JP5492276B2 - 磁気ディスク用ガラス基板及び磁気ディスク - Google Patents
磁気ディスク用ガラス基板及び磁気ディスク Download PDFInfo
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- JP5492276B2 JP5492276B2 JP2012244017A JP2012244017A JP5492276B2 JP 5492276 B2 JP5492276 B2 JP 5492276B2 JP 2012244017 A JP2012244017 A JP 2012244017A JP 2012244017 A JP2012244017 A JP 2012244017A JP 5492276 B2 JP5492276 B2 JP 5492276B2
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- Prior art keywords
- magnetic disk
- glass substrate
- glass
- disk
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims description 199
- 230000005291 magnetic effect Effects 0.000 title claims description 181
- 239000000758 substrate Substances 0.000 title claims description 115
- 238000005498 polishing Methods 0.000 claims description 62
- 239000010410 layer Substances 0.000 claims description 40
- 239000000126 substance Substances 0.000 claims description 39
- 238000003426 chemical strengthening reaction Methods 0.000 claims description 26
- 239000005354 aluminosilicate glass Substances 0.000 claims description 15
- 239000002344 surface layer Substances 0.000 claims description 13
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 55
- 239000000463 material Substances 0.000 description 27
- 238000000227 grinding Methods 0.000 description 24
- 230000003746 surface roughness Effects 0.000 description 20
- 239000007788 liquid Substances 0.000 description 17
- 239000006061 abrasive grain Substances 0.000 description 15
- 238000012545 processing Methods 0.000 description 13
- 239000011241 protective layer Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
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- 238000007517 polishing process Methods 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 238000005342 ion exchange Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007730 finishing process Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000001050 lubricating effect Effects 0.000 description 4
- 239000010702 perfluoropolyether Substances 0.000 description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 4
- 238000005477 sputtering target Methods 0.000 description 4
- 229910002651 NO3 Inorganic materials 0.000 description 3
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
- 229910000929 Ru alloy Inorganic materials 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 150000001721 carbon Chemical class 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000003302 ferromagnetic material Substances 0.000 description 3
- 230000005415 magnetization Effects 0.000 description 3
- 229910000734 martensite Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 2
- 229910000684 Cobalt-chrome Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- AVMBSRQXOWNFTR-UHFFFAOYSA-N cobalt platinum Chemical compound [Pt][Co][Pt] AVMBSRQXOWNFTR-UHFFFAOYSA-N 0.000 description 2
- 239000010952 cobalt-chrome Substances 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001690 polydopamine Polymers 0.000 description 2
- 235000010333 potassium nitrate Nutrition 0.000 description 2
- 239000004323 potassium nitrate Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000013024 sodium fluoride Nutrition 0.000 description 2
- 239000011775 sodium fluoride Substances 0.000 description 2
- 235000010344 sodium nitrate Nutrition 0.000 description 2
- 239000004317 sodium nitrate Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 229910001362 Ta alloys Inorganic materials 0.000 description 1
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical compound [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 description 1
- UGGYKLULVSLVBW-UHFFFAOYSA-N [Pt].[B].[Cr].[Co] Chemical compound [Pt].[B].[Cr].[Co] UGGYKLULVSLVBW-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DRVLHCMOXCBPHN-UHFFFAOYSA-N aluminum ruthenium Chemical compound [Al].[Ru] DRVLHCMOXCBPHN-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- QNHZQZQTTIYAQM-UHFFFAOYSA-N chromium tungsten Chemical compound [Cr][W] QNHZQZQTTIYAQM-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Magnetic Record Carriers (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012244017A JP5492276B2 (ja) | 2012-11-05 | 2012-11-05 | 磁気ディスク用ガラス基板及び磁気ディスク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012244017A JP5492276B2 (ja) | 2012-11-05 | 2012-11-05 | 磁気ディスク用ガラス基板及び磁気ディスク |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010007869A Division JP5235916B2 (ja) | 2010-01-18 | 2010-01-18 | 磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法及び磁気ディスク |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013030268A JP2013030268A (ja) | 2013-02-07 |
| JP2013030268A5 JP2013030268A5 (enExample) | 2013-07-11 |
| JP5492276B2 true JP5492276B2 (ja) | 2014-05-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012244017A Expired - Lifetime JP5492276B2 (ja) | 2012-11-05 | 2012-11-05 | 磁気ディスク用ガラス基板及び磁気ディスク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5492276B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7058358B1 (ja) * | 2021-03-05 | 2022-04-21 | 株式会社Uacj | 磁気ディスク装置および磁気ディスク装置を製造する方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07230621A (ja) * | 1993-07-07 | 1995-08-29 | A G Technol Kk | 磁気ディスク用ガラス基板およびその製造方法 |
| JP2001019466A (ja) * | 1999-07-06 | 2001-01-23 | Hitachi Ltd | 磁気ディスク用ガラス基板 |
| JP2001162510A (ja) * | 1999-09-30 | 2001-06-19 | Hoya Corp | 研磨方法並びに磁気記録媒体用ガラス基板の製造方法及び磁気記録媒体の製造方法 |
| JP2002140816A (ja) * | 2000-11-01 | 2002-05-17 | Fuji Electric Co Ltd | 情報記録媒体用基板の特性評価方法 |
| JP2005108306A (ja) * | 2003-09-29 | 2005-04-21 | Hoya Corp | 磁気ディスク用ガラス基板の化学強化処理方法、磁気ディスク用化学強化ガラス基板の製造方法及び磁気ディスクの製造方法 |
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- 2012-11-05 JP JP2012244017A patent/JP5492276B2/ja not_active Expired - Lifetime
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| Publication number | Publication date |
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| JP2013030268A (ja) | 2013-02-07 |
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