CN109477203A

CN109477203A - Method for being coated with the depositing device and coating flexible base board of flexible base board

Info

Publication number: CN109477203A
Application number: CN201680087568.9A
Authority: CN
Inventors: 托马斯·德皮施; 斯蒂芬·海因; 尼尔·莫里森; 赖纳·库克拉; 克里斯多夫·卡森; 苏珊娜·施拉弗; 斯特凡·劳伦兹; 德克·瓦格纳; 瓦莱里亚·梅特; 沃尔克·哈克; 乌韦·赫尔曼斯; 比约恩·斯蒂克瑟-韦斯; 沃尔特·文德尔穆特; 于尔根·乌尔里奇
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2016-07-01
Filing date: 2016-07-01
Publication date: 2019-03-15
Also published as: WO2018001523A1; CN206204411U

Abstract

A kind of depositing device (100) with layer heap stack structure coating flexible base board (10) is described.The depositing device includes: first volume barrel chamber room (110), is configured to accommodate holder, the holder is for providing flexible base board；First deposition chambers (120) are arranged in first volume barrel chamber room downstream and include the first painting drum (122), and first painting drum is configured for guidance flexible base board by first group of multiple sedimentation unit (121)；Second deposition chambers (140), it is arranged in the first deposition chambers (120) downstream and includes the second painting drum (142), second painting drum is configured for guidance flexible base board by second group of multiple sedimentation unit (141)；Volume Two barrel chamber room is arranged in the second deposition chambers (140) downstream and is configured for accommodating winding reel, and the winding reel winds flexible base board on reel for winding herein after deposition；And roll assembly, it is configured to flexible base board (10) being transmitted to volume Two barrel chamber room from first volume barrel chamber room along the substrate transmitting path of Component convex and partial concavity.In addition, a kind of method for being coated with flexible base board is described, especially with the method for described depositing device coating flexible base board.

Description

Method for being coated with the depositing device and coating flexible base board of flexible base board

Technical field

The embodiment of present disclosure is related to film deposition equipment and method, in particular to uses stack of thin structure (stack) device and method of flexible base board are coated with, especially in roll-to-roll (R2R) depositing system.Some embodiments relate to And the equipment that one or two main surface of flexible base board is respectively coated with layer heap stack structure, it is such as raw for thin film solar cell It produces, hull cell production and flexible display produce.Other embodiment is related to the method for alignment thin film depositing device.

Background technique

The processing of flexible base board (such as, plastic foil or foil) is needed in packaging industry, semi-conductor industry and other industry Ask very high.Processing may include with material (such as metal, semiconductor and dielectric material) coating flexible base board, etching and for individual Using other processing movement implemented to substrate.The system for executing this task generally comprises painting drum (for example, cylindrical Roller), the painting drum is couple to the processing system for transmitting the roll assembly of substrate, and is coated on painting drum At least part of substrate.Roll-to-roll (R2R) coating system can provide high yield.

Therefore, coating process (such as, CVD technique or PVD process), especially sputtering technology, can be used for veneer Onto flexible base board.Roll-to-roll depositing system should be interpreted as, from holder to considerably long length (such as a, km or more Length) flexible base board release winding, be coated with flexible base board with stack of thin structure, and flexible base board rewound again On winding reel.In the manufacture of hull cell and in display industry and photovoltaic (PV) industry, for roll-to-roll heavy The demand of product system is also increasing.For example, touch panel element, flexible display and flexible PV modules cause to be coated in R2R The increase in demand of suitable layer is deposited in machine.

In some applications, it is folded that the layer heap with two or more layers can be deposited in the first main surface of flexible base board Structure.Sometimes, second layer stacked structure can be deposited in second main surface opposite with the first main surface of flexible base board.When On two sides when coated substrates, painting drum should be designed and operate with caution to avoid the damaged substrate during the coating of the second main surface First have been coated with surface.

In view of above, the depositing device of one or two main surface with layer heap stack structure coating flexible base board is provided, Described in layer there is the low defect quantity of high uniformity and per unit surface area, to overcome in the art at least some Problem.

Summary of the invention

According to above, provide according to a kind of depositing device for being coated with flexible base board of independent claims, a kind of painting The method of cloth flexible base board and a kind of method for being directed at depositing device.Further aspect, advantages and features will be from appurtenances Benefit requires, is apparent in the description and the appended drawings.

According to implementations described herein, provide a kind of for being coated with the depositing device of flexible base board.The deposition is set Standby includes: first volume barrel chamber room, is configured to accommodate holder, the holder is for providing flexible base board；First is heavy Product chamber, is arranged in first volume barrel chamber room downstream and including the first painting drum, first painting drum is configured for Flexible base board is guided to pass through first group of multiple sedimentation unit；Second deposition chambers are arranged in the first deposition chambers downstream and wrap The second painting drum is included, second painting drum is configured for guidance flexible base board by second group of multiple sedimentation unit； Volume Two barrel chamber room is arranged in the second deposition chambers downstream and is configured for accommodating winding reel, and the winding reel is used Flexible base board is wound on reel in winding herein after deposition；And roll assembly, it is configured to flexible base board along Component convex simultaneously And the substrate transmitting path of partial concavity is transmitted to volume Two barrel chamber room from first volume barrel chamber room.

According to other aspect described herein, describe it is a kind of with layer heap stack structure, particularly with deposition described herein The method that equipment is coated with flexible base board, wherein by flexible base board along the substrate transmitting path of Component convex and partial concavity from the A roll of barrel chamber room is transmitted to volume Two barrel chamber room.The described method includes: being moved back from the holder provided in first volume barrel chamber room Around flexible base board；At least one first layer of sedimentary stacked structure in the first main surface of flexible base board, while by providing The first painting drum in the first deposition chambers guides flexible base board；Sedimentary stacks knot at least one described first layer At least one second layer of structure, while by providing the guidance flexible base board of the second painting drum in the second deposition chambers；With Flexible base board is wound on the winding reel in volume Two barrel chamber room in offer after deposition.

According to an embodiment described herein, a kind of method for being directed at depositing device is provided, wherein the deposition is set It is standby comprising roll assembly, the roll assembly be configured to by flexible base board along the substrate transmitting path of Component convex and partial concavity from First volume barrel chamber room is transmitted to volume Two barrel chamber room.Particularly, it is heavy according to a kind of alignment of implementations described herein to provide The method of product equipment.The described method includes: at least one deflector roll of roll assembly is defined as reference roller；With relative to reference roller First rotary shaft is directed at the rotary shaft of two or more remaining deflector rolls of roll assembly, to be parallel to the first rotation of reference roller Axis extends.

Embodiment is further related to for executing each disclosed method and including for executing each described side The equipment of the environment division of method feature.It can appoint by hardware component, by the computer of Suitable software programming, by the two What combines or executes in any other manner method characteristic.

Detailed description of the invention

Embodiment be indicated above and some in other more detailed aspects will be described in the following description, And part explanation is carried out referring to attached drawing.

Fig. 1 shows the schematic cross-section of the depositing device according to implementations described herein；

Fig. 2 shows the schematic cross-sections according to the depositing device of implementations described herein；

Fig. 3 shows the schematic cross-section of the depositing device according to implementations described herein；

Fig. 4 shows the schematic cross-section of the depositing device according to implementations described herein；

Fig. 5 shows the more detailed sectional view of the depositing device according to implementations described herein；

Fig. 6 show can be used in some embodiments described herein can heating roller schematic diagram；

Fig. 7 shows the schematic cross-section for the painting drum that can be used in some embodiments described herein；

Fig. 8 shows the schematic cross-section for the painting drum that can be used in some embodiments described herein；

Fig. 9 shows the enlarged diagram of the part for the deposition chambers that can be used in some embodiments described herein；

Figure 10 shows the enlarged diagram for the AC sputtering source that can be used in some embodiments described herein；

Figure 11 shows the enlarged diagram for the DC sputtering source that can be used in some embodiments described herein；With

Figure 12 is the flow chart according to the coating method of the flexible base board of implementations described herein.

Specific embodiment

With detailed reference to various embodiments, one or more examples thereof illustrate in the accompanying drawings.In the following of attached drawing In description, same reference numbers indicate same parts.In general, the difference relative to individual embodiments is only described.With solution The mode released provides each example, and example is it is not intended that for limitation.In addition, being illustrated or described as the portion of an embodiment The feature divided can be used for other embodiments or in conjunction with other embodiments to generate another embodiment.Description is intended to This kind of modifications and variations.

It should be noted that flexible base board used in implementations described herein is usually flexible.Term " flexible base Plate " or " substrate " can synonymously be used with term " foil " or term " coiled material ".Specifically, it should be appreciated that deposition described herein The embodiment of equipment can be used for being coated with any kind of flexible base board, such as manufacturing the flat painting with uniform thickness Layer, or for manufacturing coating patterns or coating structure on flexible substrates or in primer coating structural top with predetermined shape. For example, electronic device can be formed on flexible substrates by mask, etching and/or deposition.For example, flexibility base described herein Plate may include multiple material, such as PET, HC-PET, PE, PI, PU, TaC, OPP, CPP, one or more metals, paper, above-mentioned group It closes, and has been coated with substrate, such as hard coating PET (for example, HC-PET, HC-TaC).In some embodiments, flexible base board is The COP substrate of index matching (IM) layer is provided on two sides.

Implementations described herein relates generally to the device and method with layer heap stack structure coating flexible base board.This paper institute " the layer heap stack structure " used can be regarded as the two, three or more layer deposited on top of each other, two of them, three Or more layer can be made of identical material or be made of two kinds, three or more different materials.For example, layer heap stack structure can Including one or more conductive layers (for example, metal layer) and/or one or more separation layers (for example, dielectric layer).In some realities It applies in mode, layer heap stack structure may include one or more hyaline layers (for example, SiO₂Layer or ITO layer).In some embodiments In, at least one of layer heap stack structure layer can be conductive transparent layer (for example, ITO layer).In some embodiments, can scheme Case one or more layer.In some embodiments, one or more SiO can be deposited in the first main surface of substrate₂Layer, Followed by one or more ITO layers, optionally followed by one or more metal layers (for example, layers of copper).In some embodiments In, can also coated substrates the second main surface, such as identical layer is used in the depositing device according to implementations described herein Stacked structure or the second main surface with different layer heap stack structure coated substrates.

According to some embodiments that can be combined with other embodiments described herein, depositing device be can be configured for 500m or bigger, 1000m or bigger or thousands of meters substrate length.Substrate width can be 300mm or bigger, 500mm or more Greatly, 1m or bigger, particularly from about 1.4m.Substrate width can be 3m or smaller, especially 2m or smaller.In general, substrate thickness It can be 20 μm or bigger and 1mm or smaller, especially from 50 μm to 200 μm.

According to some embodiments, the vacuum chamber that can be evacuated can be configured by some chambers of depositing device or all chambers Room.For example, depositing device may include that (such as, reel chamber neutralizes in at least part for allow to generate or maintain processing system In deposition chambers) vacuum component and equipment.Depositing device may include vacuum pump, evacuation tube, vacuum seal etc., to produce Vacuum raw or that maintenance is at least in the part of depositing device.For example, each chamber can have for evacuating corresponding chamber Individually corresponding vacuum pump or pumping plant.In some embodiments, two or more turbine vacuum pumps can be connected at least One vacuum chamber is especially connected to each vacuum chamber of depositing device.

According to some embodiments, the vacuum chamber for being adapted to the depositing device operated under vacuum conditions is formed very The vacuum chamber, i.e., can be evacuated to during deposition with 10 millibars or lower, particularly 1 millibar or more by empty sealing shell Low pressure is even evacuated to 1 × 10^-4With 1 × 10^-2Millibar between or lower pressure vacuum.It is (all for PVD process As sputtering) and CVD technique specifically consider different pressure limits, PVD process can be 10^-3Implement in millibar range, and CVD work Skill is usually implemented within the scope of millibar.In addition, vacuum chamber can be evacuated to 1 × 10^-6The background of millibar or lower pressure Vacuum (background vacuum).Background pressure (background pressure) refer to without any gas it is any into The pressure reached in the case where entering by evacuating chamber.

Fig. 1 is illustratively shown the depositing device 100 with stack of thin structure coating flexible base board 10.Depositing device 100 Including multiple vacuum chambers, the vacuum chamber can be evacuated to subatmospheric pressure.The depositing device described in Fig. 1 100 include first volume barrel chamber room 110, be arranged in 110 downstream of first volume barrel chamber room the first deposition chambers 120, be arranged in first Second deposition chambers 140 in 120 downstream of deposition chambers and the volume Two barrel chamber room 150 for being arranged in 140 downstream of the second deposition chambers. First volume barrel chamber room 110 can be considered as and be configured for accommodating holder (being wound with flexible base board on the holder) Vacuum chamber, and volume Two barrel chamber room 150 can be considered as be configured for accommodate winding reel after deposit described The vacuum chamber for the flexible base board having been coated with is wound on winding reel.

Configurable depositing device 100 so that can along substrate transmitting path by flexible base board 10 from first volume barrel chamber room 110 It is directed to volume Two barrel chamber room 150, wherein substrate transmitting path may pass through the first deposition chambers 120 and pass through the second deposition chambers 140.Flexible base board can be coated with layer heap stack structure in the first deposition chambers 120 and the second deposition chambers 140.It can provide and include The roll assembly of multiple volumes (roll) or roller is to be used to transmit substrate along substrate transmitting path, wherein can roll up in holder and winding Two or more rollers of roll assembly, five or more rollers or ten or more roller are arranged between cylinder.

According to some embodiments of this paper, substrate transmitting path can be Component convex and partial concavity.Change sentence It talks about, substrate transmitting path part is bending to the right and part is bending to the left, so that the of some guide rollers contact flexible base boards Second main surface opposite with the first main surface of one main surface and some guide rollers contact flexible base boards.For example, in Fig. 1 One deflector roll 107 contacts the second main surface of flexible base board, and flexible base board is passing through 107 (substrate transmitting path of the first deflector roll " convex " section) guidance when it is bending to the left.First main surface of the second deflector roll 108 contact flexible base board in Fig. 1, and it is soft Property substrate by the second deflector roll 108 (" spill " section of substrate transmitting path) guide when it is bending to the right.It can provide compact Depositing device, the compact depositing device is applicable to two sides deposition, because substrate transmitting path is in female section (i.e. substrate The first main surface contact support surface section) neutralize male section (i.e. second main surface contact support surface of substrate Section) in change direction for several times between first volume barrel chamber room and volume Two barrel chamber room.

Term as used herein " upstream " and " downstream " can be indicated along the corresponding chamber of substrate transmitting path or corresponding Position of the component relative to another chamber or component.For example, during operation, along substrate transmitting path via roll assembly by substrate It is directed across the first deposition chambers 120 and is then directed across the second deposition chambers 140.Therefore, the second deposition chambers 140 are arranged In 120 downstream of the first deposition chambers, and the first deposition chambers 120 are arranged in 140 upstream of the second deposition chambers.In the operation phase Between, it guides substrate when passing through the first roller or the first component first or transmits substrate by the first roller or the first component, and then lead to When crossing the second roller or second component guidance substrate or transmitting substrate by the second roller or second component, the second roller or second component cloth It sets in the first roller or first component downstream.

First volume barrel chamber room 110 is configured to accommodate holder 112, wherein holder 112 may be provided with to be wrapped in and deposit Store up the flexible base board 10 on reel 112.During operation, flexible base board 10 can be unwound from holder 112, and is transmitted along substrate Flexible base board 10 is transmitted from first volume barrel chamber room towards the first deposition chambers in path.Term as used herein " holder " can It is interpreted as storing the volume of flexible base board to be coated on the holder.Correspondingly, term as used herein " winding volume Cylinder " can be regarded as the volume for being adapted to receive the flexible base board having been coated with.Term " holder " is alternatively referred to as herein " supply volume ", and term " winding reel " alternatively referred to as " batches (take-up) volume " herein.

In some embodiments that can be combined with other embodiments described herein, it is possible to provide holder driver To unwind flexible base board from holder for rotating holder 112.In other words, holder 112 can be master Dynamic driven roller.

Can be in the first deposition chambers of direct arranged downstream 120 of first volume barrel chamber room 110, schematic depiction as shown in figure 1. Alternatively, one or more other vacuum chamber (examples can be arranged between first volume barrel chamber room 110 and the first deposition chambers 120 Such as, chamber is cleaned).In the embodiment shown in figure 1, first volume barrel chamber room 110 is left via passage aisle (such as, slit) Flexible base board can be directly entered the first deposition chambers 120.

Load locking cavity can be configured by first volume barrel chamber room 110.In other words, (flood) first reel can be perfused Chamber 110, such as to use the holder in new holder replacement first volume barrel chamber room, without damaging remaining vacuum chamber Vacuum in room.In wall between salable first volume barrel chamber room 110 and the vacuum chamber for being arranged in first volume barrel chamber room downstream Channel or opening.It therefore, can be during the replacement of the holder in first volume barrel chamber room (for example, ought be from holder When unwinding flexible base board) state that other vacuum chambers of depositing device 100 and especially deposition chambers are maintained into evacuation.

In some embodiments that can be combined with other embodiments described herein, may pass through makes vacuum chamber respectively Opening (for example, slit) in the wall being separated from each other guides flexible base board 10.For example, narrow in wall between two vacuum chambers Seam can be adapted to substrate being directed to another vacuum chamber from a vacuum chamber respectively.In some embodiments, it opens Mouth can be equipped with sealing device to be at least substantially separated the pressure condition of two vacuum chambers by the opening connection.Example Such as, if providing different pressure conditions by the chamber of opening connection, the opening in wall can be designed to maintain in chamber Corresponding pressure.

According to implementations described herein, it is possible to provide at least one gap gate or load lock valve are to make two phases Adjacent vacuum chamber is separated from each other, such as the vacuum chamber point to make first volume barrel chamber room with to be arranged in first volume barrel chamber room downstream From.At least one configurable described gap gate, so that flexible base board moves through the gap gate, and openable and pass Gap gate is closed to provide vacuum sealing.Thus, for example, same under technology vacuum the first deposition chambers 120 can be maintained When, first volume barrel chamber room 110 can be made to divulge information (vent).

For example, schematically indicating the sealing being arranged between first volume barrel chamber room and the first deposition chambers 120 in Fig. 1 Device 105.However, it should be understood that can be between other adjoining vacuum chambers (for example, in the second deposition chambers and volume Two barrel chamber Between room) other sealing device is provided, the other sealing device provides corresponding function.

Sealing device 105 may include inflatable seal, and the inflatable seal is configured to against flat enclosed watch Face presses substrate.Therefore, the opening in the wall between salable first volume barrel chamber room 110 and the first deposition chambers 120, or even work as It is also such when flexible base board may be present in opening.The removal of flexible base board to close or open that sealing device can not be must It needs.

However, also can be used for selectively opened and other means of closing gap gate, wherein can be inserted into substrate While implement to open and close and (there is open substrate path and vacuum seal).For closing while substrate is inserted into The substrate replacement that the gap gate of vacuum seal allows to be particularly easy to, comes from because can be attached to the substrate from new volume The substrate of upper a roll.

Although describing sealing device, narrow about flexible base board is directed to subsequent vacuum chamber from first volume barrel chamber room Seam, opening or gap gate, but sealing described herein can also be used between other chambers of depositing device or part Device, slit, opening or gap gate.

First deposition chambers 120 may include the first painting drum 122, and first painting drum is configured for guiding soft Property substrate 10 pass through first group of multiple sedimentation unit 121.First painting drum 122 can be rotatable around rotary shaft A.It applies Cloth roller may include curved substrate (for example, outer surface of the first painting drum 122), in the curved substrate Bootable flexible surface passes through first group of multiple sedimentation unit 121 on support surface.Pass through more than first group in guidance flexible base board When a sedimentation unit 121, flexible base board can directly be contacted with the substrate of the first painting drum, this substrate It can be cooled.When flexible base board is in the first painting drum directly to be thermally contacted, flexible base board can be reduced during deposition Temperature.

The one or more thin-layer coating flexible base boards 10 of first group of multiple sedimentation unit 121 can be passed through.For example, such as Fig. 1 Middle schematic depiction, first group of multiple sedimentation unit 121 can be arranged on the circumferencial direction around the first painting drum 122 Sedimentation unit.First deposition chambers 120 may include two or more deposition lists arranged next to each other along substrate transmitting path Member.It can be coated with first in second main surface (i.e. the rear surface of flexible base board) opposite with the first main surface of flexible base board The first main surface of flexible base board is coated with when the curved substrate contact of roller.

When rotating the first painting drum 122, guidance flexible base board passes through sedimentation unit, so that can move at a predetermined velocity Dynamic the first main surface by being coated with flexible base board when sedimentation unit, the sedimentation unit are curved towards the first painting drum Substrate.

It in some embodiments, can be between holder 112 and the first painting drum 122 and/or in the first coating One or more rollers (for example, deflector roll) of the arranged downstream roll assembly of roller 122.For example, in the embodiment shown in figure 1, Two deflector rolls 113 are provided between holder 112 and the first painting drum 122, wherein can arrange in first volume barrel chamber room At least one deflector roll and can be in the first deposition chambers and at least one deflector roll of 122 upstream arrangement of the first painting drum.? In some embodiments, three, four, five or more are provided between holder and the first painting drum, especially Eight or more deflector rolls.Deflector roll can be actively or passively roller.

" active " roller used herein or volume can be regarded as being equipped with the drive for initiatively moving or rotating corresponding roller The roller of dynamic device or motor.For example, adjustable drive roll is to provide scheduled torque or scheduled rotation speed.In general, can incite somebody to action Holder 112 and winding reel 152 are provided as drive roll.In some embodiments, painting drum can be configured to actively Roller.In addition, can configure drive roll to substrate draw roll, the substrate draw roll is configured for during operation with predetermined Power stretching substrate." passive " roller used herein can be regarded as being not provided with the driving for initiatively moving or rotating passive guide roller The roller or volume of device.It is passive to be rotated by the frictional force for the flexible base board that can directly contact with external roller surface during operation Roller.

In this disclosure, " volume " or " roller " can be interpreted as a kind of device, this device provide surface, flexible base board or The part of flexible base board generates with this surface during can transmitting flexible base board along substrate transmitting path in depositing device and contacts.This At least part of literary signified roller may include similar round shape to contact flexible base board 10 afterwards before deposition.It can be around straight longitudinal direction Axis forms general cylindrical shape.According to some embodiments, roller can be adapted to while transmitting substrate (for example, During depositing operation or while substrate is present in depositing device) guidance substrate deflector roll.Roller can be configured to expand Roller (spreader roller) (being adapted to provide the drive roll of the tension of restriction for flexible base board), treatment tube (example Such as, painting drum, for coating while support flexible base board), for deflecting substrate along curved substrate transmitting path Deflection roll, regulating roller, holder, winding reel etc..

In some embodiments, at least one deflection roll can be configured for deflecting flexible base in the clockwise direction Plate, and at least one deflection roll can be configured for deflecting flexible base board in the counterclockwise direction.For example, shown in Fig. 1 In embodiment, the first deflector roll 107 deflects flexible base board in the counterclockwise direction, and (i.e. flexible base board is moved along substrate transmitting path It is bending to the left when dynamic), and the second deflector roll 108 deflects flexible base board in the clockwise direction (i.e. flexible base board is passed along substrate It is bending to the right when sending path mobile).Therefore, the first deflector roll 107 can be rotated in the counterclockwise direction, and can be in the clockwise direction The second deflector roll 108 of upper rotation.It can provide the substrate transmitting path of Component convex and partial concavity.During flexible base board transmission The deflector roll rotated in the clockwise direction can referred to herein as " rotating clockwise roller ", and flexible base board transmission during The roller rotated in counter clockwise direction can referred to herein as " rotating roller counterclockwise ".

In some embodiments, the first main surface of at least one deflector roll (for example, first deflector roll 107) contact substrate, And the second main surface (i.e. table opposite with the first main surface of at least one deflector roll (for example, second deflector roll 108) contact substrate Face).Therefore, clean flexible base board two main surfaces can be it is beneficial, so as to reduce winding defect risk.

According to some embodiments, roller described herein can be installed on low friction roller bearing, especially there is twin shaft The roller bearing of runner framework.Therefore, it can be achieved that the roller of transmission arrangement described herein is parallel (parallelism), and can disappear Except the lateral substrate " drift (wandering) " during substrate transmission.

In some embodiments, the deflector roll along substrate transmitting path guidance flexible base board also can be configured for implementing to open Power measurement.According to exemplary embodiment, at least one tonometry roller (for example, passive guide roller) can be provided in depositing device.Have Beneficially, it is possible to provide the one, two or more tension on the two sides of the first painting drum and/or the two sides of the second painting drum Roller is measured, this allows the winding side of painting drum and unwinds the tonometry on side.Specifically, tonometry roller can be configured For measuring the tension of flexible base board.Therefore, it can preferably control base board transmit, can be controlled in the pressure of the substrate on painting drum Power, and/or the damage to substrate can be reduced or avoided.

It can be in 120 the second deposition chambers of arranged downstream 140 of the first deposition chambers.Therefore, passing through the first painting drum For 122 guidance flexible base boards 10 after first group of multiple sedimentation unit 121, flexible base board 10 can enter the second deposition chambers 140. It in some embodiments, can be in the second deposition chambers of direct arranged downstream 140 of the first deposition chambers 120.In other implementations In mode, one or more other vacuum chambers can be arranged between the first deposition chambers 120 and the second deposition chambers 140 (for example, connection chamber 130).

Second deposition chambers 140 include the second painting drum 142, and it is flexible that second painting drum is configured for guidance Substrate passes through second group of multiple sedimentation unit 141.Second group of multiple sedimentation unit 141 in the second deposition chambers 140 can be passed through With one or more thin-layer coating flexible base boards 10.For example, schematic depiction as shown in figure 1, can surround second painting drum The sedimentation unit of second group of multiple sedimentation unit 141 is arranged on 142 circumferencial direction.Second deposition chambers 140 may include along base Two or more sedimentation units that plate transmitting path is arranged next to each other.It can be rolled in the rear surface of flexible base board with the second coating The curved substrate of cylinder 142 is coated with flexible base board when directly contacting.

When rotating the second painting drum 142, sedimentation unit of the flexible base board Jing Guo second group of multiple sedimentation unit is guided, So that flexible base board can be coated with when moving through second group of multiple sedimentation unit at a predetermined velocity, the sedimentation unit is towards The curved substrate of two painting drums 142.

In some embodiments that can be combined with other embodiments described herein, first group of multiple sedimentation unit and Second group of multiple sedimentation unit all can be configured for the first main surface of coating flexible base board.In other words, heavy by first First subgroup of first group of multiple sedimentation unit sedimentary stacked structure in the first main surface of flexible base board in product chamber, And by second group of multiple sedimentation unit in the second deposition chambers the second of the first subgroup deposited on top layer heap stack structure Subgroup.Therefore, only flexible with the coating of layer heap stack structure during passing through depositing device transmission flexible base board along substrate transmitting path First main surface of substrate.

In order to also be coated with the second main surface of flexible base board, will there can be the flexible base of the first main surface having been coated with again Plate is loaded into first volume barrel chamber room, and is passed up in taking for reversion across depositing device." reversion takes used herein To " on, during transmitting flexible base board along substrate transmitting path, the second main surface of substrate (is worn with flexible base board for the first time Cross another main surface that depositing device is compared) second group of multiple sedimentation unit of first group of multiple sedimentation unit of direction and/or direction. Therefore, by guiding identical flexible base board to pass twice through depositing device, the two sides deposition on flexible base board is possible.One In a little embodiments, when passing through depositing device for the first time, first layer is deposited in the first main surface of flexible base board and stacks knot Structure, and when passing through depositing device for the second time, second layer stacked structure is deposited in the second main surface of flexible base board.First layer Stacked structure and second layer stacked structure can have respective thickness and/or respective material sequence.In some embodiments, have Two flexible base boards for having been coated with main surface can be about the median plane almost symmetry of substrate.

In other embodiments, first group of multiple sedimentation unit in the first deposition chambers can be configured for being coated with soft Property substrate the first main surface, and to can be configured for coating flexible for second group of multiple sedimentation unit in the second deposition chambers Second main surface of substrate.It can provide in the first painting drum downstream and in the second painting drum upstream for inverting flexible base board Orientation reverse roll.

It, can the coating rolling of active drive first in some embodiments that can be combined with other embodiments described herein At least one of cylinder and the second painting drum.In other words, it is possible to provide the first driver is for rotating the first painting drum simultaneously And/or person can provide the second driver for rotate the second painting drum.

It in some embodiments, can be in 122 downstream of the first painting drum and in 142 upstream arrangement one of the second painting drum A or multiple deflector rolls 113.For example, can in the first deposition chambers 120 and 122 arranged downstream of the first painting drum at least one Deflector roll guides flexible base board 10 to be arranged in the vacuum chamber in 120 downstream of the first deposition chambers for direction, or can be heavy second In product chamber 140 and at least one deflector roll of 142 upstream arrangement of the second painting drum, for substantially being rolled with the second coating The side that the substrate of cylinder is tangent boots up flexible roller, so that flexible base board is smoothly guided into the second painting drum On 142.In some embodiments, provided between the first painting drum and the second painting drum three or more, especially It is five or more, more particularly seven or more deflector rolls.At least one of these deflector rolls multiple have hereafter The function that will be discussed in greater detail.

It can be in the direct arranged downstream volume Two barrel chamber room 150 of the second deposition chambers 140.In other embodiments, may be used One or more vacuum chambers are arranged between the second deposition chambers 140 and volume Two barrel chamber room 150.Volume Two barrel chamber room 150 It can be configured for accommodating winding reel 152 to wind flexible base board on winding reel after deposit.It can be respectively in vacuum Wall between chamber is interior and especially provides sealing device in the wall for separating volume Two barrel chamber room 150 with deposition chambers.Example Such as, in the embodiment shown in figure 1, sealing device is provided between the second deposition chambers 140 and volume Two barrel chamber room 150 105.Sealing device 105 may include the inflatable seal for being configured to seal against surface pressing substrate.Therefore, salable The opening in wall between two deposition chambers 140 and volume Two barrel chamber room 150, or even when flexible base board may be present in opening Also so.Remove flexible base board may not be necessary for closing or opening sealing device.

In some embodiments that can be combined with other embodiments described herein, it is possible to provide winding reel driver To wind flexible base board on winding reel for rotating winding reel 152.In other words, winding reel 152 can be Drive roll.

Load locking cavity can be configured by volume Two barrel chamber room 150.Therefore, it can configure volume Two barrel chamber room so that twining Winding reel (being wound with the flexible base board having been coated on winding reel) can be unloaded from volume Two barrel chamber room, while can be perfused second Reel chamber 150.It, can (for example, via sealing device 105) sealing volume Two barrel chamber room for volume Two barrel chamber room 150 is perfused 150 and be arranged in volume Two cylinder chamber upstream vacuum chamber between channel.Therefore, it is wound with new winding changing bobbins It, can be by other vacuum chambers of depositing device and especially deposition chambers maintain under evacuated during reel.In some realities It applies in mode, volume Two barrel chamber room 150 may include gap gate or load lock valve (e.g., including sealing device), such as with In the channel or slit closed between the second deposition chambers of opening and volume Two barrel chamber room.It can be in the sealing state of sealing device It is lower to retain substrate in the opening.

During deposition, such as when using sputtering source, the first deposition chambers 120 and/or the second deposition chambers 140 can be located Under middle vacuum or under high vacuum, for instance in 1 × 10^-2Millibar and 1 × 10^-4Under pressure between millibar.Inside sedimentation unit Pressure be higher by such as an order of magnitude than the pressure in the main volume of deposition chambers.For example, during sputtering sedimentation, sputtering Pressure inside sedimentation unit can be about 5 × 10^-3Millibar.During deposition, first volume barrel chamber room 110 and volume Two barrel chamber room Pressure in 150 is higher by such as one or two order of magnitude than the pressure in deposition chambers.For example, first volume barrel chamber room and/ Or the background pressure in volume Two barrel chamber room can be between 10^-1Millibar and 10^-3Between millibar.It can be for example at least one vacuum chamber One or more vacuum control units are provided in room and/or at least one sedimentation unit.

Before the deposition, during and/or after, particle can be assembled on flexible substrates, if not removing particle, this can be led Cause the pollution and damage to substrate surface.Specifically, the flexible base board and deflector roll of particle ought be formed on flexible substrates When support surface generates contact, it can scratch or the surface of damaged substrate.These problems are also referred to as " winding defect ".In more detail For, it is 10 microns or smaller zonule that this defect, which can be the order of magnitude, wherein concentrated wear sedimentary or even entire Flexible base board.The possibility source of these defects is the particle for example on the flexible base board of holder, and there are also by coating work Skill causes and is adhered to the particle of substrate.

It is proposed several methods, it is intended to avoid the problem that winding defect.A kind of method is a kind of system, wherein flexible base board Only one main surface (for example, uncoated surface) directly contacts during depositing operation with roller surface generation.However, this set Meter can not be suitable for two sides depositing operation and the thin film deposition processes using advanced tension force.It specifically, is including having In the depositing device of the substrate transmitting path of both female and male sections, two main surfaces of flexible base board can be during transmission It is directly contacted with roller surface generation.Therefore, cleaning one or two main surface of substrate can to reduce the risk of winding defect It can be beneficial.

In some embodiments, in order to avoid winding defect, depositing device may include at least one cleaning device, described Cleaning device is configured for cleaning substrate, wound especially on roller flexible base board or flexible base board under high tension with roller table It is cleaned before generating directly contact in face.

In some embodiments that can be combined with other embodiments described herein, it is possible to provide the first cleaning device with For cleaning the first main surface (for example, first main surface being coated with layer heap stack structure) of flexible base board and/or can mention For the second cleaning device with the second main surface for cleaning flexible base board (for example, flexible base board is opposite with the first main surface Rear surface).

Fig. 2 is illustratively shown the depositing device 100 for being coated with flexible base board 10, including the first cleaning device 171 and second cleaning device 172.Most of feature of the depositing device 100 of Fig. 2 corresponds to the phase of depositing device shown in FIG. 1 The feature answered is not repeated herein so that can refer to explanation explained above.

The first cleaning device 171 be can provide with the first main surface for cleaning flexible base board, and it is clear to can provide second Clean device 172 is with the second main surface for cleaning flexible base board.It can be clear in first group of multiple sedimentation unit upstream arrangement first Clean device 171 and/or the second cleaning device 172, so that flexible base board can be cleaned before the deposition in the first deposition chambers Surface.

First main surface of substrate can be the substrate surface being then coated in the first deposition chambers, and the of substrate Two main surfaces can be the substrate surface opposite with the first main surface.In some embodiments, the second main surface can be not The substrate surface of coating, and in other embodiments, it can be previously for example coated with when passing through depositing device for the first time Second main surface.The particle that may be already present in the first main surface of flexible base board or other pollutions can be removed before deposition Object, so that the coating quality in the first main surface can be improved.It (or can be provided on the second major surface in the second main surface Coating) contact with the generation of the substrate of the first painting drum before removal may be already present on the second of flexible base board Particle or other pollutants in main surface, so that can avoid winding defect.

In other embodiments, it is possible to provide only the first cleaning device or only the second cleaning device.For example, base can be cleaned only First main surface of plate can only clean the second main surface contacted with the generation of the substrate of the first painting drum.

In some embodiments, the first cleaning device 171 and/or the second sanitizer cartridge can be arranged in cleaning chamber 170 Set 172, as depicted in Figure 2, can 110 downstream of first volume barrel chamber room and 120 upstream of the first deposition chambers provide described in Clean chamber.It in other embodiments, can be in first volume barrel chamber room and in holder downstream or in the first deposition chambers The first cleaning device 171 and/or the second cleaning device 172 are provided in 120 and in the first painting drum upstream.Can with retouch herein In some embodiments for the other embodiments combination stated, individually cleaning chamber can not be provided.There is provided cleaning chamber 170 can With usually with the better vacuum separation between the first volume barrel chamber room 110 and the first deposition chambers of aturegularaintervals perfusion Advantage.Specifically, cleaning chamber may act as the further gas between first volume barrel chamber room and the first deposition chambers and separate Region.In some embodiments, passage aisle (such as, slit) can be only provided between cleaning chamber and the first deposition chambers to use It is extended there through in guidance flexible base board.Cleaning chamber 170 in accommodate cleaning device can have another advantage is that can be more The component of cleaning device is easily replaced, and deposition chambers can be cannot be introduced by the pollutant that cleaning procedure generates, and can be from It is pumped out in cleaning chamber.

It, can be additionally or alternatively on edge in some embodiments that can be combined with other embodiments described herein Other cleaning device is provided at the other positions of substrate transmitting path.For example, in the embodiment shown in figure 2, it can be After one group of multiple 121 arranged downstreams first of sedimentation unit coating cleaning device 173 and/or can second group of multiple deposition singly Cleaning device 174 after first 141 arranged downstreams second coating.Cleaning device 173 can be configured for cleaning and pass through after first coating First group of multiple sedimentation unit 121 is coated on the surface of the coating in the first main surface of flexible base board.It is cleaned after second coating Device 174 can be configured for the surface of the coating of cleaning on flexible substrates by second group of multiple coating of sedimentation unit 141.

It can be under the direct downstream of first group of multiple sedimentation unit 121 and/or the direct of second group of multiple sedimentation unit 141 Trip executes cleaning, so that in coating table during reliably coating being removed before having been coated with surface and contacting with roller surface generation The particle generated on face." direct downstream " used herein, which can imply, arrives deflector roll or cunning for substrate-guided no after coating Flexible base board is directly cleaned in the case where wheel, the deflector roll or pulley can apply pressure to the surface being newly coated with.It can reduce or keep away Exempt from the generation of winding defect.

The purpose of cleaning device can be, collect flexible base board before being wound by deflector roll with high-tension or being deflected substrate On particle or other pollutants.For example, usually flexible base board is pulled around painting drum under high tension, to improve flexibility Thermally contacting between substrate and painting drum, so that the second main surface in the first painting drum upstream cleaning substrate can be Benefit.It can reduce or avoid completely the generation of winding defect.

For example, as depicted in Figure 2, after deposit and before contacting any deflector roll, by being cleaned after the first coating Device 173 and (being newly coated with) first main surface that flexible base board 10 is cleaned by cleaning device 174 after the second coating.Second Cleaning device 174 after the direct arranged downstream second of the multiple sedimentation units 141 of group is coated with.It is not only restricted to any embodiment, is applied Cleaning device is commonly configured to the new coated side of cleaning flexible base board after cloth.

In some embodiments, cleaning device 173 after the first coating can be disposed so that cleaning device after the first coating 173 contact flexible base board 10 at the position that flexible base board 10 is contacted with the first painting drum 122, such as around the first coating In the last sedimentation unit downstream of first group of multiple sedimentation unit 121 on the circumferencial direction of the rotary shaft of roller 122.In some realities Apply in mode, cleaning device 174 after the second coating can be disposed so that after the second coating cleaning device 174 flexible base board still with Flexible base board 10 is contacted at the position of second painting drum 142 contact, such as in the rotary shaft around the second painting drum 142 In the last sedimentation unit downstream of second group of multiple sedimentation unit 141 on circumferencial direction.It, can be corresponding as described in Fig. 2 It is more than one at least some of the rotary shaft positioned beneath sedimentation unit of painting drum sedimentation unit, especially sedimentation unit Half sedimentation unit.

At least some of cleaning device is configurable as follows.It should be noted that also cleaning device after coating is considered as herein Cleaning device.The functionality of cleaning device is illustrated about the first cleaning device 171.First cleaning device 171 may include Grain displacement unit and particle eliminate unit (particle dissipation unit).Particle displacement unit is shown as having Sticky or adherence surface the first viscosity volume 175, and particle elimination unit is shown as with sticky or adherence surface Second viscosity volume 176.In some embodiments, the viscosity of the second viscosity volume 176 is bigger than the viscosity of the first viscosity volume 175 (ability that the i.e. second viscosity volume is adhered to particle on the second viscosity volume makes particle be adhered to the first viscosity volume than the first viscosity volume On ability it is stronger).

The first cleaning device 171 including the first viscosity volume 175 and the second viscosity volume 176 can operate as follows.First is glued Property volume 175 be positioned to directly contact with the main surface of flexible base board to be cleaned 10.Usually with the circle with deflector roll positioned opposite Identical the first viscosity of the peripheral speed rotation volume 175 of circular velocity, the deflector roll provides counter-pressure surface.First viscosity volume 175 can It is driven by flexible base board, during the operation of depositing device, the first viscosity volume 175 is in CONTACT WITH FRICTION with flexible base board.

Since the first viscosity rolls up 175 adherence surface, the adherence table that the particle on flexible base board is rolled up by the first viscosity Face aggregation.Therefore, particle is temporally adhered on the first viscosity volume, and the first viscosity volume is rotated on the circumference of the first viscosity volume Opposite side.The second viscosity of placement volume 176 is so that the second viscosity volume 176 is contacted with the first viscosity volume 175.It is noticeable It is that the second viscosity volume 176 does not contact usually with flexible base board.In view of the viscosity and the viscosity of the first viscosity volume of the second viscosity volume Big compared to more, the particle on the first viscosity volume will be adhered on the adherence surface of the second viscosity volume.

Therefore, particle will be retained on the surface of the second viscosity volume, while the outer surface of the first viscosity volume will be rotated back To be contacted again flexible base board.Therefore, when the first sticky cigarette touching flexible base board, it will be not present any on the first viscosity volume Grain, and therefore contact of the first viscosity volume with flexible base board will not cause any damage.It is glued on the contrary, particle is stored in second Property volume on.It can be rolled up frequently by second new viscosity volume the second viscosity of replacement.

In some embodiments, clear after cleaning device 173 and the second coating after the coating of the second cleaning device 172, first Clean device 174 and possible other cleaning device can have corresponding setting.For example, the substrate branch of the first painting drum 122 Support surface may act as applying the counter-pressure surface of the first viscosity volume of cleaning device 173 after the first coating and/or second The substrate of cloth roller 142 may act as the counter-pressure table for the first viscosity volume of cleaning device 174 after the second coating Face.

In some embodiments that can be combined with other embodiments described herein, at least one apparatus for coating can be attached Add ground or alternatively including laser, the laser can be extended to the entire width of covering flexible base board.The laser of extension Beam is usually enough to high energy so that particle is separated with the surface of flexible base board.Alternatively, can be controlled by automatic particle positioning system Laser, automatic particle positioning system may include camera and the controller for analyzing captured photo.It can be cleaned accordingly Device upstream disposes this positioning system.Particle positioning system can position the independent particle on substrate.Laser can draw laser beam Lead the particle of positioning on flexible substrates.

In some embodiments, laser beam is enough to separate particle with substrate.It can provide other particle and eliminate unit (for example, suction unit) is for for good and all taking away particle from substrate.Suction unit can be disposed in laser downstream.In embodiment party In formula, controls and operate laser so that eliminating particle by laser beam.In this case, storage device in addition (for example, suction unit) may be non-essential.

In some embodiments, suction unit may act as cleaning device.It is not only restricted to this embodiment, usually may Other gas is being provided after the coating in the direct downstream of this sedimentation unit between cleaning device in last sedimentation unit and arrangement Separation phase.

In some embodiments that can be combined with other embodiments described herein, generated by ionized particles beam single The ionized particles beam that member generates can additionally or alternatively serve as one in cleaning device described herein.It can will ionize The particle beams expands to the entire width of covering flexible base board.Such as, it is possible to provide air blades or nozzle array are as outlet.Ion Changing particle flux can be used to separate particle with the surface of flexible base board.The beam may include nitrogen or be made of nitrogen.Alternatively, can pass through Automatic particle positioning system controls ionized particles beam, and automatic particle positioning system may include camera and captured for analyzing The controller of photo.

Due to the potential high temperature during coating, and due to cleaning device, coating after depositing operation positioning coating Cleaning device can be configured to bear at least 50 DEG C, 70 DEG C or even 100 DEG C or higher temperature afterwards.Flexible base board temperature or painting The temperature of cloth roller can be from -30 DEG C to+100 DEG C, especially during operation from -15 DEG C to+30 DEG C, especially in flexible base board On sputtering sedimentation during.

In general, in the depositing operation that may include highly exothermic reaction, it may be desirable to cooling painting drum.For sputtering, technique Heat mainly to the condensation energy of particle on flexible base board and be attributed to the heat of ion bombardment it is related.It can it is expected to avoid flexibility The high temperature of substrate.Therefore, painting drum disclosed herein may include cooling unit (not shown), such as be configured to apply Cloth roller is cooled to the cooling unit of 0 DEG C of temperature below.

Alternatively or additionally, at least one of cleaning device may include cooling unit.Therefore, cleaning device can be protected Hold allow by unknown or undesirable gas from the evaporation of cleaning device be maintained at acceptable level at a temperature of.Cleaning device This cooling under high temperature execute depositing operation the case where it is particularly advantageous.

It is especially multiple heavy at first group in some embodiments that can be combined with other embodiments described herein 121 upstream of product unit, it is possible to provide pretreatment unit 201.For example, pretreatment unit 201 can be located at the first deposition chambers 120 in and First group of multiple 121 upstream of sedimentation unit.In some embodiments, arrangement pretreatment unit 201 is so that can be in flexibility Substrate and the substrate of the first painting drum 122 are in contact in when pre-process flexible base board.In some embodiments In, pretreatment unit only is provided in the first deposition chambers 120, without providing in the second deposition chambers 140.In other implementations In mode, it is possible to provide more than one pretreatment unit.Pretreatment unit 201 can be configured to the first main table of activation flexible base board Face, to promote the adherency of layer heap stack structure to be deposited.

Pretreatment unit 201 may include plasma source (for example, RF plasma source), and the plasma source is configured For pre-processing flexible base board with plasma.For example, being modified with the surface that the pretreatment of plasma can provide substrate surface With the adhesiveness of film of the enhanced deposition on this surface, or substrate form can be improved in another way to improve the place of substrate Reason.

Pretreatment unit 201 can be ion source, especially linear ion source (LIS).Pretreatment unit 201 can be configured The first main surface for the precleaning flexible base board directly before being coated with the first main surface.Pretreatment unit 201 can be configured At the first main surface directing plasma injection stream towards flexible base board, to burn up hydrocarbon and to activate table Face is to promote the adherency of layer to be deposited.In some embodiments, argon ion can be used for providing to the effective of flexible base board Plasma cleaning.In some embodiments, combination of gases (for example, combination of argon ion and oxonium ion) can be used for being provided with The plasma cleaning of effect.In some embodiments, such as the pretreatment for the substrate based on PI, N₂It is also possible gas Body.

In some embodiments, it is possible to provide at least one discharge assembly is with the charge for being adapted on flexible base board.Example Such as, a discharge assembly can be arranged in first group of multiple sedimentation unit upstream (for example, in first volume barrel chamber room), and optional Ground, discharge assembly that can be other in first group of multiple sedimentation unit arranged downstream.Improvement processing can be beneficial to by providing discharge assembly As a result quality, because such as positive charge and/or negative electrical charge can accumulate on flexible base board.Specifically, charge can be from depositing Occur when storage reel unwinding flexible base board.Then, even if when flexible base board is moved in deposition chambers, electrostatic charge can also be protected It stays on substrate, and therefore spuious particle can be attracted to the surface of flexible base board.Therefore, by providing described herein put Electrical component, it is possible to provide the ion of opposite polarity, these ions are moved to the surface of flexible base board to neutralize charge.Therefore, it can mention For cleaning and flexible base board surface through discharging, so that the quality of the processing (for example, coating) of substrate can be improved.

In this disclosure, be intended to indicate that can be via any dress of electric field and ionic gas for term " discharge assembly " It sets.Discharge assembly can be passive unit or active cell or both passive unit and active cell.In addition, discharge assembly can wrap Include the one or more neutralization devices that may be connected to power supply and control unit.One or more device can be neutralized to be provided as neutralizing Spray gun or ionization spray gun with one or more spikes.In addition, power supply (especially high voltage power supply) neutralization can be connected to Device, to provide high pressure to one or more spikes, thus enable processing gas electrical breakdown to generate ion, these ions Can be mobile towards the surface of flexible base board in the electric field, to neutralize the charge on this surface.Control unit can initiate order or The electric discharge profile of pre-programmed is executed, so that generating negatively charged or positively charged ion stream by neutralization device, this ion stream will flow To the surface of substrate, so that can be moved into surface and the neutralization of substrate with the polar ion of opposite charge on the surface of substrate In the charge of substrate surface.

It therefore, can be by using electrostatic charge alleviator (for example, being described herein according to implementations described herein Discharge assembly) reduce influence of the particle to product yield.It can prevent granular materials from being used during unwinding because of substrate transmission Volume cause substrate electrification and be attracted.This facilitates the level of the extraneous contamination at restricting substrate surface.

It, can be in the first deposition chambers 120 in some embodiments that can be combined with other embodiments described herein Downstream connects chamber 130 with 140 upstream arrangement of the second deposition chambers.Connect chamber 130 can include: connection chamber ingress is used for Flexible base board is received from the first deposition chambers 120；With connection chamber outlet, for guide flexible base board enter the second deposition chambers In 140.The gas that can improve between the first deposition chambers 120 and the second deposition chambers 140 separates.It can be in connection chamber 130 One or more deflector rolls are arranged, to upward deflect flexible base board in the side of connection chamber outlet, so that flexible base board can be via The channel (for example, small slit) connected between chamber 130 and the second deposition chambers 140 swimmingly enters the second deposition chambers 140.

Fig. 3 is illustratively shown according to implementations described herein for being coated with the depositing device of flexible base board 10 100.Most of features of the depositing device 100 of Fig. 3 correspond to the individual features of depositing device shown in FIG. 1, so that can refer to Explanation explained above, is not repeated herein.

It, can be single in first group of multiple deposition in some embodiments that can be combined with other embodiments described herein First 121 upstreams provide annealing unit 114.Annealing unit 114 can be configured for first group of multiple 121 upstream of sedimentation unit Heat at position or anneal flexible base board 10.Heating can be from the flexible base board that holder 112 is wound it is beneficial, to permit Perhaps it deaerates before deposition to flexible base board.In addition, flexible base board is (such as, comprising such as PET, HC-PET, PE, PI, PU, TaC, COP Etc synthetic substrate) may include a considerable amount of moisture.It is de- to moisture in high vacuum conditions during coating process Gas can property to layer heap stack structure to be deposited (for example, layer adhesiveness, optical homogeneity, sheet resistance rate and other layer Property) there is negative effect.Therefore, it can be in first group of multiple 121 anneal upstream flexible base board of sedimentation unit beneficial.

It can be by disposing annealing unit 114 in one in one or more vacuum chambers of the first deposition chambers upstream To be reduced or avoided as annealing process damage caused by the vacuum condition in the first deposition chambers.For example, can be in the first reel Annealing unit 114 is provided in chamber 110 and in 112 downstream of holder, or first volume barrel chamber room 110 and first can be placed in Annealing unit 114 is provided in (optional) the cleaning chamber between deposition chambers 150.

In some embodiments, annealing unit 114 may include be configured to towards flexible base board guide heat radiation can At least one of heating roller 115 and pharoid 116.In some embodiments, it is possible to provide additional with heating zone Heating chamber.

In some embodiments, can by annealing unit 114 by flexible base board be annealed to 80 DEG C or higher, particularly 100 DEG C or higher or even up to 150 DEG C temperature.

Can heating roller 115 can be and be adapted to guide in the case where itself roller driver along substrate transmitting path The passive deflector roll or drive roll of flexible base board.In some embodiments, can heating roller can be for making flexible base board Deflect the deflection roll of predetermined deflection angle.

In some embodiments, can be heated by heat transfer medium (for example, oil or water) can heating roller 115.However, this Roller may need to carry out vacuum-tight seal to rotation feedthrough component (feedthrough) for the transfer medium via pipeline.

In some embodiments, can for can heating roller 115 electric heater unit is provided.Heating device may include first end and Second end, and heating device can be kept at first end and at second end.Electric heater unit can be being arranged in heating roller. In some embodiments, heating device can be fixed at first end and at second end.

In some embodiments, heating device can be irradiation heating device, and such as infrared heating device, induction add Thermal etc..According to some embodiments, electric heater unit can be non-contact thermal device.Non-contact thermal device energy It is enough make in the case where not contacting flexible base board can the surface of heating roller reach the temperature of restriction.In some embodiments, add Thermal can have both ends, and can be adapted to be supported, keep or fix at both ends.In one embodiment, heating dress The form that there can be generic cylindrical is set, wherein the both ends of heating device are the longitudinal axis of the heating device of generic cylindrical Both ends.

In some embodiments, depositing device can have trap (for example, cold trap), for for example by making With can heating roller from flexible base board collect degassing steam.It specifically, can be (moisture can be from described with the surface of flexible base board Surface evaporation) at opposite position steam of the arrangement for collecting degassing from flexible base board trap (for example, single by annealing During member 114 heats flexible base board).

Fig. 6 show can be used for according to the depositing device 100 of implementations described herein can heating roller 115 side view Figure.For example, can by can heating roller 115 be used as the direct downstream of holder deflection roll, as shown in exemplary in Fig. 3, or be used as Along the deflection roll of the farther arranged downstream of substrate transmitting path.In some embodiments, can in first volume barrel chamber room 110 and/or There is provided two or more in other vacuum chambers (for example, in the cleaning chamber in first volume barrel chamber room downstream) can heating roller. Can heating roller 115 may include roller surface 210, the roller surface 210 is adapted to contact with flexible base board 10.It can heating roller 115 Roller surface 210 can be adapted to as deflector roll guide flexible base board.Electric heater unit 220 can provided in heating roller 115. Electric heater unit 220 can be adapted to be operated under vacuum conditions.In Fig. 6, indicate that electric heating fills with reference marker 225 The outer surface set.The first end 250 of electric heater unit 220 and second end 260 can be considered as positioned at the generally round of heating device The front side of cylindrical shape.Heating device can be kept at first end 250 and second end 260.According to some embodiments, by first Holding meanss 271 keep first end 250, and keep second end 260 by the second holding meanss 272.

By supporting electric heater unit at both ends, it can stably keep during the operation of depositing device and be filled including electric heating Set 220 can heating roller 115, it is especially unrelated with the weight of flexible base board.According to some embodiments, it may be desirable to roller position High accuracy is to ensure the reliable operation of depositing device 100.

In some embodiments that can be combined with other embodiments described herein, annealing unit 114 can be additionally It or alternatively include pharoid 116.In some embodiments, pharoid can be configured to heating lamp (for example, red Outside line lamp).In some embodiments, can heating roller 115 immediately upstream or directly arranged downstream pharoid 116.For example, as shown in figure 3, annealing unit 114 may include can heating roller 115 and be located in can the direct downstream of heating roller 115 Pharoid 116.

When guiding flexible base board to pass through pharoid 116, pharoid 116 be can be configured to towards flexible base board 10 guidance heat radiations.One, two or more deflector roll be can provide for guiding flexible base board (for example, once or twice In) pass through pharoid 116.Degassing efficiency can be improved.It can be before the coating for example by the way that flexible base board be heated to 100 DEG C or higher or even up to 150 DEG C temperature make flexible base board reliably deaerate and preannealing.

Such as schematic depiction in Fig. 3, depositing device 100 can further comprise flaw detection apparatus 154 for heavy The defect of flexible base board is detected after product.It can be in first group of multiple 121 downstream of sedimentation unit and/or second group of multiple sedimentation unit 141 arranged downstream flaw detection apparatus 154.For example, can be mentioned in volume Two barrel chamber room 150 as shown in the embodiment of Fig. 3 For flaw detection apparatus 154.It in other embodiments, can be in the second deposition chambers and under second group of multiple sedimentation unit Trip arrangement flaw detection apparatus.In embodiment further, it is possible to provide two or more flaw detection apparatus.

Flaw detection apparatus 154 can be configured for the defects of the layer heap stack structure that detection deposits on flexible substrates (such as, winding defect or coating defects (for example, pin hole, crack or other openings)).It can tandem (inline) operational deficiencies Check device 154 carries out defect inspection during transmitting flexible base board along substrate transmitting path after the deposition of layer heap stack structure It surveys.For example, the layer heap stack structure being newly coated with can continuously be checked by flaw detection apparatus 154.Wherein, flaw detection apparatus 154 It can be configured to operate under vacuum conditions, i.e., during the transmission for passing through vacuum chamber (for example, volume Two barrel chamber room) in substrate Check substrate.

For example, can be used flaw detection apparatus 154 detect defect (for example, pin hole in the layer heap stack structure deposited, Crack or opening), the defect has 50 μm or smaller, particularly 30 μm or smaller, more particularly 15 μm or smaller or even 5 μm or smaller size.It can determine the size (for example, maximum gauge) and/or per unit table of one or more defects detected The defect counts of area.

In some embodiments, flaw detection apparatus 154 can be optical defect check device, particularly including light source 155 and photodetector 156 (for example, camera).

It is beneficial to estimate that the number of the defects of deposited layer heap stack structure and approximate size can be.Inspection has been coated with Substrate can be reasonably, to examine coating result.In some embodiments, the outermost layer of layer heap stack structure should be minimized The defects of number, the outermost layer can be metal layer (such as, Cu layers).In some embodiments, have 10 μm or The defect of larger size (for example, maximum gauge) can influence the functionality of deposited layer heap stack structure.Therefore, defect inspection fills Setting can be configured for detection and has 10 μm or larger sized defect or even smaller defect.

In some embodiments, it can be configured for according to the depositing device of implementations described herein in flexible base Sedimentary stacked structure in first main surface of plate, especially wherein the outermost layer of layer heap stack structure can be metal layer (for example, Cu layers).Outermost layer quality can make outermost layer not have 30 μm or larger sized defect or pin hole substantially, so that Outermost layer is in every 625cm²There is 15 μm of defects or pin hole to 30 μ m in size having less than 10 on surface area (A4 paper product), And/or make outermost layer in every 625cm²There are 5 μm of lacking to 15 μ m in size having less than 15 on surface area (A4 paper product) Sunken or pin hole.Flaw detection apparatus 154 can be configured to check whether these for providing the layer heap stack structure having been coated with or similar Metric attribute.

Flaw detection apparatus 154 can be configured for carrying out optical transmission measurement, especially check that non transparent layer is (all Such as, metal layer) Shi Jinhang.For example, light source 155 can be provided on the first side of flexible base board, and can be the second of flexible base board Photodetector 156 is provided on side, so that the transmission that can carry out the layer to flexible base board and/or deposition on flexible substrates is surveyed Amount.It may imply that the non transparent layer of deposition on flexible substrates may by the transmissivity increase of the flexible base board of photo-detector measurement Defect with such as pin hole or opening.

In some embodiments that can be combined with other embodiments described herein, it can be led in the first deflector roll with second (i.e. " suspended span (free span) " section of flexible base board, wherein flexible base board does not connect directly with one in deflector roll between roller Touching) defective mounting check device 154.For example, can on the first side of flexible base board defective mounting check device 155 light source 155, so that the light beam that the suspended span segment transmission that may pass through flexible base board is generated by light source 155.It can be in the another of flexible base board The photodetector 156 of flaw detection apparatus is arranged on side, so that the light beam that the suspended span section for having already passed through flexible base board is propagated It can be detected by photodetector 156.It in some embodiments, can be in sedimentation unit downstream and winding reel upstream (for example, twining Between the two guidance volume of winding reel immediately upstream) defective mounting check device.

In some embodiments, the width of the light beam generated by light source 155 can be adapted to the width of flexible base board, with So that flexible base board can be checked substantially in the overall with of flexible base board or at least in the overall with of the layer heap stack structure deposited. For example, the width of light beam can be 500mm or bigger, especially 1m or bigger, more particularly between 1.2m and 1.8m.? In some embodiments, and especially in vacuum chamber arrange light source in the case where, can for example with cooling fluid (such as with Water) cool down light source.Such as, it is possible to provide water is recycled to cool down light source 155, when arranging light source 155 especially in vacuum chamber. Can provide supply pipe cooling medium (for example, water) being supplied in vacuum chamber, supply pipe is for example including across the second reel The vacuum feedthrough part of the wall of chamber.In addition, in some embodiments, it is possible to provide vacuum feedthrough part is with by other medium (example Such as, electric) it is supplied in vacuum chamber.For example, can be guided via one or more vacuum feedthrough parts for light source and/or light inspection Control cable and/or service cable that survey device is controlled and/or powered pass through the wall of vacuum chamber.

It in some embodiments, can be outside vacuum chamber (for example, one provided in vacuum chamber wall, two, three A or more window rear) arrangement photodetector 156, the photodetector 156 may include one, two, three or more A camera.This allows to have easy access to photodetector 156 for adjusting, alignment and maintenance.In addition, when in vacuum chamber outdoor arrangement When photodetector 156, the vacuum feedthrough part for being controlled photodetector and being powered can not be provided.Even further, It is likely difficult to provide photodetector 156 in vacuum chamber, because the indoor available space of vacuum chamber may be limited.Therefore, may be used Overall compact vacuum chamber is provided.

Therefore, in some embodiments, light source can be arranged in vacuum chamber (for example, in volume Two barrel chamber room 150) 155, and can (for example, one or more window rears in the wall of volume Two barrel chamber room 150) arrangement light inspection outside vacuum chamber Survey device 156.Alternatively, in the vacuum tightness shell that can be provided in vacuum chamber (such as in the main volume for being located at vacuum chamber Big gas tank in, such as in volume Two barrel chamber room 150) accommodate at least one of light source and photodetector.For example, can be Two, three or more window is provided in the roof of two reel chambers 150 or in the wall of vacuum tightness shell, and can be worn Two or more cameras for crossing two or more windows towards photodetector 156, which boot up, has passed through flexible base board propagation Light beam.In some embodiments, photodetector 156 can be installed on the adjustable lever outside vacuum chamber, can optionally be adjusted Save the distance between light source 155 and photodetector 156.For example, for example depending on one or more parameters (such as, check width, Number of cameras, light beam focal length of photodetector etc.), photodetector is installed at some distance away from the layer heap stack structure deposited It can be reasonable.Therefore, in some embodiments, the compatible camera of vacuum can not be necessary.Described tandem Flaw detection apparatus permission carries out high-resolution accurate defects detection in R2R depositing device.

In other embodiments, it can be arranged outside vacuum chamber (for example, at one or more corresponding window rears) Both light source 155 and photodetector 156.For example, reflector can be provided in vacuum chamber to be reflected back light beam, so that can be Light source 155 and photodetector 156 are arranged on the same side of flexible base board (for example, outside vacuum chamber).Further implementing In mode, light source 155 and photodetector 156 can be arranged in vacuum chamber, as schematically indicated in Fig. 3.Defect inspection dress The setting further set be it is possible, provided for example including the light source provided outside vacuum chamber and in vacuum chamber Photodetector.

In some embodiments that can be combined with other embodiments described herein, depositing device 100 can be further Including being arranged in first group of multiple 121 downstream of sedimentation unit and in the first monitoring dress of second group of multiple 141 upstream of sedimentation unit It sets 161 and is arranged at least one of second monitoring device 162 in second group of multiple 141 downstream of sedimentation unit.In some realities It applies in mode, the first monitoring device 161 and/or the second monitoring device 162 can be tandem monitoring device, this tandem prison Surveying device can operate during the operation of depositing device, particularly under vacuum conditions.First monitoring device 161 and/or second Monitoring device 162 can be configured for one or more properties of at least one layer deposited on detection flexible base board.

For example, the first monitoring device 161 can be configured for detecting or measuring being deposited by first group of multiple sedimentation unit 121 One or more layers one or more properties, and the second monitoring device 162 can be configured for detecting or measure by the The one or more properties for one or more layers that two groups of multiple sedimentation units 141 deposit.

It, can be in the first deposition chambers 120 in some embodiments that can be combined with other embodiments described herein In and in 122 the first monitoring device of arranged downstream 161 of the first painting drum, and/or can in the second deposition chambers 140 and In 142 the second monitoring device of arranged downstream 162 of the second painting drum.Can corresponding painting drum and corresponding monitoring device it Between arrange one or more deflector rolls (such as, drive roll or passive guide roller).

Monitoring device can be configured for the electrical properties and optics of the one or more layers deposited on measurement flexible base board At least one of property.For example, can measure electricity relevant to the conductivity of the one or more layers deposited on flexible base board Property.Specifically, it can measure the electricity sheet resistance of the one or more conductive layers of deposition on flexible substrates.In some realities It applies in mode, it can be by applying potential or voltage between the position spaced apart of two in one or more layers and passing through measurement The electric current of one or more layers between two positions spaced apart is flowed through to measure be deposited on substrate one or more A layer of electrical properties.

It in some embodiments, can be by incuding local current (such as, being vortexed) in one or more layers and passing through The intensity of incuded vortex is measured to measure electrical properties (such as, the thin-layer electric for the one or more layers being deposited on substrate Resistance).The electrical property of the one or more layers of deposition on flexible substrates is measured by incuding the vortex in one or more layers Matter can have the advantage that the measurement of the space analysis of electrical properties can be possibly realized.For example, can be by incuding and measuring flexibility The sheet resistance in lateral side regions of the vortex to measure flexible base board in the lateral side regions of substrate.Similarly, induction can be passed through And measure the sheet resistance in central area of the vortex to measure flexible base board in the central area of flexible base board.In addition, can With inductive loop in a non-contact manner.Therefore, the risk that damage has been coated with substrate can be reduced.

In some embodiments, at least one of the first monitoring device 161 and the second monitoring device 162 be alternatively Or it is additionally configured to one or more optical properties of the one or more layers of measurement deposition on flexible substrates.Example Such as, transmissivity, reflectivity and/or the color value of one or more layers be can measure.Coating on substrate can pass through specified spectrum Reflectivity and transmissivity value and gained color value characterize, and the reliable series connection of the transmission and reflection during the production of coating Formula measurement can be the control for depositing operation and the aspect that is contemplated that.Layer uniformity and/or layer thickness value can be from being surveyed The transmissivity and/or reflectance value of amount are derived from.

Albedo measurement on mobile flexible base board can be challenging, because the little deviation of the flatness of substrate can be led The Geometrical change on reflecting bundle to the path of detector is caused, to generate the measurement result of mistake.It can be in flexible base board and deposition Reflectivity is measured at the position that the deflector roll of equipment is in Mechanical Contact to ensure the even contact of substrate and roller surface.It can be Transmission measurement is carried out at position between one roller and the second roller.Region between first roller and the second roller can be known as flexible base board " suspended span " section.

In some embodiments that can be combined with other embodiments described herein, the first monitoring device 161 and/or Second monitoring device 162 can be configured for one or more optical properties of measurement flexible base board or one or more coatings. In some embodiments, monitoring device may include at least one sphere structure.Sphere structure can be integrating sphere, such as black cloth In wish (Ulbricht) ball.Sphere structure can be disposed in suspended span region between the first deflector roll and the second deflector roll.Sphere structure It can provide homogenous diffusion or the diffusion of the light in sphere structure.It can be distributed and incident in sphere structure on an equal basis in sphere structure Light on surface.From sphere structure pass through port emit diffused light can be irradiated on flexible base board so as to measure flexible base board or At least one optical property of one or more coatings.

In some embodiments, at least one monitoring device may include that a layer measuring system (LMS) (such as, survey by optical layer Amount system), to measure and to assess coating result.It will be understood, therefore, that embodiment provides metrology capability, such as passing through Estimate the thickness degree of one or more sedimentaries using optical reflection and/or transmissive system, for example, for it is transparent or semitransparent Flexible base board or coating layer are used together.

In some embodiments, it is possible to provide at least one monitoring device is for measuring the exhausted of one or more coating layers To thickness and/or the thickness uniformity.

In addition, (such as with 200 μm or perhaps 100 μm or smaller or 50 μm or smaller especially for thin substrate It is small, the substrate of for example, about 25 μm of thickness), processing substrate and the substrate winding of corrugationless are beneficial and challenging.Root According to some embodiments, one or more draw roll and/or one or more tonometry rollers can be used to provide the sum of corrugationless The controlled substrate winding of tension and/or transmission (or the substrate that the fold with reduction generates winds and/or transmits).

Such as schematic depiction in Fig. 4, according to some embodiments described herein, depositing device may include one or more A draw roll and one or more tonometry rollers.Therefore, it can be configured in the controlled lower operation of tension along substrate transmission path Diameter guides and transmits the roll assembly of flexible base board.Draw roll can be regarded as drive roll, including the driver (example for driven roller Such as, there is adjustable driving force).Tonometry roller can be regarded as include sensor roller, the sensor for measure in roller The tension of the flexible base board of a part of surface guidance.Flexible base board 10 is around tonometry roller around (enlacement) Angle can be 90 ° or bigger, especially 120 ° or bigger, or even up to 180 °, to improve the reliability of measurement result.

In some embodiments, at least one of lower roll or multiple it can be drive roll: holder 112, One painting drum 122, the second painting drum 142 and winding reel 152.In some embodiments, it is possible to provide additional active Roller.For example, in embodiment shown in Fig. 4, can (for example, in first deposition chambers) provide first draw roll 181 and/ Or it can the second draw roll 183 of (for example, in second deposition chambers) offer.Drive roll is marked with curved arrow in Fig. 4.

In some embodiments, tonometry roller can be associated at least one of drive roll.In some embodiment party In formula, two or more drive rolls can be respectively provided with associated tonometry roller.In some embodiments, a master is removed All drive rolls other than dynamic roller can be respectively provided with associated tonometry roller.Can not have associated tonometry roller One drive roll can referred to herein as " home roll ".Flexible base board can along the transmission speed (also referred to as " linear velocity ") of transmitting path It is determined by the rotation speed of home roll, the home roll can be rotated with scheduled rotation speed.

It can be in drive roll associated with tonometry roller upstream or arranged downstream tonometry roller.In general, in drive roll Other drive roll is not provided between associated tonometry roller.However, in some cases, can drive roll to it is related One, two or more passive guide roller is provided between the tonometry roller of connection.It specifically, respectively, can be along substrate transmission path Diameter alternately provides drive roll and tonometry roller, and can arrange between the two in drive roll and tonometry roller or can not arrange quilt Dynamic roller.

As an example, first tonometry roller 184 is associated with holder 112 in embodiment shown in Fig. 4, Second tonometry roller 185 is associated with the first draw roll 181, and third tonometry roller 186 is related to the second painting drum 142 Connection, the 4th tonometry roller 187 is associated with the second draw roll 183, and the 5th tonometry roller 188 and winding reel 152 It is associated.First painting drum (and drive roll) can be configured to home roll, and the home roll determines the transmission speed of flexible base board And can not have associated tonometry roller.It should be understood that this arrangement is exemplary setting.For example, in other embodiment party In formula, home roll can be configured by the second painting drum or another drive roll.In addition, in some embodiments, it is possible to provide be more than Or less than five tonometry rollers, and/or can provide the additional draw roll more or less than two.In other implementations In mode, the setting of tonometry roller and draw roll and corresponding position can be different.Fig. 4 shows and will be explained in detail to flexibility One in numerous possible settings of the tension force of substrate.

In embodiment shown in Fig. 4, the first tonometry roller 184 is associated with holder 112.First tension is surveyed The downstream that roller 184 can be located at holder 112 is measured, wherein can arrange between holder 112 and the first tonometry roller 184 One, two or more passive guide roller.For example, the first tonometry roller 184 can be located in the first deposition chambers 120 and first Painting drum 122 (next drive roll) upstream.

Can substrate tension at the position of preset first tonometry roller 184 set point (i.e. target value).If by One tonometry roller 184 measures the tension value greater than set point, then can reduce the torque provided by 112 driver of holder Value.If measuring the tension value less than set point by the first tonometry roller 184, it can increase and be driven by holder 112 The torque value that device provides.Therefore, it can be ensured that the appropriate tension of the flexible base board in holder downstream.It can avoid by large substrates tension The damage (such as, rupture, crack, pin hole or winding defect) to flexible base board caused.In addition, can avoid by low substrate tension Cause be attributed to substrate excessive substrate temperature and generate fold, fluctuating, sagging or defect.

In the embodiment illustrated in fig. 4, the first painting drum 122 can be determining flexible base board along the biography of substrate transmitting path Send the home roll of speed.The rotation speed of home roll can be optionally set.For example, the transmission speed of flexible base board can be 1 m/min Or higher and 5 ms/min or lower, particularly from about 2 ms/min.The measured value that may depend on associated tonometry roller exists The driver of the every other drive roll along substrate transmitting path is controlled on tension.

Such as schematic depiction in Fig. 4, in some embodiments, the second tonometry roller 185 can be with another drive roll (such as, the first draw roll 181) is associated.Second tonometry roller 185 can be located at the first painting drum 122 direct downstream and First draw roll 181 is immediately upstream.However, in other embodiments, can be applied respectively in the second tonometry roller and first One or more passive guide rollers are arranged between cloth roller between the second tonometry roller and the first draw roll.For example, the second tension Measuring roller 185 can be located in the first deposition chambers 120 and in 122 downstream of the first painting drum.Second tonometry roller 185 can quilt It is configured to the substrate tension of measurement 122 downstream position of the first painting drum.

Can substrate tension at the position of preset second tonometry roller 185 set point (i.e. target value).If by Two tonometry rollers 185 measure the tension value greater than set point, then can reduce by the driver offer of the first draw roll 181 Torque value.If measuring the tension value less than set point by the second tonometry roller 185, can increase by the first draw roll The torque value that 181 driver provides.Therefore, it can be ensured that around the appropriate tension of the flexible base board of the first painting drum.

It should be noted that high substrate tension can increase the risk of winding defect.For example, if flexible base board is pressed with high-tension To roller surface, then it can produce scratch or other winding defects.Therefore, low substrate tension is in direct in flexible base board and roller surface It can be at the position of contact beneficial.On the other hand, can be around the high substrate tension of painting drum it is beneficial because when soft Property substrate and painting drum cooled substrate be in be in close contact in when, can be during deposition more efficiently Cooling flexible base board.It therefore, is beneficial along the accurate control of the substrate tension of substrate transmitting path.

Therefore, the target value of the second tonometry roller 185 can be higher than the target value of the first tonometry roller 184.This be because Low substrate tension between holder 112 and the first tonometry roller 184 can be beneficial to reduce the risk of winding defect, and Higher substrate tension between first painting drum 122 and the first draw roll 181 can be beneficial to improve flexible base board and the first painting Thermo-contact between the substrate of cloth roller 122.For example, the expection substrate around the first painting drum 122 can be represented The target value of second tonometry roller 185 of power can be 100N or bigger and 900N or smaller, especially from 200N to 400N. In some embodiments, the target value of the substrate tension lower than 200N can be beneficial.

Similarly, it such as schematic depiction in Fig. 4, in some embodiments, can be provided in 181 downstream of the first draw roll Third tonometry roller 186, and third tonometry roller is associated with the second painting drum 142.It may depend on by third Power measures the tension value that roller 186 measures to control by the torque of the driver generation of the second painting drum.

Such as schematic depiction in Fig. 4, in some embodiments, the 4th can be provided in 142 downstream of the second painting drum Tonometry roller 187, and the 4th tonometry roller is associated with the second draw roll 183.It may depend on by the 4th tonometry Roller 187 measure tension value come control by the second draw roll 183 driver generation torque.In some embodiments, Four tonometry rollers 187 can be located in the second deposition chambers 140.

Similarly, such as schematic depiction in Fig. 4, in some embodiments, the can be provided in winding 152 upstream of reel Five tonometry rollers 188, and the 5th tonometry roller is associated with winding reel 152.It may depend on by the 5th tonometry Roller 188 measure tension value come control by winding reel 152 driver generation torque.If by the 5th tonometry roller 188 measure the tension value greater than set point, then can reduce the torque value provided by winding reel 152.If by the 5th tension Measurement roller 188 measures the tension value less than set point, then can increase the torque value provided by winding reel 152.It therefore, can be true Protect the appropriate tension of the flexible base board of winding reel upstream.

There is provided one or more additional draw rolls (for example, the first draw roll 181 and/or second draw roll 183) can be with Be it is beneficial, to reduce the substrate tension in the central section between two drive rolls, have between two of them drive roll Over long distances or with several passive guide rollers.For example, in some embodiments, can the first painting drum and the second painting drum it Between arrange at least one draw roll.In addition, in the depositing device that Component convex and partial concavity substrate transmitting path are provided, The one or more draw rolls of offer can be beneficial.For example, big curved on changing on orientation substrate and differently curved direction Bent angle can increase substrate tension, and the drive roll for allowing offer other is advantageous.Further it is provided that additional draw roll can Having the advantage that optionally can be arranged to substrate tension in corresponding region in the different zones along substrate transmitting path Different values.

Fig. 5 shows the schematic sectional view of the depositing device 100 according to implementations described herein.Depositing device 100 Including multiple vacuum chambers, the multiple vacuum chamber includes first volume barrel chamber room 110, cleaning chamber 170 (optional), first heavy Product chamber 120, connection chamber 130 (optional), the second deposition chambers 140 and volume Two barrel chamber room 150.In addition, depositing device 100 Including roll assembly, the roll assembly is configured for transmitting flexible base board along substrate transmitting path.

Such as schematic depiction in Fig. 5, these vacuum chambers can be arranged with substantial linear setting.In other words, Edge can be arranged on (for example, on right side) side along the first chamber of substrate transmitting path (i.e. first volume barrel chamber room 110) The second chamber (i.e. cleaning chamber 170) of substrate transmitting path.It similarly, can be at the second vacuum chamber (i.e. cleaning chamber 170) Side on (i.e. on right side) arrange along substrate transmitting path third chamber (i.e. the first deposition chambers 120).Similarly, may be used It is arranged (i.e. on right side) along the 4th of substrate transmitting path on the side of third vacuum chamber (i.e. the first deposition chambers 120) Chamber (i.e. connection chamber 130).Therefore, it can substantially be arranged with linear setting or with the row from left to right extended in Fig. 5 Vacuum chamber.Therefore, the general direction of substrate transmitting path similarly can from left to right extend.However, substrate transmitting path exists It can be bent for several times in each vacuum chamber or change direction (for example, downwardly and upwardly and/or to right and left), in Fig. 5 It is indicated.

For example, in some embodiments, downwardly and upwardly curved substrate transmitting path can be replaced.Space, which can be reduced, to be needed It asks.In the illustrative embodiments of Fig. 5, substrate transmitting path from holder 112 extend downwardly into can heating roller 115, institute State can heating roller can be the roller rotated counterclockwise.Then, substrate transmitting path can be bent upwards towards deflector roll 113, it is described to lead Roller 113 can be the roller rotated clockwise.Deflector roll 113 can rotate down flexible base board, the deflection roll again towards deflection roll It can be the roller rotated counterclockwise.Deflection roll can be towards the slit in the wall between first volume barrel chamber room 110 and cleaning chamber 170 Deflect flexible base board.Can first volume barrel chamber room 110 and cleaning chamber 170 between wall in provide sealing device 105 (for example, Including inflatable seal).From can on path of the heating roller 115 towards 113 downstream of deflector roll 113 or deflector roll, can by radiation plus Hot device 116 heats flexible base board.

The roller rotated clockwise can be in contact with the first main surface of flexible base board, and the first main surface can be accordingly By the main surface to be coated during depositing device, and the roller rotated counterclockwise can connect with the second main surface of substrate Touching, the second main surface are the rear surfaces (can be or may not be the surface having been coated with) of substrate.Therefore it provides being configured for clear First cleaning device 171 of clean first main surface and the second cleaning device 172 for being configured for the second main surface of cleaning can be with It is beneficial.The first cleaning device 171 and the second cleaning device can be arranged in cleaning chamber 170.Can it is mutual directly on Trip or arranged downstream the first cleaning device 171 and the second cleaning device 172.In embodiment shown in Fig. 5, rotate counterclockwise The roller surface of roller may act as the counter-pressure surface for the first cleaning device 171, and the roller surface of the roller rotated clockwise It may act as the counter-pressure surface for the second cleaning device 172.The roller rotated clockwise can be towards cleaning chamber 170 and the Open Side Down in wall between one deposition chambers 120 deflects flexible base board.It can be in cleaning chamber 170 and the first deposition chambers Other sealing device is optionally arranged in wall between 120, so as to improve cleaning chamber 170 and the first deposition chambers 120 it Between gas separation, and so as to avoid by cleaning device discharge gas enter the first deposition chambers 120.

In the first deposition chambers 120, two or more and five or more can be provided in 122 upstream of the first painting drum Less, particularly three deflector rolls, and two or more and five or less, special can be provided in 122 downstream of the first painting drum It is not three deflector rolls.It, can be by one in the deflector roll for being arranged in 122 upstream of the first painting drum as described in being explained in more detail above A to be configured to the first tonometry roller 184, the first tonometry roller can be associated with holder 112.It can will be arranged in The deflector roll of first painting drum 122 immediately upstream is configured to deflection roll for flexible base board 10 to be swimmingly directed to the first painting In the substrate of cloth roller 122.

In addition, at least one of the deflector roll in 122 downstream of the first painting drum can will be arranged in, it is disposed particularly in first The deflector roll in the direct downstream of painting drum 122 is configured to the second tonometry roller 185.In addition, the second tonometry can will be arranged in One in the deflector roll in 185 downstream of roller is configured to first draw roll 181 associated with the second tonometry roller 185.Exist It is above explained in greater detail and illustrates the concept of tension force, and be not repeated herein.Such as schematic depiction in Fig. 5, Substrate transmitting path can change for several times direction in 122 downstream of the first painting drum in the first deposition chambers 120.Offer can be provided With 120 ° or bigger, particularly 150 ° or bigger or even about 180 ° or the bigger deflector roll around angle generate substrate transmission The variation of path direction.For example, the circular angle of the second tonometry roller 185 can be about 180 °.Flexible base board can for several times completely Change direction, so that can provide the compact overall setting of depositing device.It in some embodiments, can be in the first deposit cavity The first monitoring device 161 is provided in room 120 and in 122 downstream of the first painting drum.

Deflection roll can be configured by the last deflector roll in the first deposition chambers 120 to be used for towards the first deposition chambers 120 Flexible base board is deflected with the opening in the wall connecting between chamber 130.It in some embodiments, can be in the first deposition chambers Sealing device (optional) is provided in wall between 120 and connection chamber 130.

Connection chamber 130 can be arranged between the first deposition chambers 120 and the second deposition chambers 140.It is heavy that first can be improved Product chamber 120 is separated with the gas between the second deposition chambers 140.In addition, can be by increasing by the first deposition chambers 120 and second The distance between deposition chambers 140 promote the component being arranged in the first deposition chambers 120 and/or the second deposition chambers 140 Maintenance.

Specifically, according to some embodiments, depositing device described herein can have modularized design.For example, In some embodiments, it may be unnecessary to the second deposition chambers 140.In this case, volume Two barrel chamber room 150 can directly be connected The first deposition chambers 120 are connected to, rather than connect chamber 130.In other embodiments, addition third deposition chambers can be Reasonably.In this case, it is possible to provide the second connection chamber replaces the volume Two barrel chamber room in 140 downstream of the second deposition chambers 150, and third deposition chambers and volume Two barrel chamber room can be connected to the second connection chamber downstream.Therefore, depositing device can Equipped with flange or connection pedestal, to allow by connecting other vacuum chamber or by from depositing device 100 shown in Fig. 5 Remove in vacuum chamber some extends depositing device.It will be understood, therefore, that it is heavy for extending to can provide other vacuum chamber The opereating specification of product equipment.Therefore, the modularized design of depositing device described herein allows to be adapted to the size of base shape, institute The requirement (for example, space requirement in factory) for stating base shape and user matches.

In some embodiments, single deflector roll can be only provided in connection chamber 130, for direction connection chamber 130 Opening in wall between the second deposition chambers 140 guides flexible base board.It in other embodiments, can be in connection chamber Two or more rollers are provided.It in some embodiments, can be in the wall between connection chamber 130 and the second deposition chambers 140 Interior arrangement sealing device (optional).

The basic setup of second deposition chambers can correspond to the setting of the first deposition chambers, so that saying with reference to explained above It is bright, it is not repeated herein.Specifically, the base in the second deposition chambers can be controlled in the mode similar with the first deposition chambers The tension of plate.However, in some embodiments, can be mentioned in the first deposition chambers and first group of multiple sedimentation unit upstream The pretreatment unit 201 of confession can not be provided in the second deposition chambers.In addition, in some embodiments, it can be only second Monitoring device (i.e. the second monitoring device 162) is provided in deposition chambers and in second group of multiple 141 downstream of sedimentation unit.For example, In some embodiments, the monitoring of the layer heap stack structure in second group of multiple sedimentation unit downstream can be enough.Alternatively, It can provide the first monitoring device 161 and the second monitoring device 162, as depicted in Figure 5.In addition, in some embodiments, the The sedimentation unit of one group of multiple sedimentation unit can be different from the sedimentation unit of second group of multiple sedimentation unit.For remaining aspect, Second deposition chambers can have the setting similar or identical with the first deposition chambers.

It, can be in the second deposition chambers 140 in some embodiments that can be combined with other embodiments described herein Other sealing device is provided in wall between volume Two barrel chamber room 150.It in some embodiments, can be in winding reel The flaw detection apparatus 154 that explanation is explained in more detail above is arranged in the volume Two barrel chamber room of 152 upstreams.

Fig. 7 shows the schematic sectional view of painting drum 400, and painting drum 400 can be the first painting drum 122 or the Two painting drums 142.Specifically, in some embodiments, the first painting drum 122 and the second painting drum 142 can have There is corresponding or at least similar setting.

In some embodiments that can be combined with other embodiments described herein, painting drum 400 may include using In the curved substrate 401 of contact flexible base board 10, wherein curved substrate 401 can be around rotation Axis A is rotatable, and can include: substrate-guided region 403；One group of gas vent 404 is placed in curved substrate support table In face 401 and it is adapted to release air-flow；With gas distributing system 405, go out for air-flow to be selectively supplied to gas Mouthfuls 404 the first subgroup and for selectively preventing gas from flowing to the second subgroup of gas vent 404, wherein gas vent 404 the first subgroup includes at least one gas vent in substrate-guided region 403, and the second subgroup packet of gas vent Include at least one gas vent outside substrate-guided region 403.

Typically, painting drum 400 can be rotated around rotary shaft A.In some embodiments, painting drum 400 includes quiet Stop point and can (for example, around stationary part) rotation part.For example, painting drum 400 may include stationary internal part (one In a little embodiments, it may include the component of gas distributing system or gas distributing system) and revolving outer part, outside the rotation Portion part is rotated around internal stationary part.

According to some embodiments, painting drum 400 includes curved substrate 401.Painting drum 400 it is curved Bent substrate can be adapted to contact during the operation of depositing device 100 with flexible base board (at least partly). According to the embodiment that can be combined with any other embodiment described herein, curved substrate can be cylinder Shape symmetrical surface.Specifically, curved substrate can be selected from the group being made up of: cylindrical surface, spill-circle Cylindrical surface, the surface of cone and truncated cone surface.

According to some embodiments, during the operation of depositing device, curved substrate 401 can be in contact position Set place's contact flexible base board.For example, (such as, coarse by the surface nature of the curved substrate of painting drum Degree), substrate can be in point-like contacts with curved substrate.Curved substrate with roughness can Mean that the Microscopic Angle of curved substrate shows " peak and valley ", wherein curved substrate and substrate Between point-like contacts be curved substrate roughness have " peak " position at.According to can with other implementation The roughness of some embodiments that mode combines, the curved substrate of painting drum can be typically in about 0.1Rz Between about 1.5Rz, more typically between about 0.2Rz and about 0.8Rz.According to some embodiments, work as coating When roller 400 rotates, the contact between painting drum 400 and substrate allows moving substrate.

During operation, substrate is guided above the substrate-guided region 403 in curved substrate 401.? In some embodiments, substrate-guided region 403 can be defined as to the angular region of painting drum 400 (in the operation of painting drum Period substrate contacts in this angular region with curved substrate surface), and can correspond to the circular angle of painting drum.

In some embodiments, the circular angle of painting drum can be 120 ° or bigger, especially 180 ° or bigger, or Even 270 ° or bigger, such as schematic depiction in Fig. 5.In some embodiments, the topmost portion of painting drum can grasped It is not contacted with flexible base board during work, wherein the circle zone of painting drum can cover at least entire lower half of painting drum. In some embodiments, flexible base board can be in a manner of substantial symmetry around painting drum.

Painting drum shown in Fig. 7 further comprises that one group of gas being placed in curved substrate 401 goes out Mouth 404.Gas vent 404 is adapted to discharge gas from the gas distributing system 405 of painting drum 400, especially corresponding Gas vent position be essentially perpendicular on the direction of curved substrate 401.Coating shown in Fig. 7 In the example of roller, gas vent is distributed in the whole circumference of painting drum.It in some embodiments, can be in painting drum Whole circumference on distribute gas vent 404 in regular fashion.

According to the embodiment that can be combined with any other embodiment described herein, any individual gas vent, Any subgroup or all gas outlet of gas vent can be selected from the group being made up of: opening, hole, slit, nozzle, air blast Pipe, spray valve, catheter opening, aperture, jet port, the outlet provided by porous material etc..According to some embodiments, outlet is Groove in surface, these grooves are typically infundibulate or cupuliform, and further groove is fed with bottom or side from groove The gas on road.The gas vent of painting drum described herein can also be the opening of porous layer.According to some embodiments, originally Literary signified gas vent can have any proper shape, such as automatic adjustment, annular, ellipse, triangle, rectangle, Square, polygon, irregular shape (such as irregular cycle irregularly has angular shape), a gas vent and another The different shape etc. of gas vent.According to some embodiments, gas vent is not reached outside surface.

Painting drum 400 according to some embodiments described herein further comprises gas distributing system 405.According to Some embodiments, gas distributing system 405 include gas source 408.Gas distributing system 405 allows selectively to provide air-flow To the first subgroup of gas vent.For example, as shown schematically in figure 7, there is gas vent 404 and gas distributing system 405 Painting drum air-flow is provided to the gas vent 404 in the substrate-guided region 403 of curved substrate.It can incite somebody to action (temporary) gas vent in substrate-guided region 403 is appointed as the first subgroup of gas vent.According to described herein Some embodiments, the gas distributing system 405 in painting drum are adapted to selectively prevent gas flow substrate-guided The gas vent of painting drum outside region 403.(temporary) gas vent outside substrate-guided region 403 can be appointed as Second subgroup of gas vent.

During the rotation of painting drum, any single gas vent temporarily belongs to the first subgroup and the second subgroup.It changes Sentence is talked about, and can close the gas vent opened in later time, and can be in the gas vent of later time either on or off. Gas source is opened or be connected to the gas vent for entering substrate-guided region 403 during the rotation of curved substrate (i.e. member relation becomes the first subgroup).The gas in substrate-guided region will be left during the rotation of curved substrate Body outlet is closed or disconnects (i.e. member relation becomes the second subgroup) with gas source.

The gas distributing system 405 of painting drum can be adapted to the gas for selectively providing and preventing gas from flowing to restriction Outlet.For example, in the example in figure 7, the gas distributing system 405 of painting drum includes being arranged in the static of painting drum 400 Gas source 408 in part 406.Gas source 408 has the size of the section of the circumference for the stationary part for surrounding painting drum.Coating rolling The curved substrate 401 of cylinder can be rotated around the rotary shaft A of painting drum, and specifically, around the quiet of painting drum Stop point (including gas source) rotation.

According to some embodiments described herein, gas distributing system 405 may include gas passage 407.When corresponding When gas vent is in substrate-guided region 403, gas passage 407 can be from the substrate of 408 guided bend of gas source Gas vent 404 on 401.Gas passage can be from the gas vent in the substrate 401 of 408 guided bend of gas source 404 the first subgroup.Gas distributing system 405 with gas source 408 and gas passage 407 can be described as to part rotation and portion Divide static.In the case where gas passage 407 is rotated around gas source 408, gas distributing system 405 allows gas passage 407 It is selectively connected and disconnects with gas source 408.

According to some embodiments, air-flow is provided to gas vent by gas distributing system 405 (specifically, gas source 408) 404.It in some embodiments, is still to allow flexible base board by the air-flow that gas distributing system 405 is provided to gas vent 404 The air-flow contacted with curved substrate 401.For example, air-flow can typically range between about 10sccm and about 400sccm it Between, more typically between about 30sccm and about 300sccm.In some embodiments, painting drum 400 can be adapted to The flow rate of gas of the per unit area of curved substrate 401, this flow rate typically range between about 10sccm/ m²With about 200sccm/m²Between, more typically between about 30sccm/m²With about 120sccm/m²Between.In one example, it applies Cloth roller can be adapted to the flow rate of gas of the per unit area of curved substrate, this flow rate can be typical Ground is about 100sccm/m²。

According to some embodiments that can be combined with other embodiments described herein, especially for gas passage Painting drum (in such as Fig. 7 exemplary shown in), gas vent number can typically range between 20 and 100, more typically be situated between Between 40 and 100.According to some embodiments, curved substrate can be separated into gas section.In some realities It applies in mode, each gas section has several gas vents.In some embodiments, the gas in substrate-guided region goes out The number of mouth is between 5 and 20.5000 can be typically at least for the number of the gas vent of the porous layer of painting drum It is a, more typically at least 6000, and even more typically at least 8000.According to some embodiments, gas goes out The number of mouth is between 20 and 100 or painting drum includes providing the porous layer of gas vent.

According to some embodiments that can be combined with other embodiments described herein, gas vent as referred to herein can With the cross sectional dimensions between about 0.1mm and about 1mm.Cross sectional dimensions can be measured as at curved substrate The minimum cross-section of gas vent.In some embodiments, the fluid conductivity of gas vent can typically range between about 0.001 Between liter/second and about 0.1 liter/second, more typically between about 0.009 liter/second and about 0.05 liter/second.In an embodiment party In formula, the fluid conductivity of gas vent can be about 0.01 liter/second.

It, can in air-flow provided on the direction towards substrate during the operation of depositing device according to some embodiments Gas bearing, especially waterpower or hot gas axis are generated between substrate and the curved substrate 401 of painting drum It holds.In some embodiments, the contact that gas bearing can also be expressed as between substrate and curved substrate A kind of thin or small gas backing outside position.It is understood that the curved substrate with painting drum contacts and in base Substrate between plate and curved substrate with gas bearing can be contacted in some of curved substrate Position (for example, the dotted position provided by the roughness of curved substrate) contact, and can be in the position of contact There is gas bearing between setting.In contact position (such as, the curved substrate support table of substrate and curved substrate The region in face or point) between, gas bearing can be formed by the air-flow discharged from gas vent.According to can with it is described herein other Some embodiments of embodiment combination, the pressure in gas bearing typically range between about 0.1 millibar during deposition (mbar) between about 10 millibars, more typically between about 1 millibar and 10 millibars.

In some embodiments, the gas bearing between substrate and curved substrate is fillable because coating is rolled The curved substrate of cylinder and the roughness of substrate and existing gap, especially support in substrate and curved substrate Except contact position between surface.The thickness of gas bearing can correspond to the curved substrate branch for the painting drum being in contact with each other Support the roughness on surface and substrate.

Air-flow according to some embodiments, between substrate and curved substrate by being discharged from gas vent Form multiple gas bearing.

Gas bearing between substrate and curved substrate can improve the heat between painting drum and substrate and pass Conductance, such as to cool down or heat the substrate during the sedimentary stacked structure on substrate.For example, painting drum may include temperature Regulating system (is illustratively shown as humidity control system 430), such as cooling down or heating painting drum.By painting drum 400 gas bearing provided help to increase that the thermal conductivity between substrate and painting drum.According to some embodiment party described herein The temperature of flexible base board can be kept below the upper limit of restriction during deposition by formula.

Painting drum shown in Fig. 7 allows to solve the problems, such as some of other systems.For example, the risk of substrate damage can be reduced, Because substrate can be guided above the substrate of painting drum under lower substrate tension.Specifically, flexible base board Increased thermal conductivity between painting drum improves the cooling of substrate, and towards cooled base under high substrate tension Plate support surface pull substrate so as to obtain sufficient cooling efficiency can not be it is necessary.Higher deposition rate (coating speed) Lead to the relatively high heat load towards substrate.For using high deposition rate (for example, in order to accelerate coating process), substrate and coating Appropriate thermo-contact between roller is useful.

Painting drum 400 shown in Fig. 7 can for example advantageously serve in the depositing operation of two sides.It therefore, can be by painting drum To transmit the flexible base board being coated on the first major surface so as to second side of also coated substrates.In the coating of the second main surface Period, the first main surface having been coated with can be contacted with the curved substrate 401 of painting drum 400.Therefore, it may be present The risk for the first main surface of flexible base board having been coated with is damaged, such as when under excess tension in the curved base of painting drum Above plate support surface or when the surface of another roller guides flexible base board.It is flexible in coating according to some embodiments Before second main surface of substrate, make the coating in the first main surface of flexible base board (for example, via annealing unit 114) Film degassing.The surface of degassing can lead to compared with low heat transfer.Allow to increase according to the painting drum of implementations described herein soft Thermal conductivity between property substrate and curved substrate, to compensate the relatively low heat transfer of the coiled material of degassing, especially In the depositing operation of two sides.

Include driver 410 according to the painting drum 400 of implementations described herein, is applied for rotation during operation Cloth roller and the substrate contacted for movement with painting drum.

According to some embodiments that can be combined with other embodiments described herein, the gas of gas distributing system 405 Body can be selected from the group being made up of: any mixing of inert gas, argon gas, helium, nitrogen, hydrogen, silane and above-mentioned items Object.It in some embodiments, is that there is at least 0.01W/mK, more typically at least 0.1W/ from the gas that gas vent discharges MK and the even more typically at least gas of the thermal conductivity of 0.15W/mK.

The gas bearing formed when substrate and painting drum contact can be small enough to (i.e. comprising sufficiently small gas flow) Vacuum environment is not influenced generally, or can be small enough to the vacuum environment that do not interfere at least for coating process.For special Sensitive technique, or if being still to reduce the risk of pollution vacuum environment, some embodiments can have further feature with Just actively prevent vacuum environment contaminated.

For example, in some embodiments, Vacuum generating system (being not shown in Fig. 7) can generate system via vacuum is connected to The gas passage 407 of system provides suction.Vacuum generating system can be far from substrate and above mentioning towards the direction of Vacuum generating system For suction.Vacuum available generation system removes the gas that the hot bearing of waterpower is formed between substrate and painting drum discharged from gas source Body.For example, gas can be removed before substrate leaves substrate-guided region 403.The vacuum environment of painting drum is produced by vacuum Raw system protection.

Fig. 8 shows the painting drum 400 that can be used in depositing device according to implementations described herein.Painting drum 400 is similar with the painting drum illustrated in Fig. 7.Feature about Fig. 7 description can also be applied to the embodiment of Fig. 8 In.The embodiment of the painting drum 400 of Fig. 8 further comprises sealing element.In some embodiments, sealing element can be by multiple Sealing unit 413 (such as sealing unit made of at least partly elastic material) is made.According to some embodiments, sealing Unit 413 can be lip seal unit.This sealing element can prevent or limit the vacuum ring for being diffused into deposition chambers of gas bearing Gas flow in border.In some embodiments, sealing unit 413 reduces or prevents direction that can arrange the heavy of painting drum 400 The air-flow of the main volume of product chamber.

The circumferencial direction of painting drum 400 can be essentially perpendicular to and be essentially perpendicular to the radial direction of painting drum 400 Sealing unit 413 is arranged on the direction in direction.In some embodiments, it can be arranged in the width direction of painting drum 400 Sealing unit 413.

Sealing unit can provide in the second main surface of the substrate contacted with curved substrate 401 individually to be added The air pocket (pocket) of pressure.In some embodiments, each air pocket formed between two sealing units can provide individually Pressure.Pressure in each air pocket may depend on the rotation position of air pocket.

In some embodiments, curved substrate can be separated in the width direction of painting drum, such as So as to the substrate for making painting drum adapt to that there is different in width.For example, painting drum may be adapted to about 0.5m between about 2m and Substrate width between more typically about 1.2m and about 1.8m.Separate the adaptation distribution that section can provide gas vent, such as not With different densities, the various sizes of gas vent in curved substrate of gas vent, gas vent of number Deng.In some embodiments, gas source, which can be, can divide position difference section, so that the different sections for painting drum provide Gas (especially in the direction of the width).

In some embodiments that can be combined with other embodiments described herein, painting drum can have one or Multiple electronics Acetabula devices.Specifically, one or more electronics Acetabula devices can provide for making substrate and painting drum The attraction that curved substrate is kept in contact.According to some embodiments, curved substrate it is each Section may include individual electronics sucker watt (tile).Individual electronics sucker watt can provide attraction appropriate, example to substrate Such as depend on the rotation position of painting drum.In some embodiments, each electronics sucker watt is controlled so as to according to substrate-guided Section position in or beyond region operates.According to some embodiments, it can control electronics sucker watt so as to according to corresponding area Section is operated relative to the position of the gas source 408 of gas distributing system 405.In some embodiments, painting drum may include Sensor and control unit are with the rotation position for sensing painting drum, and the rotation position of especially each section.Control Unit can control the operation of electronics sucker according to the data sensed.

According to some embodiments, painting drum may include the back structure for being used to support porous layer, and wherein porous layer can Form the concave substrate support surface 401 of contact substrate.Porous layer can be further provided for for the gas towards substrate release gas Body outlet 404.In some embodiments, back structure may include support rod and be arranged in releasing between support rod for gas The region put.Specifically, support rod and the region for gas release can be arranged in a circumferential direction in an alternating fashion.

According to some embodiments, porous layer can be made of porous materials, to be provided by the porosity of material multiple Gas vent.Porous material is applicable to discharge gas, especially He, Ar and/or H towards substrate₂.For example, porous material can With the density typically between about 60% and about 85%, more typically between about 65% and about 75%.In an example In, porous material has about 70% density.In some embodiments, porous material can be the material of sintering.For example, more Porous materials can be metal, such as stainless steel, sintered stainless steel, aluminium, chromium or metal alloy.

According to some embodiments, (for example, polishing etc.) porous material can be handled, to influence porous material and operation phase Between the roughness of curved substrate that is contacted with flexible base board.It can combined with other embodiments described herein Some embodiments in, can with the roughness lower than porous material the applying porous material of material layer.For example, gold can be used Belong to layer (such as, Cr layers) applying porous material.According to some embodiments, coating layer on porous layer or even porous layer itself There can be the additional gas outlet by the processing such as drilling, being cut by laser into layer.

According to some embodiments described herein, painting drum 400 can be the painting drum of controlled temperature.Temperature by The painting drum of control allows cooling substrate.For example, painting drum may include humidity control system (such as, humidity control system 430).The humidity control system 430 of painting drum may include the system in the channel being placed in painting drum, for cooling down or adding Thermal coating roller.The channel of the humidity control system of reliable near surface placement painting drum.Term " close " typically refers to logical The surface orientation side in road is less than at a distance from 5cm between curved substrate 401, more typically less than 2.5cm, and Even more typically it is less than 1cm.Channel is usually adapted to receive cooling fluid.

According to some embodiments that can be combined with other embodiments described herein, controllable painting drum is maintained at At a temperature of one, the temperature is typically ranged between about -30 DEG C and about+170 DEG C, more typically between about -20 DEG C and about+150 Between DEG C, and even more typically between about -20 DEG C and about+80 DEG C.Specifically, for being up to 100 DEG C of temperature, Even more especially for the temperature for being lower than room temperature, cooling fluid is usually water-ethylene glycol mixture.In other application, especially It is those of to be heated in application on surface, cooling fluid is usually heat-transfer oil.Used cooling fluid is suitable for typically Up to 400 DEG C, even more typically up to 300 DEG C of temperature.Workable heat-transfer oil is in petroleum (for example, cycloalkanes or paraffin) On the basis of be made.Alternatively, heat-transfer oil can be (for example, isomery nanocrystal composition) of synthesis.

According to some embodiments that can be combined with other embodiments described herein, painting drum 400 can be typically With the width within the scope of 0.1m to 4m, more typically from 0.5 to 2m, for example, about 1.4m.The diameter of painting drum can be greater than 1m (for example, between 1.5m and 2.5m).

Such as schematic depiction in Fig. 5, first group of multiple sedimentation unit 121 may include three or more and 12 or less The first sedimentation unit, the first sedimentation unit may be arranged on the circumferencial direction of the first painting drum 122.Similarly, one In a little embodiments, second group of multiple sedimentation unit 141 may include three or more and 12 less second sedimentation units, the Two sedimentation units may be arranged on the circumferencial direction of the second painting drum 142.For example, can in the first deposition chambers 120 cloth Six the first sedimentation units are set, and/or can arrange six the second sedimentation units in the second deposition chambers 140.

In some embodiments, sedimentation unit can be covered each by the lower half of corresponding painting drum.In other words, soft Property substrate 10 can be in contact in the top angular zone of the curved surface of painting drum with painting drum, can by make rotation By sedimentation unit, (sedimentation unit can be provided partly or wholly in the lower half of the circumference of painting drum curved surface In) flexible base board 10 is guided downwards, and flexible base board 10 can be lifted to again up curved substrate The second top angular zone after leave curved substrate.It in some embodiments, can be around corresponding painting drum Sedimentation unit is arranged in a manner of substantial symmetry.In other words, sedimentation unit around corresponding painting drum arrangement relative to The vertically symmetrical plane of the rotary shaft of crosscutting corresponding painting drum can be substantial symmetry.For example, can be vertically symmetrical Three sedimentation units in a total of six sedimentation unit are arranged on first side of plane, and can be in second side of vertically symmetrical plane Remaining three sedimentation units of upper arrangement.

It, can be single in two adjacent depositions in some embodiments that can be combined with other embodiments described herein Gas separation unit 510 is provided between member 512, so as to reduce respectively from a sedimentation unit to other sedimentation units (for example, During operation arrive adjacent sedimentation unit) process gas flow.The adjacent deposition list of schematic depiction in Fig. 5 and Fig. 9 Gas separation unit 510 between member 512.

It can configure gas separation unit 510 to gas separation wall, the gas separation wall is by corresponding deposition chambers Internal capacity is divided into multiple individual compartments, wherein each compartment may include a sedimentation unit.It can be respectively two adjacent A sedimentation unit 512 is arranged between gas separation unit 510.In other words, it can be separated respectively by gas separation unit 510 Sedimentation unit.It, can be heavy independently of other are accommodated according to some embodiments that can be combined with other embodiments described herein Other compartments of product unit evacuate each of the compartment for accommodating corresponding sedimentation unit, so that can optionally be arranged each The sedimentary condition of sedimentation unit 512.Different materials, the deposited adjacent can be deposited on flexible substrates by deposited adjacent unit Unit can be separated by gas separation unit 510.

According to some embodiments, gas separation unit 510 may include gas separation wall, the gas separation wall prevent or Reduce the main volume that gas flows or enter into deposition chambers from a sedimentation unit towards deposited adjacent unit.Gas separation unit 510 can be configured for adjusting the width of the slit 511 between corresponding gas separation unit and corresponding painting drum.According to Some embodiments, gas separation unit 510 may include actuator, and the actuator is configured for adjusting the width of slit 511 Degree.In order to reduce the air-flow between deposited adjacent unit and in order to increase the gas separation factor between deposited adjacent unit, The width of slit 511 between gas separation unit and painting drum can be it is small, such as 1cm or smaller, especially 5mm or It is smaller, more particularly 2mm or smaller.In some embodiments, (i.e. two adjacent for the length of the slit 511 on circumferencial direction The length of corresponding gas split tunnel between deposition compartment) it can be 1cm or bigger, especially 5cm or bigger, or even 10cm or bigger.In some embodiments, the length of slit can be even about 14cm respectively.It can be adjacent heavy by increasing by two The length of slit 511 between product unit improves the gas separation factor between two deposited adjacent units.It can provide 1/100 Or better gas separation factor.During deposition, the mean-free-path length of the gas molecule in sedimentation unit can be in number Centimetre magnitude.Therefore, by provide between deposited adjacent unit with 5mm slit width below and 10cm or more The slit 511 of length, can propagate almost without any gas molecule between sedimentation unit.

In some embodiments that can be combined with other embodiments described herein, first group of multiple sedimentation unit 121 at least one first sedimentation unit can be sputtering sedimentation unit.Similarly, second group of multiple sedimentation unit 141 be extremely Few second sedimentation unit can be sputtering sedimentation unit.In some embodiments, first group of multiple sedimentation unit 121 Each sedimentation unit of each sedimentation unit and/or second group of multiple sedimentation unit 141 is sputtering sedimentation unit.Wherein, one Or multiple sputtering sedimentation units can be configured for DC sputtering, AC is sputtered, RF (radio frequency) sputtering, MF (intermediate frequency) is sputtered, pulse is splashed It penetrates, pulse DC sputtering, the combination of magnetron sputtering, reactive sputtering or above-mentioned items.DC sputtering source is suitably adapted for using conduction material Expect that (for example, with metal (such as, copper)) is coated with flexible base board.Alternating current (AC) sputtering source is (for example, RF sputtering source or MF sputtering Source) it is suitably adapted for being coated with flexible base board with conductive material or with insulating materials (for example, with dielectric material, semiconductor or metal).

However, depositing device described herein is not limited to sputtering sedimentation, and other can be used in some embodiments Sedimentation unit.For example, in some embodiments, can be used CVD deposition unit, hydatogenesis unit, PECVD sedimentation unit or Other sedimentation units.Specifically, due to the modularized design of depositing device 100, it is possible to by radially being moved from deposition chambers The second sedimentation unit is used to replace first except the first sedimentation unit and by the way that another sedimentation unit to be loaded into deposition chambers Sedimentation unit.For this reason, deposition chambers can be equipped with sealing cover, can be opened and closed sealing cover to replace one or more Sedimentation unit.

It, can be (for example, in the first deposit cavity in some embodiments that can be combined with other embodiments described herein In room) at least one AC sputtering source is provided, for depositing non-conducting material on flexible substrates.In some embodiments, may be used (for example, in both first deposition chambers and the second deposition chambers) provide at least one DC sputtering source, in flexible base board Upper deposition conductive material.

In some embodiments, at least one first sedimentation unit 301 of first group of multiple sedimentation unit 121 can be AC sputtering source.In embodiment shown in Fig. 9, the first two sedimentation unit of first group of multiple sedimentation unit is AC sputtering source (for example, the dual-target sputtering source being described in more below).AC sputtering source deposition of dielectric materials can be used (such as, on flexible substrates Silica).For example, two adjacent sedimentation units (for example, first sedimentation unit 301) can be configured in reactive sputtering work In skill in the first main surface of flexible base board Direct precipitation silicon oxide layer.It can be by using next to each other two or more AC sputtering source increases the thickness of silicon oxide layer obtained by (for example, doubling).

The remaining sedimentation unit of first group of multiple sedimentation unit 121 can be DC sputtering source.Embodiment shown in Fig. 9 In, at least one second deposition for being arranged in first group of multiple sedimentation unit at least one 301 downstream of the first sedimentation unit is single Member 302 can be DC sputtering source (for example, being configured for deposition ITO layer).In other embodiments, it is possible to provide be configured to use In two or more DC sputtering sources of deposition ITO layer.It in some embodiments, can be by least one the first sedimentation unit The deposited on top ITO layer of the silicon oxide layer of 301 depositions.

In addition, in some embodiments, can by be arranged at least one 302 downstream of the second sedimentation unit at least one Third sedimentation unit 303 (for example, three third sedimentation units) is configured to DC sputtering unit (for example, for depositing the first metal Layer (for example, layers of copper)).Several different metal layers or the single gold of deposition can be deposited by least one third sedimentation unit 303 Belong to a thick-layer of (for example, Cu).

It in some embodiments, can be in the deposited on top of the ITO layer deposited by least one second sedimentation unit 302 The first metal layer.

Therefore, can in the first main surface of the flexible base board 10 in the first deposition chambers sedimentary stacked structure, such as Comprising depositing silicon oxide layer, ITO layer and Cu layer on top of each other.

In some embodiments, then other layer can be deposited in the second deposition chambers 140.For example, can be by second At least one the 4th sedimentation unit 304 of the multiple sedimentation units 141 of group is configured to DC sputtering unit, such as in the first metal The deposited on top second metal layer (for example, the 2nd Cu layers) of layer.In some embodiments, second group of multiple sedimentation unit All sedimentation units in 141 can be DC sputtering unit, be respectively provided for deposited metal layer.In addition, in some embodiment party In formula, identical metal (for example, copper) can be deposited.Therefore, single thick metal layers can be deposited by second group of multiple sedimentation unit 141 (for example, thick copper layer).

Thus, for example in embodiment shown in Fig. 5, it is possible to provide 12 sedimentation units in total.The first two sedimentation unit (at least one the first sedimentation unit 301) is configured for silicon oxide layer deposited, subsequent sedimentation unit (at least one second deposition Unit 302) it is configured for deposition ITO layer, and (third sedimentation unit 303 and the 4th deposition are single for remaining nine sedimentation units 304) member can be configured for deposition thick copper layer.It should be understood that described arrangement is only exemplary arrangement, and optionally to heavy The total number of product unit, the type of sedimentation unit, the order of sedimentation unit and by the modification of material of sedimentation unit deposition it is It is possible.

It can deposit on flexible substrates including SiO₂The layer heap stack structure of layer, ITO layer and layers of copper.Flexible base board can be tool There is the poly- of index matching (IM) layer in a main surface for being located at flexible base board or in two main surfaces of flexible base board Polymer substrates.For example, flexible base board can be the COP substrate in two main surfaces of flexible base board with IM layers.

After the first main surface with layer heap stack structure coating flexible base board, side can be applied again in the orientation of reversion The substrate of cloth is loaded into first volume barrel chamber room.Then, by being conveyed through flexible base board for the second time in the orientation of reversion Depositing device 100, it is also possible to corresponding layer heap stack structure or the second main table with different layer heap stack structure coating flexible base boards Face.Therefore, the substrate of two sides coating can be manufactured, and can reduce or avoid completely winding defect.

In Fig. 9 of the enlarged view for the part for showing deposition chambers (for example, first deposition chambers 120), in deposit cavity First group of multiple sedimentation unit (i.e. six sedimentation units) is arranged in room.Gas separation is provided between deposited adjacent unit respectively Unit 510.The slit 511 that flexible base board can be conveyed through between gas separation unit 510 and painting drum 400.It is configurable Sedimentation unit is so that towards the thermic load of flexible base board offer during can reducing or minimizing deposition.

AC sputtering source 610 can be configured by least one the first sedimentation unit 301, it can be by least one the second sedimentation unit 302 are configured to DC sputtering source 612, and can configure DC sputtering source 612 at least one third sedimentation unit 303.

Figure 10 illustrates in greater detail AC sputtering source 610, and Figure 11 illustrates in greater detail DC sputtering source 612.

AC sputtering source 610 shown in Figure 11 may include two sputtering equipments, i.e. the first sputtering equipment 701 and the second sputtering dress Set 702.In the following description, by " sputtering equipment " be interpreted as include target 703 device, the target include to be deposited on flexible base Material on plate.Target can be made of material to be deposited or at least be made of the component of material to be deposited.In some embodiment party In formula, sputtering equipment may include target 703, and the target 703 is configured with the rotatable target of rotary shaft.In some embodiments In, sputtering equipment may include penstock 704, can arrange target 703 in the penstock 704.In some embodiments, it is possible to provide For generating the magnet arrangement (for example, in rotatable target) in magnetic field during the operation of sputtering equipment.It is provided in rotatable target In the case where magnet is arranged, sputtering equipment can be described as sputter magnetron.In some embodiments, it can be provided in sputtering equipment Cooling duct, to cool down the part of sputtering equipment or sputtering equipment.In some embodiments, sputtering equipment can be adapted to It is connected to the supporting element (for example, may be provided in the flange at one end of sputtering equipment) of deposition chambers.It, can according to some embodiments Sputtering equipment is operated as cathode or as anode.For example, 701 conduct of the first sputtering equipment can be operated at a time point Cathode, and the second sputtering equipment 702 can be operated as anode.At later point, when in the first sputtering equipment 701 and second When applying alternating current between sputtering equipment 702, the first sputtering equipment 701 may act as anode and the second sputtering equipment 702 can fill Work as cathode.

In some embodiments, target 703 may include silicon or be made of silicon.

Term " double sputtering equipments " refers to a pair of of sputtering equipment, such as the first sputtering equipment 701 and the second sputtering equipment 702.First sputtering equipment and the second sputtering equipment can form double sputtering equipments pair.For example, can be in same deposition technique simultaneously Flexible base board is coated with using two sputtering equipments of double sputtering equipments pair.Double sputtering equipments can be designed in a similar way. For example, double sputtering equipments can provide identical coating material, can generally be of the same size and substantially the same shape. It can be adjacent to the double sputtering equipments of arrangement each other to form the sputtering source that can be arranged in the deposition chamber.According to can with it is described herein Other embodiments combination some embodiments, two sputtering equipments of double sputtering equipments include by identical material (for example, Silicon) made of target.

As, as it can be seen that the first sputtering equipment 701 has first axle, first axle can be the first sputtering equipment in Fig. 9 and Figure 10 701 rotary shaft.Second sputtering equipment 702 has the second axis, and the second axis can be the rotary shaft of the second sputtering equipment 702.It splashes Injection device provides material on flexible substrates to be deposited.For reactive deposition technique, it is eventually deposited on flexible base board Material can extraly include the compound of processing gas.It will be understood, therefore, that the target 703 being made of such as silicon or doped silicon Including silicon materials, and illustratively, oxygen can be used as processing gas addition with final cvd silicon oxide.

According to Fig. 9 it is exemplary shown in embodiment, guide flexible base board by double sputtering equipments by painting drum 400. Wherein, by flexible base board in the second of first position 705 and flexible base board on painting drum 400 on painting drum 400 706 are set to limit coat window.Coat window (i.e. part of the flexible base board between first position 705 and the second position 706) The region for defining substrate, can deposition materials on the region of the substrate.As shown in Figure 9, it is released from the first sputtering equipment 701 The particle for the deposition materials put and from the particle of the deposition materials discharged in the second sputtering equipment 702 reach coat window in it is soft Property substrate.

It can be adapted to sputtering source 610, in order to provide first sputtering equipment of 300mm or smaller, particularly 200mm or smaller The distance of second axis of 701 first axle to the second sputtering equipment 702.Typically, the first axle of the first sputtering equipment 701 and the The distance of second axis of two sputtering equipments 702 can between 150mm and 200mm, more typically between 170mm and 185mm it Between, such as 180mm.

According to some embodiments, can be cylindrical sputtering equipment the first sputtering equipment and the second sputtering equipment it is outer Diameter can be typically in the range of 90mm and 120mm, more typically between about 100mm and about 110mm.

In some embodiments, the first sputtering equipment 701 can be equipped with the first magnet arrangement and the second sputtering equipment 702 can arrange equipped with the second magnet.Magnet arrangement can be the magnetic yoke for being configured for generating magnetic field to improve deposition efficiency. According to some embodiments, magnet arrangement can tilt toward each other.The magnet arranged in a manner of inclined toward each other is arranged in It may imply that the magnetic field for guiding generated by magnet arrangement toward each other in this context.

According to some embodiments, above-mentioned sputtering equipment can be used for non-conductive and/or conductive material depositing to flexible base On plate.For example, sputtering source 610 can provide target material, such as silicon, titanium, aluminium.With the gas for introducing one or more process gas Body entrance together, can (for example, pass through reactive sputtering technique) deposition materials (such as, silica, nitridation on flexible substrates Silicon, titanium oxide, aluminium oxide etc.).Specifically, AC sputtering source 610 can be used for reactive sputtering technique (such as, SiO₂Reaction Property sputtering).Therefore, according to some embodiments that can be combined with other embodiments described herein, depositing device can be equipped with In addition equipment, such as gas access for process gas (such as, oxygen or nitrogen).

According to some embodiments, AC sputtering source 610 can be used in intermediate frequency (such as, in about 10kHz between about 50kHz Frequency range in) under operate two sputtering equipments technique in.In one embodiment, AC sputtering source 610 can be adapted For one in two sputtering equipments to be used as anode and corresponding another is used as cathode.In general, adaptation AC sputtering Source 610 is so that can operation of the alternating sputtering device as anode and cathode.This means that being used as the sputtering equipment of anode before It can be used as cathode, and the sputtering equipment as cathode is operable as anode before, corresponding to applied alive frequency.

According to some embodiments, AC sputtering source 610 can be configured for reactive deposition technique.It can provide for reacting The closed-loop control of property depositing operation.Reactive deposition technique can be used for the deposition of silicon oxide layer, wherein from sputtering equipment sputtered silicon, And process gas (such as, oxygen) is provided from gas access.Low process gas flow and high electric field are being applied to sputtering equipment In the case where, technique is carried out under metal mode.In the case where higher process gas flow, depositing operation can be transformed into oxygen Gas mode can deposit transparent silicon oxide layer under oxygen mode.Therefore, the method for controlling reactive deposition technique is can be controlled in The depositing operation provided under transition mode, in the transition mode can be with quite high rate depositing transparent layers (for example, oxidation Silicon).

In some embodiments, can be by providing voltage supply control depositing operation, the voltage supply can be by making The voltage-controlled system of electricity consumption keeps sputtering equipment in the transition mode.It wherein, can be in the case where voltage be controlled (for example, being provided to sputtering equipment Fixed voltage) sputtering equipment is operationally connected to the power supply for powering to sputtering equipment.However, working as to supplies voltages control When processed, voltage supply causes voltage controlled, and power is not kept constant, because power supply can only keep a parameter to fix.Such as Fruit is controlled using voltage, and power and therefore deposition rate can change with used process gas, and this can not sometimes connect It receives.

Therefore, in addition to the control of the voltage of power supply, it can be used as closed control loop and power control be provided, wherein monitoring is practical Power, and the flow velocity of process gas is controlled to keep power substantial constant.It can provide closed-loop control, to provide substantially permanent Fixed deposition rate.Therefore, in some embodiments, reactive deposition technique is that voltage is controlled and establish oxygen flow tune Section, this keeps constant sputtering power.

In some embodiments, process gas may include oxygen, argon gas, nitrogen, hydrogen, H₂O and N₂At least one in O Kind.Typically, it can be used as and provide oxygen for the reactant gas of reactive deposition technique.In the reactive process based on oxygen Process gas in a small amount of nitrogen is provided can be beneficial to stablize plasma generated.

According to exemplary embodiment, sputtering equipment can be provided to as power supply to supplies voltages set-point value The upper limit of voltage.The voltage of set-point value fixed power source can be passed through.Heating region may depend on by the power that power supply provides In reactant gas flow.For example, power may depend on oxygen flow for silicon oxide deposition technique, it is limited to simultaneously Voltage set point value.The controller for providing closed-loop control controls process gas stream according to the actual power for being supplied to sputtering equipment Amount.

The flow rate for the process gas being introduced into heating region can be defeated with the power supply for being supplied to sputtering equipment Power is proportional out.Controller can control flow rate of gas, so that can be used as what the signal from power supply to controller provided Actual power value is held substantially constant.

Therefore, according to implementations described herein, reactive deposition technique can be kept in the transition mode, and can At least one first sedimentation unit 301 by can be configured to AC sputtering source 610 deposits the non-of high uniformity on flexible substrates Conductive layer (such as, silicon oxide layer).

Figure 11 shows the enlarged diagram that can be used for some DC sputtering sources 612 in implementations described herein.? In some embodiments, DC sputtering source 612 is configured by least one second sedimentation unit 302 described in Fig. 9, and/or At least one third sedimentation unit 303 is configured DC sputtering source 612 by person.

DC sputtering source 612 may include at least one cathode 613, at least one described cathode 613 includes target 614 to be used for Material to be deposited is provided on flexible base board.At least one cathode 613 can be rotatable cathode, especially substantially cylinder-shaped Cathode, the rotatable cathode can rotate around rotary shaft.

Target 614 can be made of material to be deposited.For example, target 614 can be metallic target (such as, copper target or aluminium target).It can The magnet assembly 615 for constraining plasma generated is arranged in rotatable cathode.

In some embodiments, DC sputtering source 612 may include single cathode, as shown schematically in Figure 11.Some In embodiment, conductive surface (for example, wall surface of deposition chambers) may act as anode.It in other embodiments, can be immediately Cathode provides individual anode (such as, the anode of the shape with bar), so that can be at least one cathode 613 and individually positive Electric field is established between pole.Power supply be can provide for applying electric field between at least one cathode 613 and anode.DC electricity can be applied , this allows deposition conductive material (such as, metal).In some embodiments, the field DC of pulse is applied at least one A cathode 613.In some embodiments, DC sputtering source 612 may include more than one cathode (for example, two or more are negative The array of pole).

In some embodiments that can be combined with other embodiments described herein, depositing device 100 can be used for making Transparent main body is made for using in touch panel.The first hyaline layer stacking can be deposited in the first main surface of flexible base board Structure, wherein the first hyaline layer stacked structure may include one or more silicon-containing layers (for example, silicon oxide layer).It can be transparent first The deposited on top transparent conductive film (for example, ito film) of layer heap stack structure.Ito film can be provided with predetermined pattern.In some realities It applies in mode, it is possible to provide monitoring device during deposition for measuring in the first hyaline layer stacked structure and transparent conductive film The optical property (for example, transmissivity and/or reflectivity) of at least one.In some embodiments, it can stack and tie in hyaline layer The deposited on top metal layer of structure.

Then, in some embodiments, identical layer heap stack structure or not can be deposited in the second main surface of substrate Same layer heap stack structure, second main surface is the opposite main surface of flexible base board.It can be by being incited somebody to action in the orientation of reversion The surface of side coating is loaded into depositing device and by being passed up flexible base board by offer the in taking for reversion Sedimentation unit in one deposition chambers and the second deposition chambers carrys out the second main surface of coated substrates, so that identical layer can be used Stacked structure is coated with the second main surface with different layer heap stack structures.

Due to the flexible base board transmission controlled along the tension of the substrate transmitting path of partial concavity and Component convex, two sides are applied The flexible base board of cloth can have low defect number.Furthermore, it is possible to provide the flexible base that the two sides with reduced defect counts are coated with Plate especially cleans, because of two main surfaces of cleanable substrate especially in flexible base board before deposition and/or after deposition Respective major surface be in contact under high drawing force with roller surface before clean.

Figure 12 is the flow chart of the method for diagram layer heap stack structure coating flexible base board.It can be used according to described herein The depositing device 100 of any one of embodiment carries out the method.Wherein, by flexible base board along Component convex and part The substrate transmitting path of spill is transmitted to the winding reel in volume Two barrel chamber room from the holder in first volume barrel chamber room.Institute The method of stating includes: to unwind flexible base board from the holder provided in first volume barrel chamber room in box 910；Then, in side In frame 920, at least one first layer of sedimentary stacked structure in the first main surface of flexible base board, while by providing The first painting drum in one deposition chambers guides flexible base board；Then, it in box 930, sinks at least one first layer At least one second layer of lamination stacked structure, at the same it is flexible by providing the guidance of the second painting drum in the second deposition chambers Substrate；Then, in box 940, flexible base board is wound on the winding reel in volume Two barrel chamber room in offer after deposit.

Hereafter, the second main surface of second layer stacked structure coating flexible base board can be also optionally used by following steps: In box 950, winding reel is removed from volume Two barrel chamber room and (on winding reel is wound with flexible base board (flexible base board can With the first main surface having been coated with), and in removed winding reel replacement first volume barrel chamber room in the orientation of reversion Holder；Then, in box 960, second layer stacked structure is deposited on the second major surface, while guiding flexible base board Across the first deposition chambers and the second deposition chambers；Then, it in box 970, is providing in volume Two barrel chamber room in addition Winding reel on wind flexible base board.

According to other aspect described herein, a kind of depositing device 100 being aligned for being coated with flexible base board 10 is described Method.Specifically, it can be aligned and be described herein before using depositing device with sedimentary stacked structure on flexible substrates Any one of embodiment depositing device.Depositing device 100 may include roll assembly, the roll assembly be configured to by Flexible base board is along the substrate transmitting path of Component convex and partial concavity from the holder being arranged in first volume barrel chamber room It is transmitted to the winding reel being arranged in volume Two barrel chamber room 150.

Alignment methods can include: at least one deflector roll with the first rotary shaft in roll assembly is defined as reference roller； The rotary shaft of two or more remaining deflector rolls of roll assembly is directed at the first rotary shaft relative to reference roller to be parallel to First rotary shaft of reference roller extends.

When the roll shaft of each of remaining deflector roll deflector roll is aligned relative to the first rotary shaft of reference roller, all deflector rolls Roll shaft it is not parallel only with respect to reference roller and parallel relative to each other.It can provide the roll assembly with the alignment of excellent roller, and And it can avoid acting on the diagonal pulling force on flexible base board.

In some embodiments, the roll shaft of deflector roll can have 1m or bigger and 2m or smaller along the length of rotary shaft, Particularly from about 1.5m.Depositing device can have more than 20 deflector rolls and less than 60 deflector rolls, for example, about 30 deflector rolls, the deflector roll It can be respectively relative to reference roller alignment, so as to substantially parallel with reference roller, and it is therefore parallel to each other.

Although above with respect to embodiment, can be designed in the case where not departing from base region other and further Embodiment, and the range is determined by the appended claims.

Claims

1. a kind of depositing device (100) with layer heap stack structure coating flexible base board (10), includes:

First volume barrel chamber room (110) is configured for accommodating holder (112), and the holder (112) is for providing institute State flexible base board (10)；

First deposition chambers (120) are arranged in first volume barrel chamber room (110) downstream and include the first painting drum (122), First painting drum (122) is configured for guiding the flexible base board by first group of multiple sedimentation unit (121)；

Second deposition chambers (140) are arranged in the first deposition chambers (120) downstream and include the second painting drum (142), Second painting drum (142) is configured for guiding the flexible base board by second group of multiple sedimentation unit (141)；

Volume Two barrel chamber room (150) is arranged in the second deposition chambers (140) downstream and is configured for accommodating winding reel (152), the winding reel (152) is for winding the flexible base board (10) on the winding reel (152) after deposit； With

Roll assembly is configured to the flexible base board along the substrate transmitting path of Component convex and partial concavity from described A roll of barrel chamber room is transmitted to volume Two barrel chamber room.

2. depositing device as described in claim 1 further includes cleaning chamber (170), cleaning chamber (170) arrangement In first volume barrel chamber room (110) downstream and in the first deposition chambers (120) upstream, wherein in the cleaning chamber (170) at least one cleaning device for cleaning the flexible base board (10) is provided in.

3. depositing device as claimed in claim 1 or 2, wherein in the first painting drum upstream, especially in the cleaning chamber In room (170), the first cleaning device (171) of the first main surface for cleaning the flexible base board (10) is provided and for clear The second cleaning device (172) of second main surface of the clean flexible base board (10).

4. depositing device as claimed any one in claims 1 to 3 further includes and is placed in first group of multiple deposition Cleaning device (173) and described second group multiple sedimentation unit (141) downstream is placed in after first coating in unit (121) downstream The second coating after at least one of cleaning device (174).

5. the depositing device as described in any one of claim 2 to 4, wherein at least one described cleaning device includes first viscous Property volume (175) and second viscosity roll up (176), wherein it is described second viscosity volume (176) viscosity be greater than it is described first viscosity roll up (175) viscosity.

6. the depositing device as described in any one of claims 1 to 5 further includes connection chamber (130), the connecting cavity Room (130) is arranged in the downstream of first deposition chambers (120) and in the upstream of second deposition chambers (140).

7. further including annealing unit (114) such as depositing device described in any one of claims 1 to 6, the annealing is single First (114) particularly comprise can at least one of heating roller (115) and pharoid (116), the annealing unit (114) It is configured for heating the flexible base board, the annealing at the position of described first group multiple sedimentation unit (121) upstreams Unit (114) is specifically arranged in first volume barrel chamber room (110).

8. the depositing device as described in any one of claims 1 to 7 further includes flaw detection apparatus (154) to be used for The defect of the flexible base board is detected after deposit, and the flaw detection apparatus (154) particularly comprises light source (155) He Guangjian It surveys device (156), particularly wherein the flaw detection apparatus (154) is arranged in volume Two barrel chamber room (150).

9. further including such as depositing device described in any item of the claim 1 to 8 and being arranged in first group of multiple deposition Unit (121) downstream and in the first monitoring device (161) of described second group multiple sedimentation unit (141) upstream and it is arranged in institute At least one of second monitoring device (162) in second group of multiple sedimentation unit (141) downstream is stated, wherein first monitoring Device (161) and/or second monitoring device (162) are configured for measurement and are deposited on the flexible base board (10) extremely The electricity and/or optical property of a few layer.

10. depositing device as claimed in any one of claims 1-9 wherein, further includes: at least one tonometry roller (184,185,186,187,188) are configured for measuring the tension of the flexible base board；With at least one draw roll (181, 183) it, is configured for stretching the flexible base board, wherein according to as measured by least one described tonometry roller The tension of flexible base board controls at least one described draw roll.

11. the depositing device as described in any one of claims 1 to 10, wherein first group of multiple sedimentation unit (121) It is sputtering sedimentation unit respectively with described second group multiple sedimentation units (141), particularly wherein first group of multiple deposition Unit (121) and second group of multiple sedimentation unit (141) all include at least one DC sputtering source (612), the DC sputtering Source (612) is configured for depositing conductive material on the flexible base board (10) respectively, and/or wherein described first group Multiple sedimentation units include at least one AC sputtering source (610), and the AC sputtering source (610) is used in the flexible base board (10) Upper deposition non-conducting material.

12. depositing device as claimed in claim 11, wherein at least one of first group of multiple sedimentation unit is first heavy Product unit (301) is configured for the silicon oxide layer deposited on the flexible base board, is arranged at least one described first deposition At least one second sedimentation unit (302) of first group of multiple sedimentation unit in unit downstream is configured in the oxygen ITO layer is deposited on SiClx layer, is arranged in first group of multiple deposition at least one described the second sedimentation unit (302) downstream At least one third sedimentation unit (303) of unit is configured for depositing the first metal layer in the ITO layer, and/or At least one the 4th sedimentation unit (304) of second group of multiple sedimentation unit (141) described in person is configured for described first Depositing second metal layer on metal layer.

13. the depositing device as described in any one of claims 1 to 12, wherein first painting drum (122) and described At least one of second painting drum (142) includes:

For contacting the curved substrate (401) of the flexible base board (10), wherein the curved substrate support Surface is can to rotate around rotary shaft (A) and include substrate-guided region (403)；

One group of gas vent (404) is placed in the curved substrate (401) and is adapted to release gas Stream；With

Gas distributing system (405), for the air-flow to be selectively supplied to the first subgroup of the gas vent (404) And for selectively preventing gas from flowing to the second subgroup of the gas vent (404), wherein the gas vent First subgroup includes at least one gas vent in the substrate-guided region (403), and the gas vent Second subgroup includes at least one gas vent outside the substrate-guided region.

14. a kind of method with layer heap stack structure coating flexible base board (10), particularly using such as any preceding claims institute The depositing device (100) stated, wherein by the flexible base board along the substrate transmitting path of Component convex and partial concavity from A roll of barrel chamber room (110) is transmitted to volume Two barrel chamber room (150), which comprises

The flexible base board is unwound from holder (112), the holder (112) is located at first volume barrel chamber room (110) in；

At least one first layer of the layer heap stack structure is deposited in the first main surface of the flexible base board (10), is led to simultaneously The first painting drum (122) provided in the first deposition chambers (120) is provided and guides the flexible base board；

At least one second layer of the layer heap stack structure is deposited at least one described first layer, while by heavy second The second painting drum (142) provided in product chamber (140) guides the flexible base board；With

The flexible base board is wound in winding reel (152) after deposit, the winding reel (152) is located at the volume Two In barrel chamber room (150).

15. method as claimed in claim 14 is then coated with the flexible base by following steps second layer stacked structure Second main surface of plate (10):

The winding reel (152) is removed from volume Two barrel chamber room (150), the winding reel (152), which has, to be wrapped in The flexible base board on winding reel (152), and replaced in the orientation of reversion with the winding reel removed Change the holder in first volume barrel chamber room (110)；

The second layer stacked structure is deposited in second main surface, while guiding the flexible base board by described first Deposition chambers and second deposition chambers；With

The flexible base board is wound on the other winding reel in volume Two barrel chamber room (150) is provided.

16. a kind of method of alignment for being coated with the depositing device (100) of flexible base board (10), is especially in alignment with as any aforementioned The method of depositing device described in claim, wherein the depositing device (100) includes roll assembly, the roll assembly is configured For the flexible base board to be transmitted along the substrate transmitting path of Component convex and partial concavity from first volume barrel chamber room (110) To volume Two barrel chamber room (150), which comprises

At least one deflector roll of the roll assembly is defined as reference roller；With

The first rotary shaft relative to the reference roller is directed at the rotary shaft of two or more remaining deflector rolls of the roll assembly, So that first rotary shaft that the rotary shaft of the two or more residue deflector rolls is parallel to the reference roller extends.