JP5481701B2 - 電子装置および電子装置の製造方法 - Google Patents

電子装置および電子装置の製造方法 Download PDF

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Publication number
JP5481701B2
JP5481701B2 JP2009145946A JP2009145946A JP5481701B2 JP 5481701 B2 JP5481701 B2 JP 5481701B2 JP 2009145946 A JP2009145946 A JP 2009145946A JP 2009145946 A JP2009145946 A JP 2009145946A JP 5481701 B2 JP5481701 B2 JP 5481701B2
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Japan
Prior art keywords
substrate
electronic device
bonding material
electrode post
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2009145946A
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English (en)
Japanese (ja)
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JP2011003749A (ja
JP2011003749A5 (enExample
Inventor
孝 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009145946A priority Critical patent/JP5481701B2/ja
Publication of JP2011003749A publication Critical patent/JP2011003749A/ja
Publication of JP2011003749A5 publication Critical patent/JP2011003749A5/ja
Application granted granted Critical
Publication of JP5481701B2 publication Critical patent/JP5481701B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2009145946A 2009-06-19 2009-06-19 電子装置および電子装置の製造方法 Active JP5481701B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009145946A JP5481701B2 (ja) 2009-06-19 2009-06-19 電子装置および電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009145946A JP5481701B2 (ja) 2009-06-19 2009-06-19 電子装置および電子装置の製造方法

Publications (3)

Publication Number Publication Date
JP2011003749A JP2011003749A (ja) 2011-01-06
JP2011003749A5 JP2011003749A5 (enExample) 2012-07-12
JP5481701B2 true JP5481701B2 (ja) 2014-04-23

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JP2009145946A Active JP5481701B2 (ja) 2009-06-19 2009-06-19 電子装置および電子装置の製造方法

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JP (1) JP5481701B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6036739B2 (ja) * 2014-04-04 2016-11-30 株式会社村田製作所 モジュールおよびその製造方法
US11728307B2 (en) * 2021-04-21 2023-08-15 Micron Technology, Inc. Semiconductor interconnect structures with conductive elements, and associated systems and methods

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120266B6 (ja) * 2007-01-31 2018-06-27 富士通セミコンダクター株式会社 半導体装置及びその製造方法

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Publication number Publication date
JP2011003749A (ja) 2011-01-06

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