JP5470705B2 - 半導体装置及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 219
- 238000004519 manufacturing process Methods 0.000 title claims description 39
- 239000000758 substrate Substances 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000005468 ion implantation Methods 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 18
- 150000004767 nitrides Chemical class 0.000 claims description 14
- 230000005533 two-dimensional electron gas Effects 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 238000002513 implantation Methods 0.000 claims description 3
- 229940126062 Compound A Drugs 0.000 claims 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 247
- 239000002346 layers by function Substances 0.000 description 37
- 238000002161 passivation Methods 0.000 description 36
- 229910002601 GaN Inorganic materials 0.000 description 24
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/8252—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Description
特公平3−3936号公報
本発明の第1の実施の形態は、HEMTが形成された電力用半導体装置及びこの電力用半導体装置の製造方法に本発明を適用した例を説明するものである。
図1及び図2に示すように、第1の実施の形態に係る電力用半導体装置1は、一主面に中央領域102と外縁を含む中央領域102の外側であって露出された周辺領域101とを有する基板2と、基板2の一主面上に基板2に比べて硬い半導体材料により構成され、周辺領域101の露出部側に傾斜した側面を持つメサ形状を有する主半導体層(半導体層)20と、主半導体層20の側面上に配設された絶縁膜12Sとを備える。
次に、前述の半導体装置1の製造方法を説明する。併せて、細分化処理前のウエーハの構造について説明する。
第1の実施の形態に係る半導体装置1及びその中間生成物であるウエーハ2Wは、周辺領域101を露出させ、中央領域102に基板2又はウエーハ2Wに比べて硬い半導体材料を有する主半導体層20を配設する。つまり、製造方法としては、ウエーハ2Wの主面の表面に達するメサエッチングを主半導体層生成層20Aに行い、細分化された主半導体層20を形成し、この後にウエーハ2Wのダイシングエリア103に細分化処理が行われる。この結果、細分化処理がウエーハ2Wだけになり、更にダイシングエリア103から周辺領域101を介在して主半導体層20の側面までの離間マージンを確保しているので、細分化処理の際の応力が特にデバイス機能層4に伝達しにくく、デバイス機能層4の側面にクラックが発生することを減少することができる。
本発明の第2の実施の形態は、前述の第1の実施の形態に係る半導体装置の製造プロセスの変形例を説明するものである。
第2の実施の形態に係る半導体装置の製造方法は、まず最初に前述の第1の実施の形態に係る半導体装置の製造方法の図7に示す、マスク20Mの開口から露出するパッシベーション膜10、パッシベーション膜6のそれぞれの一部を順次エッチングにより除去した後に、マスク20Mが除去される。
本発明の第3の実施の形態は、前述の第1又は第2の実施の形態に係るHEMTが形成された半導体装置1に代えて、MESFET(metal semiconductor field effect transistor)が形成された半導体装置1に本発明を適用した例を説明するものである。
上記のように、本発明は複数の実施の形態によって記載されているが、この開示の一部をなす論述及び図面はこの発明を限定するものでない。本発明は様々な代替実施の形態、実施例及び運用技術に適用することができる。
2…基板
20…主半導体層
2W…ウエーハ
3…バッファ層
4、41a…デバイス機能層
41…GaN層
42…AlGaN層
43…二次元電子ガス層
5S、5D…オーミック電極
6、10、12…パッシベーション膜
7S、7D…電極
7G…ゲート電極
8…HEMT
11S…半導体層
12S…絶縁膜
101…周辺領域
102…中央領域
103、103(1)、103(2)…ダイシングエリア
20M−22M…マスク
Claims (6)
- ダイシングエリアに沿って細分化された、一主面に中央領域とこの中央領域の外側に前記ダイシングエリアに沿って配設された周辺領域とを有し、IV族半導体材料又はIII−V族化合物半導体材料である基板と、
前記基板の前記中央領域上に配設され、前記基板に比べて硬い半導体材料のヘテロ接合を持つ窒化物系半導体層により構成され、且つ前記ヘテロ接合界面近傍に二次元電子ガス層を有し、周囲に前記ダイシングエリアに沿った側面を持つ半導体層と、
前記半導体層の前記側面に配設され、この側面以外の前記半導体層の他の領域に比べて抵抗値が高い高抵抗領域と、
を備えたことを特徴とする半導体装置。 - 前記高抵抗領域は、リーク電流を抑制するイオン注入層であることを特徴とする請求項1に記載の半導体装置。
- 前記半導体層の前記側面上であって、前記高抵抗領域上に絶縁膜を有することを特徴とする請求項1又は2に記載の半導体装置。
- 一主面に中央領域とこの中央領域の外側に周囲をダイシングエリアに沿って配設された周辺領域とを有し、IV族半導体材料又はIII−V族化合物半導体材料である基板の前記一主面上に、この基板に比べて硬い半導体材料の窒化物系半導体層を有する半導体層生成層を形成する工程と、
前記半導体層生成層の一部に前記基板の前記一主面の表面に達するエッチングを前記ダイシングエリアに沿って行い、前記一主面の第1の方向及びそれに交差する第2の方向に一定間隔において前記半導体層生成層から細分化され、周囲に前記ダイシングエリアに沿った側面を持つ複数の半導体層を前記中央領域上に形成する工程と、
前記半導体層の前記側面にこの側面以外の前記半導体層の他の領域に比べて抵抗値が高い高抵抗領域を形成する工程と、
前記半導体層生成層の一部がエッチングされた領域において前記基板に細分化処理を行い、前記基板を細分化する工程と、
を備えたことを特徴とする半導体装置の製造方法。 - 前記高抵抗領域を形成する工程は、前記半導体層の前記側面の表面部分に不純物を注入し、この不純物の注入によって前記半導体層の前記表面部分にリーク電流を抑制するイオン注入層を形成する工程であることを特徴とする請求項4に記載の半導体装置の製造方法。
- 前記イオン注入層を形成する工程は、前記半導体層の結晶性が前記半導体層の中央側の結晶性に比べて低下されている、又は緩和されていることを特徴とする請求項5に記載の半導体装置の製造方法。
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JP2007340972A JP5470705B2 (ja) | 2007-12-28 | 2007-12-28 | 半導体装置及びその製造方法 |
US12/244,927 US7838906B2 (en) | 2007-12-28 | 2008-10-03 | Semiconductor device and method of manufacturing the same |
US12/760,293 US8143650B2 (en) | 2007-12-28 | 2010-04-14 | Semiconductor device having resistance layer formed on side surface of semiconductor layer |
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JP4290745B2 (ja) * | 2007-03-16 | 2009-07-08 | 豊田合成株式会社 | Iii−v族半導体素子の製造方法 |
US7999288B2 (en) * | 2007-11-26 | 2011-08-16 | International Rectifier Corporation | High voltage durability III-nitride semiconductor device |
SG185120A1 (en) * | 2010-05-02 | 2012-11-29 | Visic Technologies Ltd | Field effect power transistors |
US8816395B2 (en) | 2010-05-02 | 2014-08-26 | Visic Technologies Ltd. | Field effect power transistors |
JP2014197565A (ja) * | 2011-07-29 | 2014-10-16 | パナソニック株式会社 | 半導体装置 |
US9601638B2 (en) * | 2011-10-19 | 2017-03-21 | Nxp Usa, Inc. | GaN-on-Si switch devices |
US10164038B2 (en) * | 2013-01-30 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of implanting dopants into a group III-nitride structure and device formed |
US9214423B2 (en) * | 2013-03-15 | 2015-12-15 | Semiconductor Components Industries, Llc | Method of forming a HEMT semiconductor device and structure therefor |
CN108788473B (zh) * | 2013-04-17 | 2020-08-07 | 松下知识产权经营株式会社 | 化合物半导体装置及其制造方法以及树脂密封型半导体装置 |
KR20150065240A (ko) * | 2013-12-05 | 2015-06-15 | 서울반도체 주식회사 | 누설전류 억제 구조물을 구비하는 질화물계 트랜지스터 |
JP6287143B2 (ja) * | 2013-12-06 | 2018-03-07 | 株式会社デンソー | 半導体装置およびその製造方法 |
US9711463B2 (en) * | 2015-01-14 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dicing method for power transistors |
US10283501B2 (en) * | 2016-03-03 | 2019-05-07 | Gan Systems Inc. | GaN-on-Si semiconductor device structures for high current/ high voltage lateral GaN transistors and methods of fabrication thereof |
KR102044244B1 (ko) * | 2016-12-13 | 2019-12-02 | (주)웨이비스 | 질화물계 전자소자 및 그 제조방법 |
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WO2023106087A1 (ja) * | 2021-12-09 | 2023-06-15 | 国立研究開発法人産業技術総合研究所 | 半導体装置 |
WO2023228899A1 (ja) * | 2022-05-27 | 2023-11-30 | ローム株式会社 | 窒化物半導体装置 |
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US7476918B2 (en) * | 2004-11-22 | 2009-01-13 | Panasonic Corporation | Semiconductor integrated circuit device and vehicle-mounted radar system using the same |
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US7859021B2 (en) * | 2007-08-29 | 2010-12-28 | Sanken Electric Co., Ltd. | Field-effect semiconductor device |
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US20100193842A1 (en) | 2010-08-05 |
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