JP5470483B1 - 導電性及び応力緩和特性に優れる銅合金板 - Google Patents

導電性及び応力緩和特性に優れる銅合金板 Download PDF

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Publication number
JP5470483B1
JP5470483B1 JP2013090390A JP2013090390A JP5470483B1 JP 5470483 B1 JP5470483 B1 JP 5470483B1 JP 2013090390 A JP2013090390 A JP 2013090390A JP 2013090390 A JP2013090390 A JP 2013090390A JP 5470483 B1 JP5470483 B1 JP 5470483B1
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Japan
Prior art keywords
copper alloy
mpa
alloy plate
stress relaxation
less
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JP2013090390A
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English (en)
Japanese (ja)
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JP2014101574A (ja
Inventor
隆紹 波多野
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2013090390A priority Critical patent/JP5470483B1/ja
Priority to CN201380054982.6A priority patent/CN104718302B/zh
Priority to KR1020157008502A priority patent/KR101716991B1/ko
Priority to PCT/JP2013/066875 priority patent/WO2014064961A1/ja
Priority to TW102121874A priority patent/TWI471428B/zh
Application granted granted Critical
Publication of JP5470483B1 publication Critical patent/JP5470483B1/ja
Publication of JP2014101574A publication Critical patent/JP2014101574A/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Contacts (AREA)
JP2013090390A 2012-10-22 2013-04-23 導電性及び応力緩和特性に優れる銅合金板 Active JP5470483B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013090390A JP5470483B1 (ja) 2012-10-22 2013-04-23 導電性及び応力緩和特性に優れる銅合金板
CN201380054982.6A CN104718302B (zh) 2012-10-22 2013-06-19 导电性和应力缓和特性优异的铜合金板
KR1020157008502A KR101716991B1 (ko) 2012-10-22 2013-06-19 도전성 및 응력 완화 특성이 우수한 구리 합금판
PCT/JP2013/066875 WO2014064961A1 (ja) 2012-10-22 2013-06-19 導電性及び応力緩和特性に優れる銅合金板
TW102121874A TWI471428B (zh) 2012-10-22 2013-06-20 Conductive and stress relief characteristics of excellent copper alloy plate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012233005 2012-10-22
JP2012233005 2012-10-22
JP2013090390A JP5470483B1 (ja) 2012-10-22 2013-04-23 導電性及び応力緩和特性に優れる銅合金板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013242254A Division JP5525101B2 (ja) 2012-10-22 2013-11-22 導電性及び応力緩和特性に優れる銅合金板

Publications (2)

Publication Number Publication Date
JP5470483B1 true JP5470483B1 (ja) 2014-04-16
JP2014101574A JP2014101574A (ja) 2014-06-05

Family

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Family Applications (1)

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JP2013090390A Active JP5470483B1 (ja) 2012-10-22 2013-04-23 導電性及び応力緩和特性に優れる銅合金板

Country Status (5)

Country Link
JP (1) JP5470483B1 (zh)
KR (1) KR101716991B1 (zh)
CN (1) CN104718302B (zh)
TW (1) TWI471428B (zh)
WO (1) WO2014064961A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6749121B2 (ja) * 2016-03-30 2020-09-02 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板
JP6749122B2 (ja) * 2016-03-30 2020-09-02 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板
JP6306632B2 (ja) * 2016-03-31 2018-04-04 Ｊｘ金属株式会社 電子材料用銅合金
JP6283048B2 (ja) * 2016-03-31 2018-02-21 株式会社神戸製鋼所 電気電子部品用銅合金条
TWI592946B (zh) * 2016-11-11 2017-07-21 Metal Ind Res & Dev Ct Copper alloy wire and its manufacturing method
JP7213086B2 (ja) * 2018-12-26 2023-01-26 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
TW202035722A (zh) * 2019-03-25 2020-10-01 日商Ｊｘ金屬股份有限公司 銅合金板、通電用電子零件及散熱用電子零件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749699B2 (en) * 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
JP2004256902A (ja) * 2003-02-27 2004-09-16 Nikko Metal Manufacturing Co Ltd Ｃｕ−Ｃｒ−Ｚｒ合金およびその製造方法
JP3731600B2 (ja) * 2003-09-19 2006-01-05 住友金属工業株式会社 銅合金およびその製造方法
CN100510131C (zh) * 2004-08-17 2009-07-08 株式会社神户制钢所 具有弯曲加工性的电气电子部件用铜合金板
JP4191159B2 (ja) * 2005-03-14 2008-12-03 日鉱金属株式会社 プレス加工性に優れたチタン銅
JP5135496B2 (ja) * 2007-06-01 2013-02-06 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｂｅ系銅合金板材およびその製造法
WO2009019990A1 (ja) * 2007-08-07 2009-02-12 Kabushiki Kaisha Kobe Seiko Sho 銅合金板
JP4968533B2 (ja) * 2007-11-30 2012-07-04 日立電線株式会社 電気・電子部品用銅合金材
JP5411679B2 (ja) 2009-12-07 2014-02-12 株式会社Ｓｈカッパープロダクツ 銅合金材
JP5590990B2 (ja) * 2010-06-30 2014-09-17 株式会社Ｓｈカッパープロダクツ 銅合金
KR101811080B1 (ko) * 2010-08-27 2017-12-20 후루카와 덴키 고교 가부시키가이샤 구리합금판재 및 그의 제조방법
JP5060625B2 (ja) * 2011-02-18 2012-10-31 三菱伸銅株式会社 Ｃｕ−Ｚｒ系銅合金板及びその製造方法

Also Published As

Publication number Publication date
CN104718302A (zh) 2015-06-17
TW201416463A (zh) 2014-05-01
JP2014101574A (ja) 2014-06-05
WO2014064961A1 (ja) 2014-05-01
KR20150047624A (ko) 2015-05-04
KR101716991B1 (ko) 2017-03-15
TWI471428B (zh) 2015-02-01
CN104718302B (zh) 2017-06-23

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