JP5443993B2 - エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 - Google Patents

エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 Download PDF

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Publication number
JP5443993B2
JP5443993B2 JP2009540078A JP2009540078A JP5443993B2 JP 5443993 B2 JP5443993 B2 JP 5443993B2 JP 2009540078 A JP2009540078 A JP 2009540078A JP 2009540078 A JP2009540078 A JP 2009540078A JP 5443993 B2 JP5443993 B2 JP 5443993B2
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Prior art keywords
epoxy resin
group
resin composition
general formula
diphenyl
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JP2009540078A
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Japanese (ja)
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JPWO2009060897A1 (ja
Inventor
正史 梶
智美 福永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
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Nippon Steel and Sumikin Chemical Co Ltd
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Priority to JP2009540078A priority Critical patent/JP5443993B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
JP2009540078A 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 Active JP5443993B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009540078A JP5443993B2 (ja) 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007290647 2007-11-08
JP2007290647 2007-11-08
JP2009540078A JP5443993B2 (ja) 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物
PCT/JP2008/070203 WO2009060897A1 (fr) 2007-11-08 2008-11-06 Résine époxy et son procédé de fabrication, composition de résine époxy et produit durci

Publications (2)

Publication Number Publication Date
JPWO2009060897A1 JPWO2009060897A1 (ja) 2011-03-24
JP5443993B2 true JP5443993B2 (ja) 2014-03-19

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JP2009540078A Active JP5443993B2 (ja) 2007-11-08 2008-11-06 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物

Country Status (3)

Country Link
JP (1) JP5443993B2 (fr)
TW (1) TWI441846B (fr)
WO (1) WO2009060897A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5457304B2 (ja) * 2010-08-26 2014-04-02 新日鉄住金化学株式会社 フェノール性樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
WO2014109143A1 (fr) * 2013-01-09 2014-07-17 Jsr株式会社 Composition photosensible, polymère, film de résine, procédé de fabrication du film de résine et composant électronique
JP6834173B2 (ja) * 2016-05-13 2021-02-24 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
US20220185948A1 (en) * 2019-03-29 2022-06-16 Tdk Corporation Epoxy resin, resin composition, resin sheet, resin cured product, resin substrate and multilayer substrate
JP7476529B2 (ja) 2019-12-09 2024-05-01 住友ベークライト株式会社 樹脂シートおよび金属ベース基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241222A (ja) * 1985-08-19 1987-02-23 Sumitomo Chem Co Ltd エポキシ樹脂

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0725877B2 (ja) * 1985-08-19 1995-03-22 住友化学工業株式会社 エポキシ樹脂
US4727119A (en) * 1986-09-15 1988-02-23 The Dow Chemical Company Halogenated epoxy resins
JP3959615B2 (ja) * 2002-02-15 2007-08-15 三菱瓦斯化学株式会社 積層板用エポキシ樹脂組成物
JP2003231682A (ja) * 2002-02-06 2003-08-19 Mitsubishi Chemicals Corp ヘテロ環含有化合物およびその組成物
JP5234962B2 (ja) * 2006-08-07 2013-07-10 新日鉄住金化学株式会社 プリプレグ、積層板およびプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241222A (ja) * 1985-08-19 1987-02-23 Sumitomo Chem Co Ltd エポキシ樹脂

Also Published As

Publication number Publication date
TW200936628A (en) 2009-09-01
JPWO2009060897A1 (ja) 2011-03-24
WO2009060897A1 (fr) 2009-05-14
TWI441846B (zh) 2014-06-21

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