JP5489454B2 - 積層型半導体パッケージ - Google Patents

積層型半導体パッケージ Download PDF

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Publication number
JP5489454B2
JP5489454B2 JP2008331194A JP2008331194A JP5489454B2 JP 5489454 B2 JP5489454 B2 JP 5489454B2 JP 2008331194 A JP2008331194 A JP 2008331194A JP 2008331194 A JP2008331194 A JP 2008331194A JP 5489454 B2 JP5489454 B2 JP 5489454B2
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JP
Japan
Prior art keywords
semiconductor element
semiconductor package
wiring board
semiconductor
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2008331194A
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English (en)
Japanese (ja)
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JP2010153651A (ja
JP2010153651A5 (OSRAM
Inventor
直樹 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008331194A priority Critical patent/JP5489454B2/ja
Publication of JP2010153651A publication Critical patent/JP2010153651A/ja
Publication of JP2010153651A5 publication Critical patent/JP2010153651A5/ja
Application granted granted Critical
Publication of JP5489454B2 publication Critical patent/JP5489454B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008331194A 2008-12-25 2008-12-25 積層型半導体パッケージ Expired - Fee Related JP5489454B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008331194A JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008331194A JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2010153651A JP2010153651A (ja) 2010-07-08
JP2010153651A5 JP2010153651A5 (OSRAM) 2012-02-16
JP5489454B2 true JP5489454B2 (ja) 2014-05-14

Family

ID=42572417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008331194A Expired - Fee Related JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Country Status (1)

Country Link
JP (1) JP5489454B2 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101930689B1 (ko) 2012-05-25 2018-12-19 삼성전자주식회사 반도체 장치
JP6415365B2 (ja) 2014-03-28 2018-10-31 株式会社ジェイデバイス 半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009265A (ja) * 2000-06-21 2002-01-11 Sony Corp 固体撮像装置
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP4436179B2 (ja) * 2004-04-20 2010-03-24 富士通マイクロエレクトロニクス株式会社 半導体装置
JP2007251070A (ja) * 2006-03-18 2007-09-27 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007281043A (ja) * 2006-04-04 2007-10-25 Matsushita Electric Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
JP2010153651A (ja) 2010-07-08

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