JP5441057B2 - ワイヤソー - Google Patents

ワイヤソー Download PDF

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Publication number
JP5441057B2
JP5441057B2 JP2009268408A JP2009268408A JP5441057B2 JP 5441057 B2 JP5441057 B2 JP 5441057B2 JP 2009268408 A JP2009268408 A JP 2009268408A JP 2009268408 A JP2009268408 A JP 2009268408A JP 5441057 B2 JP5441057 B2 JP 5441057B2
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JP
Japan
Prior art keywords
wire
swing
frame
arc
wire saw
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009268408A
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English (en)
Japanese (ja)
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JP2011110643A (ja
JP2011110643A5 (enExample
Inventor
博之 北
勝利 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takatori Corp
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Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2009268408A priority Critical patent/JP5441057B2/ja
Publication of JP2011110643A publication Critical patent/JP2011110643A/ja
Publication of JP2011110643A5 publication Critical patent/JP2011110643A5/ja
Application granted granted Critical
Publication of JP5441057B2 publication Critical patent/JP5441057B2/ja
Expired - Fee Related legal-status Critical Current
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009268408A 2009-11-26 2009-11-26 ワイヤソー Expired - Fee Related JP5441057B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009268408A JP5441057B2 (ja) 2009-11-26 2009-11-26 ワイヤソー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009268408A JP5441057B2 (ja) 2009-11-26 2009-11-26 ワイヤソー

Publications (3)

Publication Number Publication Date
JP2011110643A JP2011110643A (ja) 2011-06-09
JP2011110643A5 JP2011110643A5 (enExample) 2013-01-24
JP5441057B2 true JP5441057B2 (ja) 2014-03-12

Family

ID=44233392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009268408A Expired - Fee Related JP5441057B2 (ja) 2009-11-26 2009-11-26 ワイヤソー

Country Status (1)

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JP (1) JP5441057B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015113919A1 (de) 2014-08-22 2016-02-25 Aisin Seiki Kabushiki Kaisha Herstellverfahren eines Substrats, Schneideverfahren eines Verarbeitungsobjekts und Laserverarbeitungsvorrichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103419289B (zh) * 2012-05-23 2015-09-30 浙江硅宏电子科技有限公司 一种硅晶体切割机
US9969017B2 (en) 2012-10-15 2018-05-15 Toyo Advanced Technologies Co., Ltd. Wire saw apparatus and cut-machining method
CN113146867B (zh) * 2021-04-23 2022-02-22 曲靖阳光新能源股份有限公司 一种单刀双棒切割机

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676366A (en) * 1979-11-21 1981-06-23 Toshiba Corp Cutting method using free abrasive grain
JPS63110343U (enExample) * 1986-10-27 1988-07-15
JP2674213B2 (ja) * 1989-06-06 1997-11-12 日立電子エンジニアリング株式会社 ディスク研摩装置
JPH04310337A (ja) * 1991-04-04 1992-11-02 Isami Tanaka ワーク傾動装置およびチルティングテーブル
JP3101662B2 (ja) * 1991-10-08 2000-10-23 株式会社タカトリ ワイヤソーのワイヤ供給方法とそれを用いたワイヤソー
JPH09300342A (ja) * 1996-05-17 1997-11-25 Tokyo Seimitsu Co Ltd ワイヤソーのチルチング装置
JP3672146B2 (ja) * 1997-03-27 2005-07-13 三菱住友シリコン株式会社 ワイヤソーおよびインゴット切断方法
JPH1110510A (ja) * 1997-06-19 1999-01-19 Nippei Toyama Corp ワイヤソー装置及びワーク切削方法
JPH11188602A (ja) * 1997-12-22 1999-07-13 Tokyo Seimitsu Co Ltd 固定砥粒付エンドレスワイヤソー

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015113919A1 (de) 2014-08-22 2016-02-25 Aisin Seiki Kabushiki Kaisha Herstellverfahren eines Substrats, Schneideverfahren eines Verarbeitungsobjekts und Laserverarbeitungsvorrichtung
US9789566B2 (en) 2014-08-22 2017-10-17 Aisin Seiki Kabushiki Kaisha Manufacturing method of substrate, cutting method of processing object and laser processing apparatus

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Publication number Publication date
JP2011110643A (ja) 2011-06-09

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