JP5435861B2 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

Info

Publication number
JP5435861B2
JP5435861B2 JP2007322469A JP2007322469A JP5435861B2 JP 5435861 B2 JP5435861 B2 JP 5435861B2 JP 2007322469 A JP2007322469 A JP 2007322469A JP 2007322469 A JP2007322469 A JP 2007322469A JP 5435861 B2 JP5435861 B2 JP 5435861B2
Authority
JP
Japan
Prior art keywords
electronic component
adhesive tape
substrate
mounting
tcp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007322469A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147089A (ja
JP2009147089A5 (zh
Inventor
悦郎 南浜
圭剛 広瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2007322469A priority Critical patent/JP5435861B2/ja
Priority to KR1020107015375A priority patent/KR101148322B1/ko
Priority to CN2008801185239A priority patent/CN101884098B/zh
Priority to PCT/JP2008/070816 priority patent/WO2009075164A1/ja
Priority to TW097144848A priority patent/TWI460795B/zh
Publication of JP2009147089A publication Critical patent/JP2009147089A/ja
Publication of JP2009147089A5 publication Critical patent/JP2009147089A5/ja
Application granted granted Critical
Publication of JP5435861B2 publication Critical patent/JP5435861B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2007322469A 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法 Active JP5435861B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法
KR1020107015375A KR101148322B1 (ko) 2007-12-13 2008-11-14 전자 부품 실장 장치 및 실장 방법
CN2008801185239A CN101884098B (zh) 2007-12-13 2008-11-14 电子部件的安装装置和安装方法
PCT/JP2008/070816 WO2009075164A1 (ja) 2007-12-13 2008-11-14 電子部品の実装装置及び実装方法
TW097144848A TWI460795B (zh) 2007-12-13 2008-11-20 Installation device and installation method of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2009147089A JP2009147089A (ja) 2009-07-02
JP2009147089A5 JP2009147089A5 (zh) 2012-11-22
JP5435861B2 true JP5435861B2 (ja) 2014-03-05

Family

ID=40755407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007322469A Active JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP5435861B2 (zh)
KR (1) KR101148322B1 (zh)
CN (1) CN101884098B (zh)
TW (1) TWI460795B (zh)
WO (1) WO2009075164A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
CN102879395A (zh) * 2011-07-11 2013-01-16 昆山华扬电子有限公司 Pcb板件辅助对位检查装置
CN107852858B (zh) * 2015-09-30 2020-01-03 雅马哈发动机株式会社 元件安装机、元件保持部件拍摄方法
JP6767333B2 (ja) * 2017-09-28 2020-10-14 芝浦メカトロニクス株式会社 電子部品の実装装置
KR20210121351A (ko) 2020-03-27 2021-10-08 삼성디스플레이 주식회사 본딩 장치 및 그것을 이용한 표시 장치의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939159B2 (ja) * 2002-02-05 2007-07-04 芝浦メカトロニクス株式会社 テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) * 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
JP4538843B2 (ja) * 2004-03-05 2010-09-08 澁谷工業株式会社 ダイボンド用粘着テープの貼付方法
JP2006058411A (ja) * 2004-08-18 2006-03-02 Takatori Corp 液晶パネルへの偏光板貼り付け方法及び装置
KR100591074B1 (ko) * 2004-12-13 2006-06-19 (주) 선양디엔티 칩 온 필름용 이방성 도전물 부착 시스템
JP4591140B2 (ja) * 2005-03-16 2010-12-01 パナソニック株式会社 表示パネルの組立装置および組立方法
JP4708896B2 (ja) * 2005-07-20 2011-06-22 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法

Also Published As

Publication number Publication date
CN101884098A (zh) 2010-11-10
TW200931542A (en) 2009-07-16
TWI460795B (zh) 2014-11-11
KR101148322B1 (ko) 2012-05-25
KR20100093592A (ko) 2010-08-25
WO2009075164A1 (ja) 2009-06-18
JP2009147089A (ja) 2009-07-02
CN101884098B (zh) 2012-08-29

Similar Documents

Publication Publication Date Title
JP6767333B2 (ja) 電子部品の実装装置
JP5435861B2 (ja) 電子部品の実装装置及び実装方法
CN108430167B (zh) 电子零件的安装装置和显示用部件的制造方法
KR101209502B1 (ko) 평판 표시 장치 모듈의 조립 장치
JP6663940B2 (ja) 電子部品の実装装置と表示用部材の製造方法
CN106660710B (zh) 元件供给装置
CN102194721A (zh) Fpd组件的装配装置
JP5160819B2 (ja) 電子部品の実装装置及び実装方法
JP2008139523A (ja) 光学フィルム貼付け方法、光学フィルム貼付け装置、及び表示用パネルの製造方法
JP2009004652A (ja) 電子部品の実装装置及び実装方法
JP4708896B2 (ja) 粘着性テープの貼着装置及び貼着方法
JP5416825B2 (ja) 電子部品の実装装置及び実装方法
JP2003175922A (ja) 自動ラベル貼付装置
JP2008285285A (ja) テープ貼付け装置
JP4958817B2 (ja) 電子部品の実装装置
JP2009026831A (ja) 電子部品の実装装置
JP2005022676A (ja) ラベル貼付方法および装置
JP2013214725A (ja) 粘着テープの貼着装置、貼着方法及び電子部品の実装装置
JP2020120127A (ja) 電子部品の実装装置と表示用部材の製造方法
JP5477317B2 (ja) 部品実装装置及び部品実装方法
JP2007108255A (ja) 偏光板貼付装置
JP7340732B2 (ja) 部品供給装置、部品実装装置、部品供給方法及び部品実装方法
JP2005072078A (ja) テープ部材の貼着装置及び貼着方法
JP7285303B2 (ja) 電子部品の実装装置と表示用部材の製造方法
WO2023067700A1 (ja) 基板のクランプ方法、作業装置及び作業システム

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100708

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100708

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120426

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20120529

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121003

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130115

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130301

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130625

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130826

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131126

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131210

R150 Certificate of patent or registration of utility model

Ref document number: 5435861

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150