JP5473265B2 - 多層構造計測方法および多層構造計測装置 - Google Patents
多層構造計測方法および多層構造計測装置 Download PDFInfo
- Publication number
- JP5473265B2 JP5473265B2 JP2008179311A JP2008179311A JP5473265B2 JP 5473265 B2 JP5473265 B2 JP 5473265B2 JP 2008179311 A JP2008179311 A JP 2008179311A JP 2008179311 A JP2008179311 A JP 2008179311A JP 5473265 B2 JP5473265 B2 JP 5473265B2
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- Prior art keywords
- optical distance
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- Expired - Fee Related
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B3/00—Apparatus for testing the eyes; Instruments for examining the eyes
- A61B3/10—Objective types, i.e. instruments for examining the eyes independent of the patients' perceptions or reactions
- A61B3/1005—Objective types, i.e. instruments for examining the eyes independent of the patients' perceptions or reactions for measuring distances inside the eye, e.g. thickness of the cornea
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B3/00—Apparatus for testing the eyes; Instruments for examining the eyes
- A61B3/10—Objective types, i.e. instruments for examining the eyes independent of the patients' perceptions or reactions
- A61B3/102—Objective types, i.e. instruments for examining the eyes independent of the patients' perceptions or reactions for optical coherence tomography [OCT]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02041—Interferometers characterised by particular imaging or detection techniques
- G01B9/02044—Imaging in the frequency domain, e.g. by using a spectrometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/02056—Passive reduction of errors
- G01B9/02057—Passive reduction of errors by using common path configuration, i.e. reference and object path almost entirely overlapping
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
- G01B9/02091—Tomographic interferometers, e.g. based on optical coherence
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Surgery (AREA)
- Ophthalmology & Optometry (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Engineering & Computer Science (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Biophysics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008179311A JP5473265B2 (ja) | 2008-07-09 | 2008-07-09 | 多層構造計測方法および多層構造計測装置 |
| US12/487,026 US20100007894A1 (en) | 2008-07-09 | 2009-06-18 | Multilayer Structure Measuring Method and Multilayer Structure Measuring Apparatus |
| EP09163477A EP2144034A1 (en) | 2008-07-09 | 2009-06-23 | Multilayer structure measuring method and multilayer structure measuring apparatus |
| CN2009101402379A CN101625319B (zh) | 2008-07-09 | 2009-07-09 | 多层结构测量方法和多层结构测量设备 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008179311A JP5473265B2 (ja) | 2008-07-09 | 2008-07-09 | 多層構造計測方法および多層構造計測装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010019636A JP2010019636A (ja) | 2010-01-28 |
| JP2010019636A5 JP2010019636A5 (https=) | 2011-07-21 |
| JP5473265B2 true JP5473265B2 (ja) | 2014-04-16 |
Family
ID=41066405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008179311A Expired - Fee Related JP5473265B2 (ja) | 2008-07-09 | 2008-07-09 | 多層構造計測方法および多層構造計測装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100007894A1 (https=) |
| EP (1) | EP2144034A1 (https=) |
| JP (1) | JP5473265B2 (https=) |
| CN (1) | CN101625319B (https=) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5117787B2 (ja) * | 2007-08-13 | 2013-01-16 | 株式会社トプコン | 光画像計測装置 |
| JP5483873B2 (ja) * | 2008-12-26 | 2014-05-07 | キヤノン株式会社 | 光断層撮像装置、および光断層撮像方法 |
| JP5602363B2 (ja) * | 2008-12-26 | 2014-10-08 | キヤノン株式会社 | 光干渉断層撮像装置 |
| JP5570125B2 (ja) | 2009-01-22 | 2014-08-13 | キヤノン株式会社 | 光断層撮像装置 |
| JP5279524B2 (ja) * | 2009-01-22 | 2013-09-04 | キヤノン株式会社 | 光断層撮像装置、光断層撮像方法 |
| JP5558735B2 (ja) * | 2009-04-13 | 2014-07-23 | キヤノン株式会社 | 光断層撮像装置及びその制御方法 |
| GB2478590A (en) | 2010-03-12 | 2011-09-14 | Precitec Optronik Gmbh | Apparatus and method for monitoring a thickness of a silicon wafer |
| JP5597012B2 (ja) * | 2010-03-31 | 2014-10-01 | キヤノン株式会社 | 断層画像撮像装置および断層画像撮像方法 |
| JP2012021856A (ja) * | 2010-07-14 | 2012-02-02 | Keyence Corp | 干渉膜厚計 |
| JP2012181166A (ja) * | 2011-03-03 | 2012-09-20 | Dainippon Screen Mfg Co Ltd | 膜形状取得装置および膜形状取得方法 |
| WO2012123947A2 (en) * | 2011-03-14 | 2012-09-20 | G & D Innovative Analysis, Ltd. | Method and apparatus for morphological analysis |
| GB2489722B (en) | 2011-04-06 | 2017-01-18 | Precitec Optronik Gmbh | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer |
| DE102011051146B3 (de) | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Prüfverfahren zum Prüfen einer Verbindungsschicht zwischen waferförmigen Proben |
| US8917398B2 (en) | 2011-08-28 | 2014-12-23 | G & D Innovative Analysis Ltd. | Method and apparatus for supervision of optical material production |
| JP5942494B2 (ja) * | 2012-03-12 | 2016-06-29 | コニカミノルタ株式会社 | 厚さ測定装置及び厚さ測定方法 |
| FR2988478B1 (fr) * | 2012-03-20 | 2014-04-04 | European Aeronautic Defence & Space Co Eads France | Procede et dispositif de controle non destructif de la sante matiere notamment dans les conges d'une piece composite |
| FR2994734B1 (fr) * | 2012-08-21 | 2017-08-25 | Fogale Nanotech | Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers. |
| DE102012111008B4 (de) | 2012-11-15 | 2014-05-22 | Precitec Optronik Gmbh | Optisches Messverfahren und optische Messvorrichtung zum Erfassen einer Oberflächentopographie |
| JP6057210B2 (ja) | 2012-12-13 | 2017-01-11 | 株式会社トプコン | 光学特性計測装置および光学特性計測方法 |
| TWI638131B (zh) | 2013-06-17 | 2018-10-11 | 普雷茨特光電有限公司 | 用於獲取距離差之光學量測裝置及光學量測方法 |
| ITBO20130403A1 (it) * | 2013-07-26 | 2015-01-27 | Marposs Spa | Metodo e apparecchiatura per il controllo ottico mediante interferometria dello spessore di un oggetto in lavorazione |
| JP6180909B2 (ja) * | 2013-12-06 | 2017-08-16 | 東京エレクトロン株式会社 | 距離を求める方法、静電チャックを除電する方法、及び、処理装置 |
| JP6435106B2 (ja) * | 2014-03-19 | 2018-12-05 | 株式会社ティーワイテクノ | 塗装膜解析方法 |
| US10255661B2 (en) | 2014-06-11 | 2019-04-09 | Canon Kabushiki Kaisha | Object information acquiring apparatus and image processing method |
| CN107110642B (zh) * | 2014-12-22 | 2019-12-17 | 庞巴迪公司 | 用于在线视觉检查的参考系统 |
| AU2015374335B2 (en) | 2014-12-23 | 2018-03-29 | Apple Inc. | Optical inspection system and method including accounting for variations of optical path length within a sample |
| CN105147238B (zh) * | 2015-06-19 | 2017-03-08 | 东北大学 | 一种眼睛多界面间距测量方法及装置 |
| CN108449957B (zh) | 2015-09-01 | 2021-03-09 | 苹果公司 | 用于非接触式感测物质的基准开关架构 |
| FR3045813B1 (fr) * | 2015-12-22 | 2020-05-01 | Unity Semiconductor | Dispositif et procede de mesure de hauteur en presence de couches minces |
| CN109073460B (zh) | 2016-04-21 | 2022-08-23 | 苹果公司 | 用于参考切换的光学系统 |
| US10234265B2 (en) | 2016-12-12 | 2019-03-19 | Precitec Optronik Gmbh | Distance measuring device and method for measuring distances |
| JP6776115B2 (ja) | 2016-12-22 | 2020-10-28 | キヤノン株式会社 | 処理装置および処理方法 |
| JP6333351B1 (ja) * | 2016-12-27 | 2018-05-30 | Ntn株式会社 | 測定装置、塗布装置、および膜厚測定方法 |
| US10480925B2 (en) * | 2017-01-19 | 2019-11-19 | Applejack 199 L.P. | Inspecting a slab of material |
| JP6731868B2 (ja) | 2017-02-17 | 2020-07-29 | 株式会社Screenホールディングス | 撮像方法および撮像装置 |
| US10113860B1 (en) * | 2017-04-12 | 2018-10-30 | Applejack 199, L.P. | Inspecting a multilayer sample |
| US10890434B2 (en) | 2017-04-12 | 2021-01-12 | Applejack 199 L.P. | Inspecting a multilayer sample |
| EP3688446A2 (en) | 2017-09-29 | 2020-08-05 | Apple Inc. | Resolve path optical sampling architectures |
| DE102017126310A1 (de) | 2017-11-09 | 2019-05-09 | Precitec Optronik Gmbh | Abstandsmessvorrichtung |
| CN110118533B (zh) * | 2018-02-05 | 2021-08-03 | 上海微电子装备(集团)股份有限公司 | 一种三维检测方法及检测装置 |
| CN114545550B (zh) | 2018-02-13 | 2024-05-28 | 苹果公司 | 具有集成边缘外耦合器的集成光子装置 |
| CN109164588A (zh) * | 2018-08-30 | 2019-01-08 | 天津大学 | 一种实现透过散射介质聚焦的偏振相移相位共轭方法 |
| DE102018130901A1 (de) | 2018-12-04 | 2020-06-04 | Precitec Optronik Gmbh | Optische Messeinrichtung |
| CN109632711B (zh) * | 2019-01-10 | 2021-10-01 | 山东拓步教育科技有限公司 | 一种ps小球层数检测装置 |
| CN109884588B (zh) * | 2019-01-16 | 2020-11-17 | 北京大学 | 一种脉冲序列的距离度量方法及系统 |
| CN112748111B (zh) * | 2019-10-31 | 2022-09-27 | 上海微电子装备(集团)股份有限公司 | 三维检测装置及三维检测方法 |
| CN110986890B (zh) * | 2019-11-26 | 2022-03-25 | 北京经纬恒润科技股份有限公司 | 高度检测方法及装置 |
| JP7507414B2 (ja) * | 2020-05-26 | 2024-06-28 | パナソニックIpマネジメント株式会社 | シート作成装置、シート作成方法、及び複層シートの厚さを算出する装置 |
| EP4168734B1 (de) | 2020-06-19 | 2025-09-24 | Precitec Optronik GmbH | Chromatisch konfokale messvorrichtung |
| EP4176304A1 (en) | 2020-09-09 | 2023-05-10 | Apple Inc. | Optical system for noise mitigation |
| US20240044637A1 (en) * | 2020-11-11 | 2024-02-08 | Nippon Telegraph And Telephone Corporation | Film Thickness Measurement Device and Method |
| KR102494082B1 (ko) * | 2021-01-28 | 2023-01-31 | 서울대학교산학협력단 | 간섭과 파수 고주파 변조를 이용한 박막 두께와 형상을 측정하는 장치 및 그 장치를 이용한 박막 두께와 형상 측정 방법 |
| CN113189019B (zh) * | 2021-04-21 | 2023-03-07 | 山西大学 | 基于光学频率梳的多层结构材料特性测量装置和方法 |
| US20220371152A1 (en) * | 2021-05-20 | 2022-11-24 | Applied Materials, Inc. | Fourier filtering of spectral data for measuring layer thickness during substrate processing |
| CN116148007B (zh) * | 2022-03-08 | 2025-04-18 | 上海超导科技股份有限公司 | 超导带材微观结构置样方法 |
| CN114894712B (zh) * | 2022-03-25 | 2023-08-25 | 业成科技(成都)有限公司 | 光学量测设备及其校正方法 |
| CN115035036B (zh) * | 2022-05-09 | 2025-03-11 | 北京转转精神科技有限责任公司 | 一种屏幕检测方法以及装置 |
| US12578076B2 (en) | 2023-06-05 | 2026-03-17 | Hamamatsu Photonics K.K. | Dual-output laser-driven light source |
| US12085387B1 (en) * | 2023-09-23 | 2024-09-10 | Hamamatsu Photonics K.K. | Optical coherence tomography system for subsurface inspection |
| CN120876579B (zh) * | 2025-09-26 | 2025-11-28 | 中国科学院长春光学精密机械与物理研究所 | 用于光学元件厚度检测的sd-oct系统及其检测方法 |
| CN121631993B (zh) * | 2026-02-05 | 2026-04-03 | 厦门理工学院 | 一种检测透明平板间隙的光学相干断层成像方法和系统 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2539283B2 (ja) * | 1990-07-09 | 1996-10-02 | 日本分光工業株式会社 | 膜厚測定方法 |
| JPH074922A (ja) * | 1993-06-21 | 1995-01-10 | Jasco Corp | 半導体多層薄膜膜厚測定装置およびその測定方法 |
| JPH10311708A (ja) * | 1997-05-13 | 1998-11-24 | Tokyo Seimitsu Co Ltd | 干渉式膜厚計 |
| DE19814057B4 (de) * | 1998-03-30 | 2009-01-02 | Carl Zeiss Meditec Ag | Anordnung zur optischen Kohärenztomographie und Kohärenztopographie |
| JP4242767B2 (ja) * | 2001-09-21 | 2009-03-25 | ケイマック | 2次元型検出器を用いた薄膜特性測定装置及びその測定方法 |
| JP2003240515A (ja) * | 2002-02-15 | 2003-08-27 | Toray Ind Inc | 膜厚測定方法およびシートの製造方法 |
| US6885467B2 (en) * | 2002-10-28 | 2005-04-26 | Tevet Process Control Technologies Ltd. | Method and apparatus for thickness decomposition of complicated layer structures |
| JP2005160694A (ja) * | 2003-12-02 | 2005-06-23 | Microtomography Kk | 多重波面光コヒーレンスによる眼球内距離測定装置 |
| US7177030B2 (en) * | 2004-04-22 | 2007-02-13 | Technion Research And Development Foundation Ltd. | Determination of thin film topography |
| US7301644B2 (en) * | 2004-12-02 | 2007-11-27 | University Of Miami | Enhanced optical coherence tomography for anatomical mapping |
| WO2006078802A1 (en) * | 2005-01-21 | 2006-07-27 | Massachusetts Institute Of Technology | Methods and apparatus for optical coherence tomography scanning |
| WO2006125131A2 (en) | 2005-05-19 | 2006-11-23 | Zygo Corporation | Analyzing low-coherence interferometry signals for thin film structures |
| JP2007003456A (ja) * | 2005-06-27 | 2007-01-11 | Sony Disc & Digital Solutions Inc | 膜厚測定方法、膜厚測定装置 |
| CN100507513C (zh) * | 2006-09-27 | 2009-07-01 | 中国科学院上海光学精密机械研究所 | 介质薄膜群延迟的测量方法 |
-
2008
- 2008-07-09 JP JP2008179311A patent/JP5473265B2/ja not_active Expired - Fee Related
-
2009
- 2009-06-18 US US12/487,026 patent/US20100007894A1/en not_active Abandoned
- 2009-06-23 EP EP09163477A patent/EP2144034A1/en not_active Withdrawn
- 2009-07-09 CN CN2009101402379A patent/CN101625319B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010019636A (ja) | 2010-01-28 |
| CN101625319B (zh) | 2011-06-29 |
| EP2144034A1 (en) | 2010-01-13 |
| US20100007894A1 (en) | 2010-01-14 |
| CN101625319A (zh) | 2010-01-13 |
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