JP5456711B2 - Deposition equipment - Google Patents

Deposition equipment Download PDF

Info

Publication number
JP5456711B2
JP5456711B2 JP2011046565A JP2011046565A JP5456711B2 JP 5456711 B2 JP5456711 B2 JP 5456711B2 JP 2011046565 A JP2011046565 A JP 2011046565A JP 2011046565 A JP2011046565 A JP 2011046565A JP 5456711 B2 JP5456711 B2 JP 5456711B2
Authority
JP
Japan
Prior art keywords
film forming
deposition
forming material
chamber
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011046565A
Other languages
Japanese (ja)
Other versions
JP2012184457A (en
Inventor
逸史 飯尾
秀彦 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2011046565A priority Critical patent/JP5456711B2/en
Priority to TW101105865A priority patent/TWI546404B/en
Priority to CN201210051972.4A priority patent/CN102653852B/en
Priority to KR1020120021714A priority patent/KR101361289B1/en
Publication of JP2012184457A publication Critical patent/JP2012184457A/en
Application granted granted Critical
Publication of JP5456711B2 publication Critical patent/JP5456711B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52Means for observation of the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Description

本発明は、被成膜材に成膜材料を成膜する成膜装置に関するものである。   The present invention relates to a film forming apparatus for forming a film forming material on a film forming material.

従来、このような分野の技術として、下記特許文献1に記載の成膜装置が知られている。この成膜装置は、真空容器内に被成膜材を収容し、被成膜材表面に成膜材料を成膜するものである。   Conventionally, as a technique in such a field, a film forming apparatus described in Patent Document 1 below is known. This film forming apparatus accommodates a film forming material in a vacuum container and forms a film forming material on the surface of the film forming material.

特開2007−217767号公報JP 2007-217767 A

この種の成膜装置では、真空容器内における被成膜材の移動を制御すべく、所定の位置における被成膜材の有無を検出する必要がある。このような検出手段としては、例えば、被成膜材を載置するトレイ等に光を当てて検出するタイプのセンサー等が考えられる。しかしながら、このタイプのセンサーを真空容器の外側に配置して用いる場合、少なくとも真空容器の壁にセンサー光を透過する透過部を設ける必要がある。ところが、真空容器中には成膜材料が浮遊しているので透過部にも成膜材料が付着しうる。そして、成膜材料が透過部に付着し堆積することにより、当該透過部の光透過性が失われ、センサーによる検出機能を確保できなくなる場合がある。   In this type of film forming apparatus, it is necessary to detect the presence or absence of the film forming material at a predetermined position in order to control the movement of the film forming material in the vacuum container. As such a detecting means, for example, a type of sensor that detects light by applying light to a tray or the like on which a film-forming material is placed can be considered. However, when this type of sensor is used outside the vacuum vessel, it is necessary to provide a transmission portion that transmits sensor light at least on the wall of the vacuum vessel. However, since the film forming material is floating in the vacuum vessel, the film forming material can also adhere to the transmission part. Then, when the film forming material adheres to and accumulates on the transmission part, the light transmission property of the transmission part is lost, and the detection function by the sensor may not be ensured.

この問題に鑑み、本発明は、被成膜材料の有無を検出する検出機能を確保することができる成膜装置を提供することを目的とする。   In view of this problem, an object of the present invention is to provide a film forming apparatus capable of ensuring a detection function for detecting the presence or absence of a film forming material.

本発明の成膜装置は、被成膜材に成膜材料を成膜する成膜装置であって、被成膜材を収納し成膜処理を行う成膜室と、成膜室の内部に設けられ、被成膜材を搬送する搬送手段と、成膜室を画成する壁部に設けられ、光を透過する透過部を有し、成膜室の外部から内部への投光を可能とする窓部と、成膜室の外部に設けられ、窓部の透過部を透過させてセンサー光を投光し成膜室の内部の被成膜材の有無を検出する検出手段と、透過部への成膜材料の堆積を抑制する堆積抑制手段と、を備えていることを特徴とする。   A film forming apparatus of the present invention is a film forming apparatus for forming a film forming material on a film forming material, and stores a film forming material in a film forming chamber in which a film forming material is stored and a film forming process is performed. It is provided on the wall that defines the film forming chamber and the transport means for transporting the film forming material, and has a transmission part that transmits light, allowing light to be projected from the outside to the inside of the film forming chamber. And a detecting means that is provided outside the film forming chamber, detects the presence / absence of a film forming material inside the film forming chamber by transmitting sensor light through the transmitting portion of the window portion, and transmission And a deposition suppressing means for suppressing deposition of the film forming material on the part.

この成膜装置は、透過部への成膜材料の堆積が、堆積抑制手段によって抑制されるので、堆積した成膜材料によるセンサー光の透過状態の悪化を抑制することができ、その結果、被成膜材料の有無を検出する検出機能を確保することができる。   In this film forming apparatus, deposition of the film forming material on the transmission part is suppressed by the deposition suppressing means, so that deterioration of the transmission state of the sensor light due to the deposited film forming material can be suppressed. A detection function for detecting the presence or absence of the film forming material can be ensured.

また、具体的には、堆積抑制手段は、透過部へ付着した成膜材料を蒸発させると共に、透過部への成膜材料の付着を抑制することとしてもよい。   Specifically, the deposition suppressing means may evaporate the film forming material attached to the transmission part and suppress the adhesion of the film forming material to the transmission part.

更に具体的には、堆積抑制手段は、透過部を加熱する加熱部を備えることとしてもよい。この構成によれば、透過部に付着した成膜材料を加熱して蒸発させ、付着を抑制することができる。   More specifically, the deposition suppressing unit may include a heating unit that heats the transmission unit. According to this structure, the film-forming material adhering to the transmission part can be heated and evaporated to suppress adhesion.

また、加熱部は、壁部よりも成膜室の内部の側に設けられていることとしてもよい。加熱部を壁部よりも内部の側に設けることとすれば、加熱に係る透過部周辺の構造の複雑化を抑えることができる。   Further, the heating unit may be provided on the inner side of the film formation chamber than the wall portion. If the heating part is provided on the inner side of the wall part, it is possible to suppress complication of the structure around the transmission part related to heating.

また、具体的な構成として、窓部は、壁部よりも成膜室の内部の側に設けられるとともに中空部にセンサー光を通過させる筒状部を備え、筒状部の中空部に透過部が設けられており、加熱部は、筒状部の端部の側面と透過部とを囲むように設けられていることとしてもよい。この構成によれば、加熱部の熱が筒状部を通じて透過部に効率良く伝達される。   Further, as a specific configuration, the window portion is provided on the inner side of the film forming chamber with respect to the wall portion and includes a cylindrical portion that allows sensor light to pass through the hollow portion, and the transmission portion is provided in the hollow portion of the cylindrical portion. The heating part may be provided so as to surround the side surface of the end part of the cylindrical part and the transmission part. According to this structure, the heat of a heating part is efficiently transmitted to a permeation | transmission part through a cylindrical part.

また、加熱部は、壁部よりも成膜室の外部の側に設けられていることとしてもよい。加熱部を壁部よりも外部の側に設けることとすれば、成膜室内のスペースを節約することができる。   In addition, the heating unit may be provided on the outer side of the film formation chamber with respect to the wall portion. If the heating part is provided outside the wall part, the space in the film forming chamber can be saved.

また、具体的な構成として、窓部は、壁部よりも成膜室の外部の側に設けられるとともに中空部にセンサー光を通過させる筒状部を備え、筒状部の中空部に透過部が設けられており、加熱部は、筒状部の端部の側面と透過部とを囲むように設けられていることとしてもよい。この構成によれば、加熱部の熱が筒状部を通じて透過部に効率良く伝達される。   Further, as a specific configuration, the window portion is provided on the outer side of the film forming chamber with respect to the wall portion and includes a cylindrical portion that allows the sensor light to pass through the hollow portion, and the transmission portion is provided in the hollow portion of the cylindrical portion. The heating part may be provided so as to surround the side surface of the end part of the cylindrical part and the transmission part. According to this structure, the heat of a heating part is efficiently transmitted to a permeation | transmission part through a cylindrical part.

また具体的な構成として、窓部は、透過部よりも成膜室の内部の側に設けられ、センサー光を通過させる中空部を有する筒体と、中空部内に設けられセンサー光を透過する第2の透過部とを備え、透過部は、筒体と第2の透過部とによって成膜材料が浮遊する空間から仕切られており、第2の透過部は、筒体に対して着脱自在に設けられていることとしてもよい。この場合、第2の透過部が堆積抑制手段として機能する。また、第2の透過部が筒体から着脱自在であるので、第2の透過部に成膜材料が堆積した場合にも、第2の透過部を容易に交換することができ、センサー光の透過状態を確保することができる。   As a specific configuration, the window portion is provided on the inner side of the film forming chamber with respect to the transmission portion, and a cylindrical body having a hollow portion that allows sensor light to pass therethrough, and a window portion that is provided in the hollow portion and transmits the sensor light. The transmission part is partitioned from the space where the film forming material floats by the cylinder and the second transmission part, and the second transmission part is detachable from the cylinder. It may be provided. In this case, the 2nd permeation | transmission part functions as a deposition suppression means. In addition, since the second transmission part is detachable from the cylindrical body, the second transmission part can be easily replaced even when the film forming material is deposited on the second transmission part, and the sensor light A transmission state can be secured.

また、成膜材料はセレンであることとしてもよい。セレンは、透過部に厚く付着する性質があり、また付着した場合の光の透過度も低いので、透過部における光透過の阻害になりやすい。よって、成膜材料がセレンである場合には、特に上述の堆積抑制手段の必要性が高い。   The film forming material may be selenium. Selenium has a property of thickly adhering to the transmissive part, and also has a low light transmittance when adhering to it, and thus tends to hinder light transmission in the transmissive part. Therefore, when the film forming material is selenium, the necessity for the above-described deposition suppressing means is particularly high.

本発明の成膜装置によれば、被成膜材料の有無を検出する検出機能を確保することができる。   According to the film forming apparatus of the present invention, it is possible to secure a detection function for detecting the presence or absence of a film forming material.

本発明の第1実施形態に係る成膜装置を側方から見た断面図である。It is sectional drawing which looked at the film-forming apparatus which concerns on 1st Embodiment of this invention from the side. 図1の成膜装置を上方から見た断面図である。It is sectional drawing which looked at the film-forming apparatus of FIG. 1 from upper direction. 図1の成膜装置で行われる多元蒸着法を説明する図である。It is a figure explaining the multi-source vapor deposition method performed with the film-forming apparatus of FIG. CIGS発電層を備えるCIGS太陽電池の断面図である。It is sectional drawing of a CIGS solar cell provided with a CIGS electric power generation layer. 静止成膜方法による多元蒸着法を行う成膜装置の断面図である。It is sectional drawing of the film-forming apparatus which performs the multi-source vapor deposition method by a stationary film-forming method. 本発明の第2実施形態に係る成膜装置を側方から見た断面図である。It is sectional drawing which looked at the film-forming apparatus which concerns on 2nd Embodiment of this invention from the side. 図6の成膜装置を上方から見た断面図である。It is sectional drawing which looked at the film-forming apparatus of FIG. 6 from upper direction. 本発明の第3実施形態に係る成膜装置を側方から見た断面図である。It is sectional drawing which looked at the film-forming apparatus which concerns on 3rd Embodiment of this invention from the side. 図8の成膜装置を上方から見た断面図である。It is sectional drawing which looked at the film-forming apparatus of FIG. 8 from upper direction.

以下、図面を参照しつつ本発明に係る成膜装置の好適な実施形態について詳細に説明する。なお、必要な場合には、各図に示すように、Z軸を鉛直軸としXY平面を水平面とするXYZ座標系を設定し、X、Y、Zを便宜的に説明に用いる場合がある。また、Z方向を上向きとして、「上」、「下」の概念を含む語を説明に用いる場合がある。   Hereinafter, preferred embodiments of a film forming apparatus according to the present invention will be described in detail with reference to the drawings. If necessary, an XYZ coordinate system in which the Z axis is a vertical axis and the XY plane is a horizontal plane is set, and X, Y, and Z may be used for explanation as shown in the drawings. In addition, with the Z direction facing upward, words including the concepts of “upper” and “lower” may be used in the description.

(第1実施形態)
図1及び図2に示す成膜装置1は、真空の成膜室2を内部に画成するチャンバー3を備えており、成膜室2に収容されたワーク(被成膜材)Wに対し、多元蒸着法(MSD)により、セレン等を成膜材料とした成膜処理を施す装置である。例えば、成膜装置1は、太陽電池の材料であるガラス基板にセレン蒸着膜を成膜する用途で用いられる。
(First embodiment)
A film forming apparatus 1 shown in FIGS. 1 and 2 includes a chamber 3 that internally defines a vacuum film forming chamber 2, and a workpiece (film forming material) W accommodated in the film forming chamber 2. This is an apparatus for performing a film forming process using selenium or the like as a film forming material by a multi-source deposition method (MSD). For example, the film forming apparatus 1 is used for forming a selenium deposited film on a glass substrate that is a material of a solar cell.

図3に示すように、本実施形態の成膜装置1で行われる多元蒸着法は、マスクを施したワークWを成膜室2内で搬送しながら行われる。図に示すように、成膜装置1の成膜室2内で、ワークWの搬送路の上方にヒータ44が配置されている。更に、ワークWの搬送路の下方には、2つのセレン蒸着源ユニット45,45がY方向に配列され設けられている。セレン蒸着源ユニット45,45には、成膜室2外に設置されるセレン蒸着源45aが接続されている。   As shown in FIG. 3, the multi-source vapor deposition method performed in the film forming apparatus 1 according to the present embodiment is performed while conveying the work W with the mask in the film forming chamber 2. As shown in the figure, a heater 44 is disposed above the transfer path of the workpiece W in the film forming chamber 2 of the film forming apparatus 1. Further, two selenium vapor deposition source units 45, 45 are arranged in the Y direction below the work W conveyance path. A selenium vapor deposition source 45 a installed outside the film forming chamber 2 is connected to the selenium vapor deposition source units 45, 45.

また、セレン蒸着源ユニット45,45の下方には、他の蒸着物質(銅、インジウム、ガリウム)の蒸着源46,47,48が設けられている。なお、図3で、蒸着源46,47,48が、紙面に垂直なY方向に配列されているため重なって見えるが、平面視では、2つのセレン蒸着源ユニット45,45の間で、蒸着源46,47,48が順にY方向に配列されている。ワークWを載置するトレイ5には開口部(図示せず)が設けられており、セレン蒸着源ユニット45及び蒸着源46,47,48から発生する蒸着物質は、上記開口部を通じてワークWの下面に主に蒸着され、ワークWにセレン蒸着膜が形成される。   Further, below the selenium vapor deposition source units 45, 45, vapor deposition sources 46, 47, 48 of other vapor deposition materials (copper, indium, gallium) are provided. In FIG. 3, the vapor deposition sources 46, 47, 48 appear to overlap because they are arranged in the Y direction perpendicular to the paper surface, but in a plan view, the vapor deposition is performed between the two selenium vapor deposition source units 45, 45. Sources 46, 47, and 48 are sequentially arranged in the Y direction. The tray 5 on which the workpiece W is placed is provided with an opening (not shown), and the vapor deposition material generated from the selenium vapor deposition source unit 45 and the vapor deposition sources 46, 47, 48 passes through the opening. Vapor deposition is mainly performed on the lower surface, and a selenium vapor deposition film is formed on the workpiece W.

図1及び図2に示すように、成膜装置1の成膜室2内には、上記ワークWを成膜室2内で移動させるべく、ワークWを上面に載置して移動するトレイ5と、当該トレイ5を搬送する搬送装置7とが設けられている。搬送装置7はモータを動力源とする公知のものであり、成膜室2内において、Y方向に配列された複数のトレイ5を、Y方向に連続的に搬送することができる。トレイ5の搬送下流には、成膜室2からの出口があり、成膜室2内の圧力制御用の開閉可能な扉が存在する。例えば、この扉の開閉のタイミング等を制御するために、トレイ5が所定の位置に到達したか否か、ひいてはワークWが所定の位置に存在するか否かを検出する必要がある。   As shown in FIG. 1 and FIG. 2, in the film forming chamber 2 of the film forming apparatus 1, a tray 5 on which the work W is placed and moved so as to move the work W in the film forming chamber 2. And a transport device 7 for transporting the tray 5. The transfer device 7 is a known device that uses a motor as a power source, and in the film forming chamber 2, a plurality of trays 5 arranged in the Y direction can be continuously transferred in the Y direction. There is an outlet from the film forming chamber 2 downstream of the transfer of the tray 5, and there is an openable / closable door for pressure control in the film forming chamber 2. For example, in order to control the timing of opening and closing the door, it is necessary to detect whether or not the tray 5 has reached a predetermined position, and thus whether or not the workpiece W exists at the predetermined position.

そこで、成膜装置1は、成膜室2内の所定位置にトレイ5が存在するか否かを検出する検出手段を備えている。当該検出手段は、成膜室2の外部に設けられた走行センサー(検出手段)11と、当該走行センサー11から出射されるセンサー光を通過させ成膜室2の内部に導くビューポート(窓部)13とを備えている。ビューポート13の存在により、成膜室2の外部の走行センサー11から成膜室2内部への投光が可能となる。走行センサー11及びビューポート13は、チャンバー3の隔壁のうちYZ平面に平行な壁3aに設けられている。   Therefore, the film forming apparatus 1 includes a detecting unit that detects whether or not the tray 5 exists at a predetermined position in the film forming chamber 2. The detection means includes a travel sensor (detection means) 11 provided outside the film formation chamber 2, and a view port (window portion) that passes the sensor light emitted from the travel sensor 11 and guides it into the film formation chamber 2. 13). Due to the presence of the view port 13, it is possible to project light from the traveling sensor 11 outside the film forming chamber 2 into the film forming chamber 2. The travel sensor 11 and the viewport 13 are provided on a wall 3 a parallel to the YZ plane among the partition walls of the chamber 3.

走行センサー11から成膜室2の内部に向けて出射されたセンサー光は、ビューポート13を通過してX方向に出射される。当該センサー光の光軸は、符号「A」で図示されている。壁3aに対向する壁3dには、光軸A上に位置するビューポート13’と受光部17とが設けられており、上記センサ光がビューポート13’を透過して受光部17に入射する位置関係にある。ビューポート13’の詳細な図示は省略しているが、ビューポート13’はビューポート13と同様の構成を有してもよい。上記受光部17にセンサー光が入射することで、走行センサー11と受光部17との間の所定位置にトレイ5が存在しないことが認識される。そして、成膜室2内の所定位置にトレイ5が存在するときには、トレイ5の遮光部5aが光軸Aに位置し上記センサー光を遮ることで、受光部17にセンサー光が入射しなくなり、所定位置にあるトレイ5の存在が認識される。   The sensor light emitted from the travel sensor 11 toward the inside of the film formation chamber 2 passes through the view port 13 and is emitted in the X direction. The optical axis of the sensor light is indicated by “A”. The wall 3d facing the wall 3a is provided with a view port 13 ′ and a light receiving unit 17 located on the optical axis A, and the sensor light passes through the view port 13 ′ and enters the light receiving unit 17. It is in a positional relationship. Although the detailed illustration of the viewport 13 ′ is omitted, the viewport 13 ′ may have the same configuration as the viewport 13. When the sensor light is incident on the light receiving portion 17, it is recognized that the tray 5 does not exist at a predetermined position between the traveling sensor 11 and the light receiving portion 17. And when the tray 5 exists in the predetermined position in the film-forming chamber 2, the light shielding part 5a of the tray 5 is located on the optical axis A and blocks the sensor light, so that the sensor light does not enter the light receiving part 17, The presence of the tray 5 at the predetermined position is recognized.

続いて、上記ビューポート13について、更に詳細に説明する。以下、ビューポート13の構成要素の説明においては、成膜室2の内部の側(図1、図2においては左側)を「前」、成膜室2の外部の側(図1、図2においては右側)を「後」として、位置関係の説明に「前」、「後」の語の用いる場合がある。   Next, the viewport 13 will be described in more detail. Hereinafter, in the description of the components of the viewport 13, the inner side (left side in FIGS. 1 and 2) of the film forming chamber 2 is “front” and the outer side of the film forming chamber 2 (FIGS. 1 and 2). In this case, the word “front” and “back” may be used to describe the positional relationship.

ビューポート13は、成膜室2の真空と外部の大気とを仕切る透明の仕切ガラス21を備えている。仕切ガラス21は、Oリング21aを介して壁3aの外側に固定され、光軸A上に位置し、センサー光を透過する。仕切ガラス21は、例えば厚さ6mm以上の透明な耐熱ガラスである。更に、ビューポート13は、仕切ガラス21の前方において、壁3aよりも成膜室2の内部の側に位置するSUS製の筒状部23を備えている。光軸Aは、筒状部23の中空部23aを通過している。筒状部23の後端側は、壁3aに埋め込まれており、筒状部23の前端側には、光軸A上に位置する防着ガラス(透過部)27が中空部23a内に嵌め込まれている。防着ガラス27はセンサー光を透過する。なお、筒状部23の上部には連通孔23bが設けられているので、中空部23a内も成膜室2と同様に真空とされる。以上のビューポート13の構成により、走行センサー11から出射されるセンサー光は、仕切ガラス21を透過し、中空部23aを通過し、更に防着ガラス27を通過して成膜室2内に照射される。   The viewport 13 includes a transparent partition glass 21 that partitions the vacuum in the film formation chamber 2 from the outside atmosphere. The partition glass 21 is fixed to the outside of the wall 3a through an O-ring 21a, is positioned on the optical axis A, and transmits sensor light. The partition glass 21 is a transparent heat-resistant glass having a thickness of 6 mm or more, for example. Further, the viewport 13 includes a cylindrical portion 23 made of SUS positioned in front of the partition glass 21 and closer to the inside of the film forming chamber 2 than the wall 3a. The optical axis A passes through the hollow portion 23 a of the cylindrical portion 23. The rear end side of the cylindrical portion 23 is embedded in the wall 3a, and an anti-adhesion glass (transmission portion) 27 located on the optical axis A is fitted into the hollow portion 23a on the front end side of the cylindrical portion 23. It is. The deposition preventing glass 27 transmits sensor light. In addition, since the communication hole 23b is provided in the upper part of the cylindrical part 23, the inside of the hollow part 23a is also evacuated similarly to the film-forming chamber 2. With the configuration of the view port 13 described above, the sensor light emitted from the travel sensor 11 passes through the partition glass 21, passes through the hollow portion 23 a, passes through the deposition glass 27, and is irradiated into the film forming chamber 2. Is done.

成膜室2には成膜材料が浮遊しており、仕切ガラス21や防着ガラス27のような透明部材上に成膜材料が付着し堆積すると、センサー光の透過状態が悪化し、トレイ5の有無の検出ができなくなってしまう。この成膜装置1では、仕切ガラス21の前方に防着ガラス27を設置することで、仕切ガラス21上への成膜材料の堆積を抑制するものであるが、この場合、防着ガラス27への成膜材料の付着・堆積が同様の問題を発生させる。よって、防着ガラス27への成膜材料の堆積を抑制する手段が望まれる。特に、成膜装置1で成膜材料として使用されるセレンは、防着ガラス27等に厚く付着する性質があり、また付着した場合の光の透過度も低いので、防着ガラス27における光透過の阻害になりやすい。よって、成膜材料としてセレンを用いる場合には、特に堆積抑制の必要性が高い。   The film forming material floats in the film forming chamber 2, and when the film forming material adheres and deposits on a transparent member such as the partition glass 21 or the deposition preventing glass 27, the transmission state of the sensor light deteriorates, and the tray 5 It becomes impossible to detect the presence or absence. In this film forming apparatus 1, the deposition glass 27 is placed in front of the partition glass 21 to suppress deposition of the film forming material on the partition glass 21. The deposition and deposition of the film forming material causes the same problem. Therefore, a means for suppressing the deposition of the film forming material on the deposition preventing glass 27 is desired. In particular, selenium used as a film forming material in the film forming apparatus 1 has a property of adhering thickly to the anti-adhesion glass 27 and the like, and the light transmittance when adhering is low. It tends to be an obstacle. Therefore, when selenium is used as a film forming material, the necessity for suppressing deposition is particularly high.

そこで、成膜装置1のビューポート13は、防着ガラス27を加熱するためのヒータ(加熱部、堆積抑制手段)31を備えている。ヒータ31は、筒状部23の前端側の側面の周囲に巻き付けられている。そして、給電部33からヒータ31に給電することで、筒状部23を加熱し、間接的に防着ガラス27を加熱する。ヒータ31が筒状部23側面と防着ガラス27とを囲むように設けられているので、ヒータ31の熱が効率良く防着ガラス27に伝達される。また、筒状部23がSUS製であることも、伝熱効率を高める要因となる。更に、ヒータ31の周りを囲むように、ヒータ31からの放射熱を反射する反射板35が設けられており、防着ガラス27への伝熱効率を更に高めている。   Therefore, the view port 13 of the film forming apparatus 1 includes a heater (heating unit, deposition suppressing means) 31 for heating the deposition preventing glass 27. The heater 31 is wound around the side surface on the front end side of the tubular portion 23. And the cylindrical part 23 is heated by supplying with electricity to the heater 31 from the electric power feeding part 33, and the deposition prevention glass 27 is heated indirectly. Since the heater 31 is provided so as to surround the side surface of the cylindrical portion 23 and the deposition preventing glass 27, the heat of the heater 31 is efficiently transmitted to the deposition preventing glass 27. Moreover, it is also a factor which improves the heat-transfer efficiency that the cylindrical part 23 is a product made from SUS. Further, a reflection plate 35 that reflects the radiant heat from the heater 31 is provided so as to surround the heater 31, and the heat transfer efficiency to the deposition preventing glass 27 is further enhanced.

この構成によれば、防着ガラス27が加熱されるので、防着ガラス27に付着した成膜材料が、防着ガラス27の熱で昇華(蒸発)する。また、防着ガラス27に付着しようとする成膜材料も付着直後に昇華することになるので、防着ガラス27への成膜材料の付着自体が抑制される。よって、防着ガラス27への成膜材料の堆積が抑制され、堆積した成膜材料によるセンサー光の透過状態の悪化を抑制することができる。その結果、走行センサー11の検出機能を確保することができ、ワークW搬送の正確な制御が可能になる。なお、このような作用効果を得るためには、セレンの蒸発温度(120℃)を考慮し、防着ガラス27の加熱温度は約150℃とされる。また、他の成膜材料が用いられる場合には、その成膜材料の蒸発温度を考慮して、防着ガラス27の加熱温度を適宜設定すればよい。   According to this configuration, since the deposition preventing glass 27 is heated, the film forming material attached to the deposition preventing glass 27 is sublimated (evaporated) by the heat of the deposition preventing glass 27. Further, since the film forming material to be attached to the deposition preventing glass 27 is sublimated immediately after the deposition, the deposition itself of the deposition material to the deposition preventing glass 27 is suppressed. Therefore, the deposition of the film forming material on the deposition preventing glass 27 is suppressed, and deterioration of the transmission state of the sensor light due to the deposited film forming material can be suppressed. As a result, the detection function of the travel sensor 11 can be ensured, and the workpiece W conveyance can be accurately controlled. In order to obtain such effects, the heating temperature of the deposition preventing glass 27 is about 150 ° C. in consideration of the evaporation temperature of selenium (120 ° C.). In the case where another film forming material is used, the heating temperature of the deposition preventing glass 27 may be appropriately set in consideration of the evaporation temperature of the film forming material.

また、ヒータ31、筒状部23及び防着ガラス27が、壁3aよりも成膜室2の内部の側の位置に設けられるので、ビューポート13において成膜室2を真空封止する構造も複雑にならず、部品点数の増加を抑えることができる。   In addition, since the heater 31, the cylindrical portion 23, and the deposition glass 27 are provided at a position on the inner side of the film forming chamber 2 with respect to the wall 3a, the structure in which the film forming chamber 2 is vacuum-sealed in the view port 13 is also provided. It is not complicated and the increase in the number of parts can be suppressed.

ここで、センサー光の透過状態を確保するための他の構成としては、防着ガラス27を省略し、仕切ガラス21を加熱する加熱手段を設ける構成も考えられる。ところが、仕切ガラス21は、真空の成膜室2を大気から封止するものであるために、Oリング21aを介して取り付けられる。従って、仕切ガラス21を加熱する構成を採用する場合には、Oリング21aの熱劣化による封止機能の劣化を避けるために、熱劣化が少ない材質からなる特殊なOリング21aを採用することが必要になる。このような特殊なOリング21aを採用すれば、仕切ガラス21を直接加熱して仕切ガラス21への成膜材料の付着を抑制することができ、防着ガラス27やその周囲の構成要素を省略して部品点数を減少させることができる。   Here, as another configuration for securing the transmission state of the sensor light, a configuration in which the deposition preventing glass 27 is omitted and a heating unit for heating the partition glass 21 is also conceivable. However, since the partition glass 21 seals the vacuum film formation chamber 2 from the atmosphere, it is attached via the O-ring 21a. Therefore, when the configuration for heating the partition glass 21 is employed, a special O-ring 21a made of a material with little thermal degradation may be employed in order to avoid degradation of the sealing function due to thermal degradation of the O-ring 21a. I need it. If such a special O-ring 21a is adopted, the partition glass 21 can be directly heated to suppress adhesion of the film forming material to the partition glass 21, and the deposition preventing glass 27 and its surrounding components are omitted. Thus, the number of parts can be reduced.

これに対し、上述した成膜装置1では、上記のような特殊なOリングを不要とすべく、防着ガラス27を仕切ガラス21の前方に設けて、成膜材料が希薄な空間(中空部23a)を防着ガラス27と仕切ガラス21との間に形成した上で、防着ガラス27を加熱する構成としたものである。防着ガラス27は、圧力が異なる空間同士の仕切ではなくOリングは不要であるので、防着ガラス27を加熱してもOリングの劣化といったような問題は発生しない。   On the other hand, in the film forming apparatus 1 described above, the deposition glass 27 is provided in front of the partition glass 21 in order to eliminate the need for the special O-ring as described above, and the space (hollow portion) where the film forming material is thin. 23a) is formed between the deposition preventing glass 27 and the partition glass 21, and the deposition preventing glass 27 is heated. Since the protective glass 27 is not a partition between spaces having different pressures and an O-ring is not required, problems such as deterioration of the O-ring do not occur even if the protective glass 27 is heated.

以上説明した成膜装置1は、好適な一適用例として、例えば、CIGS太陽電池のCIGS発電層の成膜に用いられる。図4に、CIGS太陽電池の一例を示す。同図に示すように、CIGS太陽電池70は、ソーダライムガラス71上に、Mo裏面電極72と、CIGS発電層73と、バッファ層74と、透明導電膜75と、が順に成膜され積層されてなる。Mo裏面電極72はスパッタ法で成膜され、CIGS発電層73はセレン化法又は多元蒸着法で成膜され、バッファ層74はスパッタ法で成膜され、透明導電膜75はRPD法、スパッタ法、又はCVD法で成膜される。このうち、CIGS発電層73の成膜が、多元蒸着法を用いて成膜装置1により行われる。   The film formation apparatus 1 demonstrated above is used for film-forming of the CIGS electric power generation layer of a CIGS solar cell as a suitable one application example, for example. FIG. 4 shows an example of a CIGS solar cell. As shown in the figure, a CIGS solar cell 70 is formed by laminating a Mo back electrode 72, a CIGS power generation layer 73, a buffer layer 74, and a transparent conductive film 75 in this order on a soda lime glass 71. It becomes. The Mo back electrode 72 is formed by sputtering, the CIGS power generation layer 73 is formed by selenization or multi-source evaporation, the buffer layer 74 is formed by sputtering, and the transparent conductive film 75 is formed by RPD or sputtering. Alternatively, the film is formed by a CVD method. Among these, the film formation of the CIGS power generation layer 73 is performed by the film formation apparatus 1 using a multi-source deposition method.

なお、成膜装置1を用いる方法以外にも、一般的な他の多元蒸着法としては、ワークを搬送せずに静止させて行う静止成膜方法もある。静止成膜方法では、図5に示すように、マスクを施したワークWを成膜装置51の成膜室52内に設置して行われる。例えば、成膜室52内で、ワークWの上方に温度センサー53及びヒータ54を順次に配置し、ワークWの下方には開口部56aを有する開口板56及びシャッタ58を順次に配置する。そして、シャッタの下方に、第1〜第nの蒸着源60a,60b,60c,…が配置される。セレン蒸着膜を生成する場合において、第1〜第nの蒸着源(成膜材料)には、銅、インジウム、ガリウム及びセレンが適用される。多元蒸着法は公知の方法であるので、更なる詳細な説明は省略する。   In addition to the method using the film forming apparatus 1, as another general multi-source vapor deposition method, there is a static film forming method in which a workpiece is kept stationary without being conveyed. In the stationary film forming method, as shown in FIG. 5, the work W provided with a mask is placed in the film forming chamber 52 of the film forming apparatus 51. For example, in the film forming chamber 52, the temperature sensor 53 and the heater 54 are sequentially disposed above the work W, and the opening plate 56 having the opening 56 a and the shutter 58 are sequentially disposed below the work W. And 1st-nth vapor deposition source 60a, 60b, 60c, ... is arrange | positioned under a shutter. In the case of generating a selenium vapor deposition film, copper, indium, gallium and selenium are applied to the first to nth vapor deposition sources (film formation materials). Since the multi-source deposition method is a known method, further detailed description is omitted.

(第2実施形態)
図6及び図7に示す成膜装置201は、上記成膜装置1におけるビューポート13に代えて、ビューポート213を備えている。以下、成膜装置201において、前述の成膜装置1と同一又は同等な構成部分には同一符号を付し重複する説明を省略する。
(Second Embodiment)
A film forming apparatus 201 shown in FIGS. 6 and 7 includes a view port 213 instead of the view port 13 in the film forming apparatus 1. Hereinafter, in the film forming apparatus 201, the same or equivalent components as those of the above-described film forming apparatus 1 are denoted by the same reference numerals, and redundant description is omitted.

ビューポート213は、チャンバー3の壁3aを貫通する防着管251を有している。光軸Aは、防着管251の中空部251aを通過する。防着管251の後端部の直ぐ後方に防着ガラス(透過部)227が設けられている。更に、ビューポート213は、防着管251の後方に設けられたSUS製の筒状部(筒状部)223を備えている。防着ガラス227は、筒状部223の前端部において中空部223aに嵌め込まれている。そして、筒状部223の後方に、仕切ガラス221が設けられ、その仕切ガラス221の後方に走行センサー11が設けられている。以上のビューポート213の構成により、走行センサー11から出射されるセンサー光は、仕切ガラス221を透過し、筒状部223の中空部223aを通過し、防着ガラス227を透過し、防着管251の中空部251aを通過して、成膜室2の内部に照射される。なお、成膜装置1(図1)と同様に、壁3aに対向する壁3dには、光軸A上に位置するビューポート13’及び受光部17が設けられているが、その図示は省略している。   The view port 213 includes a deposition prevention tube 251 that penetrates the wall 3 a of the chamber 3. The optical axis A passes through the hollow portion 251a of the deposition preventing tube 251. An adhesion prevention glass (transmission part) 227 is provided immediately behind the rear end of the adhesion prevention pipe 251. Furthermore, the view port 213 includes a cylindrical portion (cylindrical portion) 223 made of SUS provided behind the protection tube 251. The anti-adhesion glass 227 is fitted into the hollow portion 223 a at the front end portion of the cylindrical portion 223. A partition glass 221 is provided behind the tubular portion 223, and the travel sensor 11 is provided behind the partition glass 221. With the configuration of the view port 213 described above, the sensor light emitted from the travel sensor 11 passes through the partition glass 221, passes through the hollow portion 223 a of the cylindrical portion 223, passes through the deposition glass 227, and is installed on the deposition tube. The film 251 is irradiated into the film forming chamber 2 through the hollow portion 251a. As with the film forming apparatus 1 (FIG. 1), the wall 3d facing the wall 3a is provided with a view port 13 ′ and a light receiving unit 17 located on the optical axis A, but the illustration thereof is omitted. doing.

また、この成膜装置201においては、防着管251の中空部251aが成膜室2内の成膜材料に晒されるので、成膜材料が中空部251aの内壁面に付着していく。従って、中空部251aに付着堆積した成膜材料がセンサ光を遮らないように、定期的に防着管251を交換する運用とする。   Further, in this film forming apparatus 201, since the hollow portion 251a of the deposition preventing tube 251 is exposed to the film forming material in the film forming chamber 2, the film forming material adheres to the inner wall surface of the hollow portion 251a. Therefore, the deposition tube 251 is periodically replaced so that the film forming material deposited and deposited on the hollow portion 251a does not block the sensor light.

更に、ビューポート213は、防着ガラス227を加熱するためのヒータ(加熱部、堆積抑制手段)231を備えている。ヒータ231は、筒状部223の前端側の側面の周囲に巻き付けられている。そして、給電部233からヒータ231に給電することで、筒状部223を加熱し、間接的に防着ガラス227を加熱する。ヒータ231が筒状部223側面と防着ガラス227とを囲むように設けられているので、ヒータ231の熱が効率良く防着ガラス227に伝達される。また、筒状部223がSUS製であることも、伝熱効率を高める要因となる。更に、ヒータ231の周りを囲むように、ヒータ231からの放射熱を反射する反射板235が設けられており、防着ガラス227への伝熱効率を更に高めている。   Further, the viewport 213 includes a heater (heating unit, deposition suppressing means) 231 for heating the deposition preventing glass 227. The heater 231 is wound around the side surface on the front end side of the cylindrical portion 223. And the cylindrical part 223 is heated by supplying electric power to the heater 231 from the electric power feeding part 233, and the deposition prevention glass 227 is heated indirectly. Since the heater 231 is provided so as to surround the side surface of the cylindrical portion 223 and the deposition preventing glass 227, the heat of the heater 231 is efficiently transmitted to the deposition preventing glass 227. Moreover, it is also a factor which improves the heat-transfer efficiency that the cylindrical part 223 is a product made from SUS. Further, a reflection plate 235 that reflects the radiant heat from the heater 231 is provided so as to surround the heater 231, and the heat transfer efficiency to the deposition preventing glass 227 is further enhanced.

また、このようなビューポート213の構成では、筒状部223、防着ガラス227及びヒータ231が成膜室2の外部に設けられるので、これらを収容するための真空ケース部253が、壁3aから外側に張り出して設けられている。仕切ガラス221は、Oリング221aを介して真空ケース部253の後端部に取り付けられており、真空の成膜室2を大気から封止している。ヒータ231の熱によるOリング221aの劣化を抑制すべく、真空ケース部253の後端部を冷却するため、冷却水を流動させる冷却水路253aが、真空ケース部253の後端部に設けられている。   Further, in such a configuration of the viewport 213, since the cylindrical portion 223, the deposition preventing glass 227, and the heater 231 are provided outside the film forming chamber 2, the vacuum case portion 253 for housing them is provided with the wall 3a. It protrudes from the outside and is provided. The partition glass 221 is attached to the rear end portion of the vacuum case portion 253 via an O-ring 221a, and seals the vacuum film formation chamber 2 from the atmosphere. In order to cool the rear end portion of the vacuum case portion 253 in order to suppress the deterioration of the O-ring 221a due to the heat of the heater 231, a cooling water passage 253a for flowing the cooling water is provided at the rear end portion of the vacuum case portion 253. Yes.

成膜装置201では、防着ガラス227をヒータ231で加熱することにより、前述の成膜装置1と同様の作用効果が奏される。すなわち、センサー光の透過状態の悪化を抑制することができ、走行センサー11の検出機能を確保することができ、ワークW搬送の正確な制御が可能になる。また、筒状部223、防着ガラス227及びヒータ231を壁3aよりも成膜室2の外部の側に設ける構成を採用しているので、成膜室2の内部のスペースを節約することができる。さらに、既存の成膜装置にビューポートを追加する場合に、成膜室2の内部にスペースの余裕がない場合であっても、壁3aの外側にビューポート213の上記各要素を取り付けることができる。   In the film forming apparatus 201, the same effect as that of the film forming apparatus 1 described above is achieved by heating the deposition preventing glass 227 with the heater 231. That is, the deterioration of the transmission state of the sensor light can be suppressed, the detection function of the travel sensor 11 can be ensured, and the workpiece W conveyance can be accurately controlled. In addition, since the configuration in which the cylindrical portion 223, the deposition glass 227, and the heater 231 are provided on the outer side of the film forming chamber 2 with respect to the wall 3a is adopted, the space inside the film forming chamber 2 can be saved. it can. Further, when a viewport is added to an existing film formation apparatus, each element of the viewport 213 can be attached to the outside of the wall 3a even if there is no room in the film formation chamber 2. it can.

(第3実施形態)
図8及び図9に示す成膜装置301は、上記成膜装置1におけるビューポート13に代えて、ビューポート313を備えている。以下、成膜装置301において、前述の成膜装置1,201と同一又は同等な構成部分には同一符号を付し重複する説明を省略する。
(Third embodiment)
A film deposition apparatus 301 shown in FIGS. 8 and 9 includes a view port 313 instead of the view port 13 in the film deposition apparatus 1. Hereinafter, in the film forming apparatus 301, the same or equivalent components as those of the above-described film forming apparatuses 1 and 201 are denoted by the same reference numerals, and redundant description is omitted.

ビューポート313は、仕切ガラス21の前方に設けられた防着管(筒体)351を備えている。光軸Aは、防着管351の中空部351aを通過している。防着管351の後端側は、壁3aに形成された貫通孔3bに挿入されている。防着管351の長手方向中央部には、防着ガラス(第2の透過部)327が、着脱自在に取り付けられている。例えば、防着管351には、YZ平面に平行な板状の防着ガラス327を、上方から挿入させるスリットが形成され、当該スリットに防着ガラス327を挿抜することができる構成とされている。防着ガラス327は、防着管351の中空部351aを前後に分断するように挿入され、光軸Aを横切るように配置される。走行センサー11からのセンサー光は、仕切ガラス21を透過し、貫通孔3bを通過する。更に、センサー光は、防着管351の中空部351aを通過するときに防着ガラス327を透過して、成膜室2内に照射される。なお、成膜装置1(図1)と同様に、壁3aに対向する壁3dには、光軸A上に位置するビューポート13’及び受光部17が設けられているが、その図示は省略している。   The viewport 313 includes an adhesion-preventing tube (tubular body) 351 provided in front of the partition glass 21. The optical axis A passes through the hollow portion 351a of the deposition preventing tube 351. The rear end side of the protection tube 351 is inserted into a through hole 3b formed in the wall 3a. An adhesion-preventing glass (second transmission part) 327 is detachably attached to the center part in the longitudinal direction of the adhesion-preventing tube 351. For example, the deposition tube 351 is formed with a slit for inserting a plate-shaped deposition glass 327 parallel to the YZ plane from above, and the deposition glass 327 can be inserted into and removed from the slit. . The deposition preventing glass 327 is inserted so as to divide the hollow portion 351a of the deposition preventing tube 351 in the front-rear direction, and is disposed so as to cross the optical axis A. Sensor light from the travel sensor 11 passes through the partition glass 21 and passes through the through hole 3b. Further, the sensor light is transmitted through the deposition preventing glass 327 when passing through the hollow portion 351 a of the deposition preventing tube 351 and is irradiated into the film forming chamber 2. As with the film forming apparatus 1 (FIG. 1), the wall 3d facing the wall 3a is provided with a view port 13 ′ and a light receiving unit 17 located on the optical axis A, but the illustration thereof is omitted. doing.

この構成によれば、仕切ガラス(透過部)21の前方に、防着管351が設けられ、当該防着管351の中空部351aに防着ガラス(堆積抑制手段)327が存在しているので、仕切ガラス21は、成膜材料が浮遊する成膜室2の空間から仕切られている。よって、成膜室2に浮遊する成膜材料は、仕切ガラス21まで到達し難い。従って、仕切ガラス21への成膜材料の堆積が抑制され、仕切ガラス21に堆積した成膜材料によるセンサー光の透過状態の悪化を抑制することができる。この場合、防着ガラス327には成膜材料が比較的接触し易いが、当該防着ガラス327に成膜材料が堆積した場合にも、防着ガラス327を容易に着脱し交換することができ、センサー光の透過状態を回復させることができる。また、定期的に防着ガラス327を交換することにより、防着ガラス327におけるセンサー光の透過状態を良好に維持することができる。その結果、走行センサー11の検出機能を確保することができ、ワークW搬送の正確な制御が可能になる。   According to this configuration, the deposition preventing tube 351 is provided in front of the partition glass (transmission portion) 21, and the deposition preventing glass (deposition suppressing means) 327 exists in the hollow portion 351 a of the deposition preventing tube 351. The partition glass 21 is partitioned from the space of the film forming chamber 2 where the film forming material floats. Therefore, it is difficult for the film forming material floating in the film forming chamber 2 to reach the partition glass 21. Therefore, deposition of the film forming material on the partition glass 21 is suppressed, and deterioration of the transmission state of the sensor light due to the film forming material deposited on the partition glass 21 can be suppressed. In this case, the deposition material is relatively in contact with the deposition glass 327, but the deposition glass 327 can be easily attached and detached even when the deposition material is deposited on the deposition glass 327. The transmission state of the sensor light can be recovered. In addition, by periodically replacing the deposition glass 327, the sensor light transmission state in the deposition glass 327 can be favorably maintained. As a result, the detection function of the travel sensor 11 can be ensured, and the workpiece W conveyance can be accurately controlled.

本発明は、上述した第1〜第3実施形態に限定されるものではない。例えば、第1及び第2実施形態においては、防着ガラス27,227を加熱するために光周波ヒータを用いてもよい。また、防着ガラス27,227にヒータを内蔵しヒータを直接加熱してもよい。また、成膜材料の付着・堆積を抑制する手段としては、防着ガラス27,227の加熱に限られず、防着ガラス27,227を帯電させてもよい。また、第1〜第3実施形態では、ワークWの有無を間接的に検出すべく、トレイ5の有無を検出しているが、センサー光をワークWに照射しワークWの有無を直接検出してもよい。また、第1〜第3実施形態では、検出手段として透過型のセンサーを用いているが、反射型のセンサを用いてもよい。また、第1〜第3実施形態では、多元蒸着法(MSD)を用いる成膜装置に本発明を適用したが、他の成膜法(例えば、プラズマ成膜法、スパッタ法)を用いる成膜装置にも適用可能である。   The present invention is not limited to the first to third embodiments described above. For example, in the first and second embodiments, an optical frequency heater may be used to heat the deposition preventing glasses 27 and 227. Further, a heater may be built in the deposition preventing glass 27, 227 and the heater may be directly heated. Further, the means for suppressing the adhesion / deposition of the film forming material is not limited to heating the deposition preventing glass 27, 227, and the deposition preventing glass 27, 227 may be charged. In the first to third embodiments, the presence / absence of the tray 5 is detected in order to indirectly detect the presence / absence of the work W. However, the sensor W is irradiated with the sensor light to directly detect the presence / absence of the work W. May be. In the first to third embodiments, a transmissive sensor is used as the detection unit, but a reflective sensor may be used. In the first to third embodiments, the present invention is applied to a film forming apparatus using a multi-source deposition method (MSD). However, a film forming method using another film forming method (for example, a plasma film forming method or a sputtering method) is used. It is also applicable to the device.

1,201,301…成膜装置、2…成膜室、3…チャンバー、3a…壁部、5…トレイ、7…搬送装置(搬送手段)、11…走行センサー(検出手段)、13,213,313…ビューポート(窓部)、21…仕切ガラス、23,223…筒状部、23a,223a…筒状部の中空部、27,227…防着ガラス(透過部)、31,231,331…ヒータ(加熱部、堆積抑制手段)、327…防着ガラス(第2の透過部)、351…筒体、351a…筒体の中空部、W…ワーク(被成膜材)。   DESCRIPTION OF SYMBOLS 1,201,301 ... Film formation apparatus, 2 ... Film formation chamber, 3 ... Chamber, 3a ... Wall part, 5 ... Tray, 7 ... Conveyance apparatus (conveyance means), 11 ... Travel sensor (detection means), 13,213 , 313 ... Viewport (window part), 21 ... Partition glass, 23, 223 ... Cylindrical part, 23a, 223a ... Hollow part of the cylindrical part, 27, 227 ... Anti-adhesion glass (transmission part), 31, 231, 331... Heater (heating unit, deposition suppressing means), 327 .. deposition preventing glass (second transmission part), 351... Cylindrical body, 351a.

Claims (9)

被成膜材に成膜材料を成膜する成膜装置であって、
前記被成膜材を収納し成膜処理を行う成膜室と、
前記成膜室の内部に設けられ、前記被成膜材を搬送する搬送手段と、
前記成膜室を画成する壁部に設けられ、光を透過する透過部を有し、前記成膜室の外部から内部への投光を可能とする窓部と、
前記成膜室の外部に設けられ、前記窓部の前記透過部を透過させてセンサー光を投光し前記成膜室の内部の前記被成膜材の有無を検出する検出手段と、
前記透過部への前記成膜材料の堆積を抑制する堆積抑制手段と、
を備えていることを特徴とする成膜装置。
A film forming apparatus for forming a film forming material on a film forming material,
A film forming chamber for storing the film forming material and performing a film forming process;
A transfer means provided in the film forming chamber for transferring the film forming material;
A window that is provided on a wall that defines the film formation chamber, has a transmission part that transmits light, and allows light to be projected from the outside to the inside of the film formation chamber;
A detecting means provided outside the film forming chamber, for detecting the presence or absence of the film forming material inside the film forming chamber by transmitting sensor light through the transmitting portion of the window portion;
Deposition suppression means for suppressing deposition of the film forming material on the transmission part;
A film forming apparatus comprising:
前記堆積抑制手段は、前記透過部へ付着した成膜材料を蒸発させると共に、前記透過部への前記成膜材料の付着を抑制することを特徴とする請求項1に記載の成膜装置。   2. The film forming apparatus according to claim 1, wherein the deposition suppressing unit evaporates the film forming material attached to the transmission part and suppresses the adhesion of the film forming material to the transmission part. 前記堆積抑制手段は、前記透過部を加熱する加熱部を備えていることを特徴とする請求項1又は2に記載の成膜装置。   The film deposition apparatus according to claim 1, wherein the deposition suppressing unit includes a heating unit that heats the transmission unit. 前記加熱部は、前記壁部よりも前記成膜室の内部の側に設けられていることを特徴とする請求項3に記載の成膜装置。   The film forming apparatus according to claim 3, wherein the heating unit is provided closer to the inside of the film forming chamber than the wall portion. 前記窓部は、前記壁部よりも前記成膜室の内部の側に設けられるとともに中空部に前記センサー光を通過させる筒状部を備え、
前記筒状部の前記中空部に前記透過部が設けられており、
前記加熱部は、前記筒状部の前記端部の側面と前記透過部とを囲むように設けられていることを特徴とする請求項4に記載の成膜装置。
The window portion is provided on the inner side of the film forming chamber with respect to the wall portion and includes a cylindrical portion that allows the sensor light to pass through a hollow portion.
The transmission part is provided in the hollow part of the cylindrical part,
The film forming apparatus according to claim 4, wherein the heating unit is provided so as to surround a side surface of the end portion of the cylindrical portion and the transmission unit.
前記加熱部は、前記壁部よりも前記成膜室の外部の側に設けられていることを特徴とする請求項3に記載の成膜装置。   The film forming apparatus according to claim 3, wherein the heating unit is provided outside the film forming chamber with respect to the wall. 前記窓部は、前記壁部よりも前記成膜室の外部の側に設けられるとともに中空部に前記センサー光を通過させる筒状部を備え、
前記筒状部の前記中空部に前記透過部が設けられており、
前記加熱部は、前記筒状部の前記端部の側面と前記透過部とを囲むように設けられていることを特徴とする請求項6に記載の成膜装置。
The window portion is provided on the outer side of the film forming chamber with respect to the wall portion and includes a cylindrical portion that allows the sensor light to pass through a hollow portion.
The transmission part is provided in the hollow part of the cylindrical part,
The film forming apparatus according to claim 6, wherein the heating unit is provided so as to surround a side surface of the end portion of the cylindrical portion and the transmission unit.
前記窓部は、
前記透過部よりも前記成膜室の内部の側に設けられ、前記センサー光を通過させる中空部を有する筒体と、
前記中空部内に設けられ前記センサー光を透過する第2の透過部とを備え、
前記透過部は、前記筒体と前記第2の透過部とによって前記成膜材料が浮遊する空間から仕切られており、
前記第2の透過部は、前記筒体に対して着脱自在に設けられていることを特徴とする請求項1に記載の成膜装置。
The window is
A cylindrical body provided on the inner side of the film forming chamber with respect to the transmission portion, and having a hollow portion that allows the sensor light to pass through;
A second transmission part provided in the hollow part and transmitting the sensor light,
The transmission part is partitioned from the space in which the film forming material floats by the cylindrical body and the second transmission part,
The film forming apparatus according to claim 1, wherein the second transmission unit is detachably attached to the cylindrical body.
前記成膜材料はセレンであることを特徴とする請求項1〜8のいずれか1項に記載の成膜装置。   The film forming apparatus according to claim 1, wherein the film forming material is selenium.
JP2011046565A 2011-03-03 2011-03-03 Deposition equipment Expired - Fee Related JP5456711B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011046565A JP5456711B2 (en) 2011-03-03 2011-03-03 Deposition equipment
TW101105865A TWI546404B (en) 2011-03-03 2012-02-22 Film forming device
CN201210051972.4A CN102653852B (en) 2011-03-03 2012-03-01 Film forming apparatus
KR1020120021714A KR101361289B1 (en) 2011-03-03 2012-03-02 Film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011046565A JP5456711B2 (en) 2011-03-03 2011-03-03 Deposition equipment

Publications (2)

Publication Number Publication Date
JP2012184457A JP2012184457A (en) 2012-09-27
JP5456711B2 true JP5456711B2 (en) 2014-04-02

Family

ID=46729580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011046565A Expired - Fee Related JP5456711B2 (en) 2011-03-03 2011-03-03 Deposition equipment

Country Status (4)

Country Link
JP (1) JP5456711B2 (en)
KR (1) KR101361289B1 (en)
CN (1) CN102653852B (en)
TW (1) TWI546404B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101425864B1 (en) * 2012-09-11 2014-07-31 (주)세미코아 Fims loader comprising sensor unit to easily installaiton and maintenance
KR101643107B1 (en) * 2012-11-13 2016-07-26 미츠비시 쥬고교 가부시키가이샤 Vacuum vapor deposition apparatus
CN107017177B (en) * 2017-04-25 2019-06-07 京东方科技集团股份有限公司 Rate of film build detects mould group, film-forming apparatus, rate of film build detection method
CN111206207A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Deposition chamber, coating equipment and coating method
CN111206223A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method
CN111206209A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method
CN111206224A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Deposition chamber, coating equipment and coating method
CN111206203A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Deposition chamber, coating equipment and coating method
CN111206205A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Deposition chamber, coating equipment and coating method
CN111206221A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method
CN111206204A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method
CN111206220A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method
CN111206208A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method
CN111206219A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Deposition chamber, coating equipment and coating method
CN111206210A (en) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 Film coating equipment and film coating method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2641922B2 (en) * 1988-10-26 1997-08-20 東京エレクトロン株式会社 Processing equipment
JPH0448263U (en) * 1990-08-31 1992-04-23
WO1999029923A1 (en) * 1997-12-05 1999-06-17 Tegal Corporation Plasma reactor with a deposition shield
KR100268448B1 (en) 1998-08-17 2000-10-16 윤종용 Etching end point detector
JP4072889B2 (en) * 2001-03-19 2008-04-09 新明和工業株式会社 Vacuum deposition system
CN2592656Y (en) * 2003-01-08 2003-12-17 中国科学院长春光学精密机械与物理研究所 Rotary guard plate of observation window of vacuum chamber for vacuum coating system
TWI299758B (en) * 2004-03-03 2008-08-11 Sanyo Electric Co Method and apparatus for measuring the thickness of deposited film, method and apparatus for forming material layer
SE0400582D0 (en) * 2004-03-05 2004-03-05 Forskarpatent I Uppsala Ab Method for in-line process control of the CIGS process
KR100959678B1 (en) * 2005-08-12 2010-05-26 엘아이지에이디피 주식회사 Flat panel display manufacturing machine
KR20070080517A (en) * 2006-02-07 2007-08-10 삼성전자주식회사 Apparatus for treating substrates
US7630859B2 (en) * 2007-05-01 2009-12-08 Verity Instruments, Inc. Method and apparatus for reducing the effects of window clouding on a viewport window in a reactive environment
WO2008115606A2 (en) * 2007-03-21 2008-09-25 Verity Instruments, Inc. Method and apparatus for reducing the effects of window clouding on a viewport window in a reactive environment
JP4413953B2 (en) * 2007-07-10 2010-02-10 株式会社アルバック Method for detecting missing carrier having missing portion
JP2009027100A (en) * 2007-07-23 2009-02-05 Rohm Co Ltd Substrate temperature measuring apparatus and substrate temperature measurement method
US7835007B2 (en) * 2007-08-01 2010-11-16 Applied Materials, Inc. Methods and apparatus for identifying thin films on a substrate
CN101608301B (en) * 2009-06-24 2011-12-07 江苏常松机械集团有限公司 Production line of continuous vacuum plasma evaporation metal composite material

Also Published As

Publication number Publication date
CN102653852A (en) 2012-09-05
JP2012184457A (en) 2012-09-27
KR101361289B1 (en) 2014-02-11
TW201241220A (en) 2012-10-16
TWI546404B (en) 2016-08-21
KR20120100795A (en) 2012-09-12
CN102653852B (en) 2014-12-10

Similar Documents

Publication Publication Date Title
JP5456711B2 (en) Deposition equipment
JP7117332B2 (en) Deposition apparatus for coating flexible substrates and method of coating flexible substrates
CN109477203A (en) Method for being coated with the depositing device and coating flexible base board of flexible base board
JP3965479B2 (en) Box type opposed target type sputtering apparatus and compound thin film manufacturing method
CN101956176B (en) Continuous evaporation apparatus
JP2009013435A (en) Substrate holder and vacuum film deposition apparatus
JP5424972B2 (en) Vacuum deposition equipment
EP2607516B1 (en) Method for forming a gas blocking layer
US9425029B2 (en) Processing apparatus having a first shield and a second shield arranged to sandwich a substrate
US20170057019A1 (en) Laser crystallizing apparatus
US20120040485A1 (en) Thermal management of film deposition processes
JP6067300B2 (en) Magnetron sputtering film forming apparatus and magnetron sputtering film forming method
TW202003885A (en) Methods for vacuum processing of a substrate, method of manufacturing a device, apparatus for vacuum processing of a substrate, and use of a pulsed laser deposition source in processing a substrate in a vacuum processing apparatus
WO2013073443A1 (en) Plasma modification and film formation apparatus
KR101646828B1 (en) Polarized light illuminating apparatus
US10126657B2 (en) Extreme ultraviolet light generating apparatus
JP5829045B2 (en) Microwave plasma generating apparatus and magnetron sputtering film forming apparatus using the same
JP5248662B2 (en) Substrate processing apparatus and thin film solar cell manufacturing apparatus
JP2013142164A (en) Film-forming apparatus
JP5411243B2 (en) Vapor deposition equipment
WO2015064716A1 (en) Organic thin film patterning device, organic thin film production system, and organic thin film patterning method
JP6116969B2 (en) Electron beam evaporation system
JP2009138240A (en) Film-forming method
KR20140106753A (en) Film-forming apparatus
JP2015168876A (en) Ion irradiation apparatus and film deposition apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130517

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131209

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140108

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees