JP5449781B2 - 並列伝導層構造を持つ金属−絶縁体転移素子 - Google Patents
並列伝導層構造を持つ金属−絶縁体転移素子 Download PDFInfo
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- JP5449781B2 JP5449781B2 JP2008553156A JP2008553156A JP5449781B2 JP 5449781 B2 JP5449781 B2 JP 5449781B2 JP 2008553156 A JP2008553156 A JP 2008553156A JP 2008553156 A JP2008553156 A JP 2008553156A JP 5449781 B2 JP5449781 B2 JP 5449781B2
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- 239000012212 insulator Substances 0.000 title claims description 35
- 230000007704 transition Effects 0.000 title claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052746 lanthanum Inorganic materials 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 5
- 229910052684 Cerium Inorganic materials 0.000 claims description 4
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 4
- 229910052691 Erbium Inorganic materials 0.000 claims description 4
- 229910052693 Europium Inorganic materials 0.000 claims description 4
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 4
- 229910052689 Holmium Inorganic materials 0.000 claims description 4
- 229910052765 Lutetium Inorganic materials 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 4
- 229910052781 Neptunium Inorganic materials 0.000 claims description 4
- 229910052778 Plutonium Inorganic materials 0.000 claims description 4
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 4
- 229910052772 Samarium Inorganic materials 0.000 claims description 4
- 229910052771 Terbium Inorganic materials 0.000 claims description 4
- 229910052776 Thorium Inorganic materials 0.000 claims description 4
- 229910052775 Thulium Inorganic materials 0.000 claims description 4
- 229910052770 Uranium Inorganic materials 0.000 claims description 4
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 229910052788 barium Inorganic materials 0.000 claims description 4
- 229910052790 beryllium Inorganic materials 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052762 osmium Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 229910052706 scandium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 229910052712 strontium Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052713 technetium Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 150000002484 inorganic compounds Chemical class 0.000 claims description 2
- 229910010272 inorganic material Inorganic materials 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 127
- 239000010408 film Substances 0.000 description 22
- 238000001069 Raman spectroscopy Methods 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000001530 Raman microscopy Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N99/00—Subject matter not provided for in other groups of this subclass
- H10N99/03—Devices using Mott metal-insulator transition, e.g. field-effect transistor-like devices
Landscapes
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Description
Claims (14)
- 臨界濃度(または低濃度)の正孔の添加により発生する急激な金属−絶縁体転移(Metal−Insulator Transition;MIT)により全体が金属状態に転移できる所定幅を持つ伝導層と、
基板の一定領域に配された第1電極と、
前記第1電極と所定の間隔をなして配された第2電極と
を備え、
前記伝導層は、前記第1電極と第2電極とを電気的に連結し、基板上に配され、
前記伝導層が複数の伝導層であり、前記伝導層は電気的に並列に連結され、
前記伝導層は、その幅全体にわたって均一に電流が流れることを特徴とする急激なMIT素子。 - 前記第1電極及び第2電極は所定距離ほど互いに離隔しており、前記伝導層の第1及び第2側面を部分的に覆うことを特徴とする請求項1に記載の急激なMIT素子。
- 前記第1電極及び第2電極は前記伝導層を介して配され、前記伝導層の第1及び第2側面を全面的に覆うことを特徴とする請求項1に記載の急激なMIT素子。
- 前記伝導層は、酸素、炭素、半導体元素(III−V族、II−VI族)、転移金属元素、希土類元素、ランタン系元素を含む低濃度の正孔が添加された無機物化合物半導体及び絶縁体、低濃度の正孔が添加された有機物半導体及び絶縁体、低濃度の正孔が添加された半導体、及び低濃度の正孔が添加された酸化物半導体及び絶縁体のうち選択された少なくとも一つであることを特徴とする請求項1に記載の急激なMIT素子。
- 前記第1電極及び第2電極は、Li、Be、C、Na、Mg、Al、K、Ca、Sc、Ti、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、Ga、Rb、Sr、Y、Zr、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、In、Sn、Sb、Cs、Ba、La、Hf、Ta、W、Re、Os、Ir、Pt、Au、Hg、Pb、Bi、Po、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu、Th、U、Np、Puの金属、前記金属の化合物または前記金属及び前記化合物を含む酸化物のうち選択された少なくとも一つ以上の物質からなることを特徴とする請求項1に記載の急激なMIT素子。
- 前記伝導層と前記第1電極との間及び前記伝導層と前記第2電極との間には、前記伝導層に流れる電流により発生する熱を耐えられる保護用電極をさらに備えることを特徴とする請求項1に記載の急激なMIT素子。
- 前記保護用電極は、Li、Be、C、Na、Mg、Al、K、Ca、Sc、Ti、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、Ga、Rb、Sr、Y、Zr、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、In、Sn、Sb、Cs、Ba、La、Hf、Ta、W、Re、Os、Ir、Pt、Au、Hg、Pb、Bi、Po、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu、Th、U、Np、Puの金属、前記金属の化合物または前記金属及び前記化合物を含む酸化物のうち選択された少なくとも一つ以上の物質からなることを特徴とする請求項6に記載の急激なMIT素子。
- 前記伝導層の一側にはゲート絶縁膜を介在させ、前記伝導層の一定領域を覆いつつ延びるゲート電極をさらに備えることを特徴とする請求項1に記載の急激なMIT素子。
- 前記ゲート絶縁膜は、前記伝導層の少なくとも一面を覆うことを特徴とする請求項8に記載の急激なMIT素子。
- 前記伝導層上にはゲート絶縁膜を介在させ、前記伝導層の一定領域を覆いつつ延びる第3電極をさらに備えることを特徴とする請求項2に記載の急激なMIT素子。
- 前記伝導層と前記基板との間にゲート絶縁膜を介在させ、前記伝導層の一定領域を覆いつつ延びる第3電極をさらに備えることを特徴とする請求項2に記載の急激なMIT素子。
- 前記伝導層、前記第1電極及び第2電極は保護回路をなし、前記保護回路と並列に連結された電気的なシステムをさらに備えることを特徴とする請求項1に記載の急激なMIT素子。
- 前記保護回路は、急速な金属−絶縁体転移により大部分の電流を収容することを特徴とする請求項12に記載の急激なMIT素子。
- 前記電気的なシステムは、前記保護回路に大部分の電流が流れることによって保護されることを特徴とする請求項12に記載の急激なMIT素子。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0009827 | 2006-02-01 | ||
KR20060009827 | 2006-02-01 | ||
KR10-2006-0057086 | 2006-06-23 | ||
KR1020060057086A KR100701159B1 (ko) | 2006-02-01 | 2006-06-23 | 병렬 전도층 구조를 갖는 금속-절연체 전이 소자 |
PCT/KR2007/000526 WO2007089097A1 (en) | 2006-02-01 | 2007-01-31 | Abrupt metal-insulator transition device with parallel conducting layers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009525608A JP2009525608A (ja) | 2009-07-09 |
JP5449781B2 true JP5449781B2 (ja) | 2014-03-19 |
Family
ID=38327628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008553156A Expired - Fee Related JP5449781B2 (ja) | 2006-02-01 | 2007-01-31 | 並列伝導層構造を持つ金属−絶縁体転移素子 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7989792B2 (ja) |
EP (1) | EP1979947B1 (ja) |
JP (1) | JP5449781B2 (ja) |
CN (1) | CN101410984B (ja) |
RU (1) | RU2392692C2 (ja) |
WO (1) | WO2007089097A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100687760B1 (ko) * | 2005-10-19 | 2007-02-27 | 한국전자통신연구원 | 급격한 금속-절연체 전이를 하는 절연체 및 그 제조방법,이를 이용한 소자 |
KR100825738B1 (ko) * | 2006-03-28 | 2008-04-29 | 한국전자통신연구원 | 급격한 금속-절연체 전이를 이용한 전압조정 시스템 |
WO2009140305A1 (en) * | 2008-05-12 | 2009-11-19 | Symetrix Corporation | Correlated electron material and process for making |
KR101109667B1 (ko) * | 2008-12-22 | 2012-01-31 | 한국전자통신연구원 | 방열 성능이 향상된 전력 소자 패키지 |
US8862193B2 (en) * | 2010-12-29 | 2014-10-14 | Varian Semiconductor Equipment Associates, Inc. | Superconducting fault current limiter |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1023660A (ja) * | 1996-07-02 | 1998-01-23 | Fuji Electric Co Ltd | 限流装置 |
US6121642A (en) * | 1998-07-20 | 2000-09-19 | International Business Machines Corporation | Junction mott transition field effect transistor (JMTFET) and switch for logic and memory applications |
US6890766B2 (en) | 1999-03-17 | 2005-05-10 | International Business Machines Corporation | Dual-type thin-film field-effect transistors and applications |
US6365913B1 (en) * | 1999-11-19 | 2002-04-02 | International Business Machines Corporation | Dual gate field effect transistor utilizing Mott transition materials |
KR100433623B1 (ko) * | 2001-09-17 | 2004-05-31 | 한국전자통신연구원 | 급격한 금속-절연체 상전이를 이용한 전계 효과 트랜지스터 |
KR100467330B1 (ko) | 2003-06-03 | 2005-01-24 | 한국전자통신연구원 | 절연체 바나듐 산화막을 채널 영역으로 이용한 전계 효과트랜지스터 및 그 제조 방법 |
US6801676B1 (en) | 2003-06-24 | 2004-10-05 | Intel Corporation | Method and apparatus for phase shifting an optical beam in an optical device with a buffer plug |
KR100576703B1 (ko) * | 2003-10-23 | 2006-05-03 | 한국전자통신연구원 | 금속-절연체 상전이 고속 스위칭 소자 및 그 제조 방법 |
KR100576704B1 (ko) * | 2003-11-06 | 2006-05-03 | 한국전자통신연구원 | 급격한 금속-절연체 상전이형 소자를 포함하는 전류제어회로 |
KR100609699B1 (ko) * | 2004-07-15 | 2006-08-08 | 한국전자통신연구원 | 급격한 금속-절연체 전이 반도체 물질을 이용한 2단자반도체 소자 및 그 제조 방법 |
JP4853859B2 (ja) * | 2005-06-27 | 2012-01-11 | 独立行政法人情報通信研究機構 | 非導電性ナノワイヤー及びその製造方法 |
WO2007013724A1 (en) * | 2005-07-29 | 2007-02-01 | Electronics And Telecommunications Research Institute | Abrupt metal-insulator transition device, circuit for removing high-voltage noise using the abrupt metal-insulator transition device, and electrical and/or electronic system comprising the circuit |
-
2007
- 2007-01-31 EP EP07708680.9A patent/EP1979947B1/en not_active Not-in-force
- 2007-01-31 US US12/162,964 patent/US7989792B2/en not_active Expired - Fee Related
- 2007-01-31 RU RU2008131700/28A patent/RU2392692C2/ru not_active IP Right Cessation
- 2007-01-31 CN CN2007800106199A patent/CN101410984B/zh not_active Expired - Fee Related
- 2007-01-31 JP JP2008553156A patent/JP5449781B2/ja not_active Expired - Fee Related
- 2007-01-31 WO PCT/KR2007/000526 patent/WO2007089097A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101410984A (zh) | 2009-04-15 |
US7989792B2 (en) | 2011-08-02 |
RU2008131700A (ru) | 2010-02-10 |
WO2007089097A1 (en) | 2007-08-09 |
CN101410984B (zh) | 2012-02-15 |
EP1979947A1 (en) | 2008-10-15 |
EP1979947B1 (en) | 2013-11-20 |
RU2392692C2 (ru) | 2010-06-20 |
US20090057820A1 (en) | 2009-03-05 |
EP1979947A4 (en) | 2012-09-26 |
JP2009525608A (ja) | 2009-07-09 |
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