JP5436394B2 - 粘着剤組成物 - Google Patents
粘着剤組成物Info
- Publication number
- JP5436394B2 JP5436394B2 JP2010244410A JP2010244410A JP5436394B2 JP 5436394 B2 JP5436394 B2 JP 5436394B2 JP 2010244410 A JP2010244410 A JP 2010244410A JP 2010244410 A JP2010244410 A JP 2010244410A JP 5436394 B2 JP5436394 B2 JP 5436394B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- group
- mass
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000203 mixture Substances 0.000 title claims description 181
- 230000001070 adhesive effect Effects 0.000 title claims description 110
- 239000000853 adhesive Substances 0.000 title claims description 109
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 266
- -1 imidazole compound Chemical class 0.000 claims description 170
- 239000000178 monomer Substances 0.000 claims description 82
- 239000003431 cross linking reagent Substances 0.000 claims description 63
- 239000012790 adhesive layer Substances 0.000 claims description 44
- 230000003287 optical effect Effects 0.000 claims description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 29
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 29
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 25
- 150000001718 carbodiimides Chemical class 0.000 claims description 24
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 24
- 150000002978 peroxides Chemical class 0.000 claims description 24
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 22
- 229920006243 acrylic copolymer Polymers 0.000 claims description 19
- 239000012948 isocyanate Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 18
- 150000002513 isocyanates Chemical class 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 94
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 87
- 239000010408 film Substances 0.000 description 60
- 239000000243 solution Substances 0.000 description 48
- 238000004132 cross linking Methods 0.000 description 41
- 230000001681 protective effect Effects 0.000 description 37
- 229920000642 polymer Polymers 0.000 description 36
- 238000012545 processing Methods 0.000 description 35
- 239000006087 Silane Coupling Agent Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 32
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 30
- 239000012298 atmosphere Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 28
- 230000015572 biosynthetic process Effects 0.000 description 27
- 238000001035 drying Methods 0.000 description 22
- 239000011521 glass Substances 0.000 description 21
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 20
- 238000002156 mixing Methods 0.000 description 20
- 238000002360 preparation method Methods 0.000 description 20
- 239000011247 coating layer Substances 0.000 description 19
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- 238000005187 foaming Methods 0.000 description 18
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- 229920006267 polyester film Polymers 0.000 description 18
- 238000006116 polymerization reaction Methods 0.000 description 18
- 238000000576 coating method Methods 0.000 description 17
- 239000007787 solid Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 125000000524 functional group Chemical group 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 230000032683 aging Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000000123 paper Substances 0.000 description 11
- 238000011109 contamination Methods 0.000 description 10
- 125000005442 diisocyanate group Chemical group 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 125000003545 alkoxy group Chemical group 0.000 description 9
- 230000008859 change Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 229920002799 BoPET Polymers 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 150000002460 imidazoles Chemical class 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 238000010998 test method Methods 0.000 description 7
- 125000003396 thiol group Chemical group [H]S* 0.000 description 7
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 6
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 229920005672 polyolefin resin Polymers 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 230000005764 inhibitory process Effects 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 3
- CHIHQLCVLOXUJW-UHFFFAOYSA-N benzoic anhydride Chemical compound C=1C=CC=CC=1C(=O)OC(=O)C1=CC=CC=C1 CHIHQLCVLOXUJW-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 3
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- MCMFEZDRQOJKMN-UHFFFAOYSA-N 1-butylimidazole Chemical compound CCCCN1C=CN=C1 MCMFEZDRQOJKMN-UHFFFAOYSA-N 0.000 description 2
- IWDFHWZHHOSSGR-UHFFFAOYSA-N 1-ethylimidazole Chemical compound CCN1C=CN=C1 IWDFHWZHHOSSGR-UHFFFAOYSA-N 0.000 description 2
- IYVYLVCVXXCYRI-UHFFFAOYSA-N 1-propylimidazole Chemical compound CCCN1C=CN=C1 IYVYLVCVXXCYRI-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 2
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKVKUNIBLLLFHA-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound C=CC(=O)OCC1(CO)CCCCC1 KKVKUNIBLLLFHA-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 2
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- 125000001931 aliphatic group Chemical group 0.000 description 2
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- 238000006482 condensation reaction Methods 0.000 description 2
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- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 238000006114 decarboxylation reaction Methods 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
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- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000002608 ionic liquid Substances 0.000 description 2
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- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- OTYIGDNQBJUCNI-UHFFFAOYSA-N tetraethyl silicate triethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound C(C)O[Si](OCC)(OCC)OCC.C(C1CO1)OC[Si](OCC)(OCC)OCC OTYIGDNQBJUCNI-UHFFFAOYSA-N 0.000 description 1
- KHULVWYNEIZLER-UHFFFAOYSA-N tetraethyl silicate triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C(C)O[Si](OCC)(OCC)OCC.C(C1CO1)OCCC[Si](OCC)(OCC)OCC KHULVWYNEIZLER-UHFFFAOYSA-N 0.000 description 1
- UUUBKUHOEXOTFP-UHFFFAOYSA-N tetraethyl silicate;3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)OCC.CCO[Si](OCC)(OCC)CCCS UUUBKUHOEXOTFP-UHFFFAOYSA-N 0.000 description 1
- PFOWXDLDZSTNHE-UHFFFAOYSA-N tetraethyl silicate;3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)OCC.CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C PFOWXDLDZSTNHE-UHFFFAOYSA-N 0.000 description 1
- OTRAIGCCGQEMOG-UHFFFAOYSA-N tetraethyl silicate;3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)OCC.CCO[Si](OCC)(OCC)CCCOC(=O)C=C OTRAIGCCGQEMOG-UHFFFAOYSA-N 0.000 description 1
- NYWGPGGNZCFHDZ-UHFFFAOYSA-N tetraethyl silicate;3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS.CCO[Si](OCC)(OCC)OCC NYWGPGGNZCFHDZ-UHFFFAOYSA-N 0.000 description 1
- HRLAHSXHMIJXHV-UHFFFAOYSA-N tetraethyl silicate;3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)OCC.CO[Si](OC)(OC)CCCOC(=O)C(C)=C HRLAHSXHMIJXHV-UHFFFAOYSA-N 0.000 description 1
- SJWDBDMRCPLUTI-UHFFFAOYSA-N tetraethyl silicate;3-trimethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)OCC.CO[Si](OC)(OC)CCCOC(=O)C=C SJWDBDMRCPLUTI-UHFFFAOYSA-N 0.000 description 1
- FJGOJSLDQKMJSD-UHFFFAOYSA-N tetraethyl silicate;triethoxysilylmethanethiol Chemical compound CCO[Si](CS)(OCC)OCC.CCO[Si](OCC)(OCC)OCC FJGOJSLDQKMJSD-UHFFFAOYSA-N 0.000 description 1
- BSTMSRIMJAEHTM-UHFFFAOYSA-N tetraethyl silicate;trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)OCC.CO[Si](OC)(OC)CCCOCC1CO1 BSTMSRIMJAEHTM-UHFFFAOYSA-N 0.000 description 1
- FZXUHBUNJYBPSF-UHFFFAOYSA-N tetraethyl silicate;trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC.CCO[Si](OCC)(OCC)OCC FZXUHBUNJYBPSF-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- KSFXBJJRUDMSCL-UHFFFAOYSA-N tetramethyl silicate;3-triethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)OC.CCO[Si](OCC)(OCC)CCCS KSFXBJJRUDMSCL-UHFFFAOYSA-N 0.000 description 1
- UMRRNLWGYGXKJT-UHFFFAOYSA-N tetramethyl silicate;3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)OC.CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C UMRRNLWGYGXKJT-UHFFFAOYSA-N 0.000 description 1
- TYWOIFWGIPJOQP-UHFFFAOYSA-N tetramethyl silicate;3-triethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)OC.CCO[Si](OCC)(OCC)CCCOC(=O)C=C TYWOIFWGIPJOQP-UHFFFAOYSA-N 0.000 description 1
- XGFZGELZFRHQIU-UHFFFAOYSA-N tetramethyl silicate;3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)OC.CO[Si](OC)(OC)CCCS XGFZGELZFRHQIU-UHFFFAOYSA-N 0.000 description 1
- HKTUBAPEZVPPNP-UHFFFAOYSA-N tetramethyl silicate;3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)OC.CO[Si](OC)(OC)CCCOC(=O)C(C)=C HKTUBAPEZVPPNP-UHFFFAOYSA-N 0.000 description 1
- XWCXOVZGEZNJMY-UHFFFAOYSA-N tetramethyl silicate;3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)OC.CO[Si](OC)(OC)CCCOC(=O)C=C XWCXOVZGEZNJMY-UHFFFAOYSA-N 0.000 description 1
- JGASWBJDLLOTLH-UHFFFAOYSA-N tetramethyl silicate;triethoxysilylmethanethiol Chemical compound CO[Si](OC)(OC)OC.CCO[Si](CS)(OCC)OCC JGASWBJDLLOTLH-UHFFFAOYSA-N 0.000 description 1
- PWYOLUNMUKEIMH-UHFFFAOYSA-N tetramethyl silicate;trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)OC.CO[Si](OC)(OC)CCCOCC1CO1 PWYOLUNMUKEIMH-UHFFFAOYSA-N 0.000 description 1
- JZWSKHZDUIDXBM-UHFFFAOYSA-N tetramethyl silicate;trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC.CO[Si](OC)(OC)OC JZWSKHZDUIDXBM-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229940006280 thiosulfate ion Drugs 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- LFBULLRGNLZJAF-UHFFFAOYSA-N trimethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CO[Si](OC)(OC)COCC1CO1 LFBULLRGNLZJAF-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- QJOOZNCPHALTKK-UHFFFAOYSA-N trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC QJOOZNCPHALTKK-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- JPPHEZSCZWYTOP-UHFFFAOYSA-N trimethoxysilylmethyl prop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C=C JPPHEZSCZWYTOP-UHFFFAOYSA-N 0.000 description 1
- RRHXZLALVWBDKH-UHFFFAOYSA-M trimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)OCC[N+](C)(C)C RRHXZLALVWBDKH-UHFFFAOYSA-M 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Liquid Crystal (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010244410A JP5436394B2 (ja) | 2010-10-29 | 2010-10-29 | 粘着剤組成物 |
| KR1020110054208A KR101351627B1 (ko) | 2010-10-29 | 2011-06-03 | 점착제 조성물 |
| CN201110328282.4A CN102464960B (zh) | 2010-10-29 | 2011-10-25 | 粘合剂组合物、光学元件、表面保护膜和粘合剂片 |
| US13/282,799 US9315691B2 (en) | 2010-10-29 | 2011-10-27 | Adhesive composition |
| TW100139352A TWI462986B (zh) | 2010-10-29 | 2011-10-28 | 黏合劑組合物、光學元件、表面保護膜和黏合劑片（二） |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010244410A JP5436394B2 (ja) | 2010-10-29 | 2010-10-29 | 粘着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012097162A JP2012097162A (ja) | 2012-05-24 |
| JP5436394B2 true JP5436394B2 (ja) | 2014-03-05 |
Family
ID=46265371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010244410A Active JP5436394B2 (ja) | 2010-10-29 | 2010-10-29 | 粘着剤組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5436394B2 (ko) |
| KR (1) | KR101351627B1 (ko) |
| TW (1) | TWI462986B (ko) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5764435B2 (ja) * | 2011-08-29 | 2015-08-19 | 綜研化学株式会社 | 粘着剤組成物、粘着シートおよびタッチパネル用積層体 |
| US10551540B2 (en) | 2013-06-21 | 2020-02-04 | Nitto Denko Corporation | Separator-attached adhesive layer structure and production method therefor, separator-attached adhesive layer and polarizing film combination structure and production method therefor, and image display device |
| KR101882560B1 (ko) * | 2014-08-01 | 2018-07-26 | 삼성에스디아이 주식회사 | 점착제 조성물, 점착필름, 광학부재 및 점착시트 |
| WO2016018003A1 (ko) * | 2014-08-01 | 2016-02-04 | 삼성에스디아이 주식회사 | 점착제 조성물, 점착필름, 광학부재 및 점착시트 |
| JP6154054B2 (ja) * | 2015-09-30 | 2017-06-28 | 日東電工株式会社 | 粘着剤層付偏光フィルム、その製造方法、および画像表示装置 |
| WO2017057357A1 (ja) * | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | 粘着剤層付偏光フィルム、その製造方法、および画像表示装置 |
| JP6330792B2 (ja) * | 2015-11-25 | 2018-05-30 | 東洋インキＳｃホールディングス株式会社 | 粘着剤およびそれを用いた粘着シート |
| JP6927674B2 (ja) * | 2016-07-07 | 2021-09-01 | 三星エスディアイ株式会社ＳＡＭＳＵＮＧ ＳＤＩ Ｃｏ．， ＬＴＤ． | 粘着剤組成物 |
| KR102353306B1 (ko) * | 2016-11-04 | 2022-01-19 | 미쯔비시 케미컬 주식회사 | 편광판용 점착제 조성물, 편광판용 점착제, 및 점착제층 부착 편광판 |
| KR101941194B1 (ko) * | 2016-12-09 | 2019-04-12 | 한국생산기술연구원 | 디스플레이용 점접착 소재 및 이의 제조방법 |
| JP6319919B2 (ja) * | 2016-12-21 | 2018-05-09 | 藤森工業株式会社 | 透明導電性フィルム用表面保護フィルムの製造方法 |
| JP7264598B2 (ja) * | 2018-04-02 | 2023-04-25 | デクセリアルズ株式会社 | 接着剤組成物及び接続構造体 |
| JP7110883B2 (ja) * | 2018-09-28 | 2022-08-02 | 三菱ケミカル株式会社 | 粘着剤組成物、およびそれを用いてなる粘着剤及び粘着シート |
| JP7259420B2 (ja) * | 2019-03-06 | 2023-04-18 | 三菱ケミカル株式会社 | 粘着剤組成物、それを用いてなる粘着剤及び粘着シート |
| JP2022179184A (ja) * | 2021-05-21 | 2022-12-02 | 日東電工株式会社 | 粘着剤組成物、粘着シート、光学積層体、画像表示装置及び粘着シートの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007058277A1 (ja) * | 2005-11-21 | 2007-05-24 | Soken Chemical & Engineering Co., Ltd. | 光学フィルム用粘着剤組成物および粘着シート、ならびにこれを用いた光学部材 |
| KR20070066929A (ko) * | 2005-12-22 | 2007-06-27 | 닛토덴코 가부시키가이샤 | 제거가능한 수분산성 아크릴 접착제 조성물 및 접착 시트 |
| JP5095150B2 (ja) * | 2006-08-03 | 2012-12-12 | 日東電工株式会社 | 水性感圧接着剤組成物およびその利用 |
| JP2008222754A (ja) * | 2007-03-09 | 2008-09-25 | Nippon Carbide Ind Co Inc | 再剥離性水性感圧接着剤組成物 |
| KR101492629B1 (ko) * | 2007-06-28 | 2015-02-12 | 린텍 가부시키가이샤 | 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 |
| JP5351400B2 (ja) * | 2007-09-20 | 2013-11-27 | リンテック株式会社 | 再剥離性粘着シート |
| JP5591477B2 (ja) * | 2008-03-13 | 2014-09-17 | 日東電工株式会社 | 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材、透明導電性積層体、タッチパネルおよび画像表示装置 |
| JP5311342B2 (ja) * | 2009-02-09 | 2013-10-09 | 綜研化学株式会社 | 帯電防止性粘着剤組成物および帯電防止フィルム |
-
2010
- 2010-10-29 JP JP2010244410A patent/JP5436394B2/ja active Active
-
2011
- 2011-06-03 KR KR1020110054208A patent/KR101351627B1/ko active IP Right Grant
- 2011-10-28 TW TW100139352A patent/TWI462986B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101351627B1 (ko) | 2014-01-15 |
| TWI462986B (zh) | 2014-12-01 |
| TW201229187A (en) | 2012-07-16 |
| KR20120045998A (ko) | 2012-05-09 |
| JP2012097162A (ja) | 2012-05-24 |
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