装置および方法、記録媒体、並びにプログラム
JP5780025B2 (ja) * 2011-07-11 2015-09-16 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、及び電子機器
TWI467751B (zh) * 2011-12-12 2015-01-01 Sony Corp A solid-state imaging device, a driving method of a solid-state imaging device, and an electronic device
JP5987326B2 (ja) 2012-01-23 2016-09-07 ソニー株式会社 固体撮像素子および信号処理方法、並びに電子機器
JP6089419B2 (ja) * 2012-03-15 2017-03-08 カシオ計算機株式会社 撮像回路、撮像方法、撮像装置及びプログラム
TWI623232B (zh) 2013-07-05 2018-05-01 Sony Corp 固體攝像裝置及其驅動方法以及包含固體攝像裝置之電子機器
JP5968350B2 (ja) * 2014-03-14 2016-08-10 キヤノン株式会社 撮像装置、および、撮像システム
JP6324184B2 (ja) * 2014-04-18 2018-05-16 キヤノン株式会社 光電変換装置、撮像システム、および光電変換装置の駆動方法
CN104064143B (zh) * 2014-06-13 2017-02-08 上海天马有机发光显示技术有限公司 一种有机发光二极管像素驱动电路及显示装置
CN104064142B (zh) 2014-06-13 2016-09-21 上海天马有机发光显示技术有限公司 一种有机发光二极管像素驱动电路及显示装置
JP6353300B2 (ja) * 2014-07-08 2018-07-04 ソニーセミコンダクタソリューションズ株式会社 画素回路、半導体光検出装置および放射線計数装置
JP2017076899A (ja) 2015-10-15 2017-04-20 ソニー株式会社 固体撮像素子、および電子装置
JP6734649B2 (ja) 2015-12-28 2020-08-05 キヤノン株式会社 撮像装置、撮像システム、及び、撮像装置の制御方法
US9961255B2 (en) * 2016-02-09 2018-05-01 Canon Kabushiki Kaisha Image capturing apparatus, control method thereof, and storage medium
WO2018140015A1 (en) * 2017-01-25 2018-08-02 BAE Systems Imaging Solutions Inc. Backside illuminated global shutter imaging array
EP3624441B1 (en) * 2017-05-10 2024-12-25 Brillnics Singapore Pte. Ltd. Solid-state image capture device, solid-state image capture device drive method, and electronic apparatus
JP6907060B2 (ja) * 2017-07-21 2021-07-21 キヤノン株式会社 撮像素子および撮像装置
JP2020047826A (ja) * 2018-09-20 2020-03-26 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
JP2021010075A (ja) * 2019-06-28 2021-01-28 キヤノン株式会社 光電変換装置、光電変換システム、および移動体
US20230253436A1 (en) * 2022-02-07 2023-08-10 Samsung Electronics Co., Ltd. Image sensor and operation method thereof

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US7068312B2 (en) * 2000-02-10 2006-06-27 Minolta Co., Ltd. Solid-state image-sensing device
JP2006049744A (ja) * 2004-08-09 2006-02-16 Seiko Epson Corp 固体撮像装置及びその駆動方法
JP2006108889A (ja) 2004-10-01 2006-04-20 Canon Inc 固体撮像装置
JP2006311515A (ja) 2005-03-29 2006-11-09 Konica Minolta Holdings Inc 固体撮像装置
US7399951B2 (en) * 2005-03-29 2008-07-15 Konica Minolta Holdings, Inc. Solid-state image-sensing device
CN1956490B (zh) * 2005-10-28 2012-06-20 索尼株式会社 固态成像器件、驱动固态成像器件的方法和成像设备
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JP5066996B2 (ja) * 2007-04-23 2012-11-07 ソニー株式会社 固体撮像装置、固体撮像装置の信号処理方法および撮像装置
JP2009049870A (ja) * 2007-08-22 2009-03-05 Sony Corp 固体撮像装置、撮像装置
JP5568880B2 (ja) * 2008-04-03 2014-08-13 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および電子機器
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JP5219724B2 (ja) * 2008-10-09 2013-06-26 キヤノン株式会社 固体撮像装置

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Publication number Publication date
CN102196199B (zh) 2015-07-08
JP2011188410A (ja) 2011-09-22
US20110221940A1 (en) 2011-09-15
US9060145B2 (en) 2015-06-16
CN102196199A (zh) 2011-09-21

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