JP5431967B2 - 有機発光ダイオードデバイスのための水分障壁コーティング - Google Patents

有機発光ダイオードデバイスのための水分障壁コーティング Download PDF

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Publication number
JP5431967B2
JP5431967B2 JP2009550960A JP2009550960A JP5431967B2 JP 5431967 B2 JP5431967 B2 JP 5431967B2 JP 2009550960 A JP2009550960 A JP 2009550960A JP 2009550960 A JP2009550960 A JP 2009550960A JP 5431967 B2 JP5431967 B2 JP 5431967B2
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Prior art keywords
film
amorphous diamond
plasma
silicone oil
layer
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Expired - Fee Related
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JP2009550960A
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Japanese (ja)
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JP2010519705A (ja
JP2010519705A5 (enExample
Inventor
エム． デイビッド，モーゼス
ビー． マコーミック，フレッド
エー． ローリグ，マーク
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
JP2009550960A 2007-02-21 2008-02-07 有機発光ダイオードデバイスのための水分障壁コーティング Expired - Fee Related JP5431967B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/677,327 US8241713B2 (en) 2007-02-21 2007-02-21 Moisture barrier coatings for organic light emitting diode devices
US11/677,327 2007-02-21
PCT/US2008/053265 WO2008103558A1 (en) 2007-02-21 2008-02-07 Moisture barrier coatings for organic light emitting diode devices

Publications (3)

Publication Number Publication Date
JP2010519705A JP2010519705A (ja) 2010-06-03
JP2010519705A5 JP2010519705A5 (enExample) 2011-03-17
JP5431967B2 true JP5431967B2 (ja) 2014-03-05

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Family Applications (1)

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JP2009550960A Expired - Fee Related JP5431967B2 (ja) 2007-02-21 2008-02-07 有機発光ダイオードデバイスのための水分障壁コーティング

Country Status (7)

Country Link
US (2) US8241713B2 (enExample)
EP (1) EP2115798B1 (enExample)
JP (1) JP5431967B2 (enExample)
KR (1) KR101481191B1 (enExample)
CN (2) CN104332564B (enExample)
BR (1) BRPI0807753A2 (enExample)
WO (1) WO2008103558A1 (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010537867A (ja) 2007-09-06 2010-12-09 スリーエム イノベイティブ プロパティズ カンパニー 型を形成する方法及びかかる型を使用して物品を成形する方法
EP2198332A4 (en) 2007-09-06 2011-11-30 3M Innovative Properties Co LIGHT CONDUCTOR WITH LIGHT EXTRACTION STRUCTURES FOR PROVIDING REGIONAL CONTROL OF LIGHT OUTPUT
WO2009032815A1 (en) * 2007-09-06 2009-03-12 3M Innovative Properties Company Tool for making microstructured articles
JP2011501209A (ja) 2007-10-11 2011-01-06 スリーエム イノベイティブ プロパティズ カンパニー 色共焦点センサ
JP5524856B2 (ja) * 2007-12-12 2014-06-18 スリーエム イノベイティブ プロパティズ カンパニー エッジ明瞭性が向上した構造の製造方法
EP2231395A4 (en) * 2007-12-28 2014-01-29 3M Innovative Properties Co INFRARED REFLECTIVE FILMS FOR SOLAR CONTROL AND OTHER USES
BRPI0819548A2 (pt) * 2007-12-28 2015-05-19 3M Innovative Properties Co "sistemas de filme de encapsulação flexível"
TWI420722B (zh) 2008-01-30 2013-12-21 歐斯朗奧托半導體股份有限公司 具有封裝單元之裝置
US8605256B2 (en) * 2008-02-26 2013-12-10 3M Innovative Properties Company Multi-photon exposure system
US7976908B2 (en) * 2008-05-16 2011-07-12 General Electric Company High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices
US9481927B2 (en) * 2008-06-30 2016-11-01 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films
JP2010103082A (ja) * 2008-09-26 2010-05-06 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子及びその製造方法
CN102257553B (zh) * 2008-10-01 2014-10-01 皇家飞利浦电子股份有限公司 Oled器件和电子电路
EP2272928A1 (de) 2009-06-23 2011-01-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Hochbarrierenverbunde und Verfahren zu ihrer Herstellung
KR20100097513A (ko) * 2009-02-26 2010-09-03 삼성모바일디스플레이주식회사 유기 발광 표시 장치
DE102009024411A1 (de) 2009-03-24 2010-09-30 Osram Opto Semiconductors Gmbh Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement
TWI522404B (zh) * 2009-03-26 2016-02-21 Lintec Corp A molded body, a manufacturing method thereof, an electronic device element, and an electronic device
CN101697343B (zh) * 2009-10-27 2011-06-15 苏州纳科显示技术有限公司 一种薄膜封装方法
JP5940980B2 (ja) 2009-11-18 2016-06-29 スリーエム イノベイティブ プロパティズ カンパニー 多層光学フィルム
US8753711B2 (en) * 2009-12-18 2014-06-17 General Electric Company Edge sealing method using barrier coatings
KR101125567B1 (ko) * 2009-12-24 2012-03-22 삼성모바일디스플레이주식회사 고분자 기판 및 그 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법
US9013018B2 (en) 2010-02-18 2015-04-21 Beneq Oy Multilayer moisture barrier
TWI515276B (zh) 2010-05-25 2016-01-01 ３Ｍ新設資產公司 抗微生物塗料
EP2576471B1 (en) 2010-05-25 2017-10-25 3M Innovative Properties Company Antimicrobial coated medical articles
EP2588314B1 (en) 2010-07-02 2020-08-19 3M Innovative Properties Company Barrier assembly with encapsulant and photovoltaic cell
US9254506B2 (en) * 2010-07-02 2016-02-09 3M Innovative Properties Company Moisture resistant coating for barrier films
FR2965407A1 (fr) * 2010-09-27 2012-03-30 Saint Gobain Procédé de connexion(s) électrique(s) d'un dispositif a diode électroluminescente organique encapsule et un tel dispositif oled
WO2012047422A1 (en) 2010-10-06 2012-04-12 3M Innovative Properties Company Anti-reflective articles with nanosilica-based coatings
JP6247533B2 (ja) 2010-10-06 2017-12-13 スリーエム イノベイティブ プロパティズ カンパニー ナノシリカ系コーティング及びバリア層を有する反射防止物品
NL2005506C2 (en) * 2010-10-12 2012-04-16 Stichting Energie Sealing layer for electronic or photovoltaic devices.
JP5631729B2 (ja) * 2010-12-28 2014-11-26 株式会社アルバック 半導体装置
JP5648523B2 (ja) * 2011-02-16 2015-01-07 富士通株式会社 半導体装置、電源装置、増幅器及び半導体装置の製造方法
JP5659079B2 (ja) * 2011-05-10 2015-01-28 株式会社アルバック ＺｒＢＯ膜の形成装置
BE1019991A3 (fr) * 2011-05-25 2013-03-05 Agc Glass Europe Procede de depot de couches sur un substrat verrier par pecvd a faible pression.
WO2013042784A1 (ja) * 2011-09-21 2013-03-28 パナソニック株式会社 発光装置
US9299956B2 (en) * 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
TWI610806B (zh) 2012-08-08 2018-01-11 ３Ｍ新設資產公司 障壁膜，製造該障壁膜之方法，及包含該障壁膜之物件
WO2014025383A1 (en) 2012-08-08 2014-02-13 3M Innovative Properties Company Photovoltaic devices with encapsulating barrier film
JP6268175B2 (ja) 2012-08-08 2018-01-24 スリーエム イノベイティブ プロパティズ カンパニー 尿素（マルチ）−（メタ）アクリレート（マルチ）−シラン化合物及びそれを含む物品
CN105720207B (zh) * 2013-06-29 2017-09-15 艾克斯特朗欧洲公司 用于高性能涂层的沉积的方法以及封装的电子器件
KR20150012584A (ko) * 2013-07-25 2015-02-04 삼성디스플레이 주식회사 스퍼터링 타겟 제조 방법, 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
US8981408B2 (en) 2013-07-26 2015-03-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Light source having liquid encapsulant
US9356256B2 (en) * 2013-07-31 2016-05-31 Samsung Display Co., Ltd. Flexible display device and manufacturing method thereof
WO2016003523A2 (en) 2014-04-16 2016-01-07 Board Of Trustees Of The Leland Stanford Junior University Polar elastomers for high performance electronic and optoelectronic devices
JP6469435B2 (ja) * 2014-10-30 2019-02-13 太陽誘電ケミカルテクノロジー株式会社 構造体及び構造体製造方法
WO2016084578A1 (ja) * 2014-11-26 2016-06-02 京セラ株式会社 半導体封止用樹脂組成物および半導体装置
KR102456654B1 (ko) 2014-11-26 2022-10-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
US9899457B2 (en) * 2015-04-24 2018-02-20 Universal Display Corporation Flexible OLED display having increased lifetime
US10581015B2 (en) 2015-08-17 2020-03-03 3M Innovative Properties Company Barrier film constructions
KR102471159B1 (ko) 2015-10-12 2022-11-25 삼성전자주식회사 이미지 센서 및 그 제조 방법
CN105552247B (zh) * 2015-12-08 2018-10-26 上海天马微电子有限公司 复合基板、柔性显示装置及其制备方法
EP3417360B1 (en) * 2016-02-16 2019-09-18 SABIC Global Technologies B.V. Barrier film laminate, method of manufacture, and displays comprising the barrier film laminate
CN105957960A (zh) * 2016-06-29 2016-09-21 京东方科技集团股份有限公司 一种磁敏器件及其制备方法
US10595417B2 (en) 2016-07-18 2020-03-17 Verily Life Sciences Llc Method of manufacturing flexible electronic circuits having conformal material coatings
DE102016214493A1 (de) 2016-08-04 2018-02-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Passives elektrisches Bauteil mit Beschichtung zur Verbesserung der Belastbarkeit
US10333104B2 (en) * 2016-11-06 2019-06-25 Orbotech LT Solar, LLC. Method and apparatus for encapsulation of an organic light emitting diode
CN106450032B (zh) * 2016-11-08 2018-01-30 武汉华星光电技术有限公司 Oled显示器及其制作方法
DE102018102416A1 (de) 2017-10-23 2019-04-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verwendung einer kohlenstoffhaltigen Beschichtung zum Schutz eines passiven elektrischen Bauteils vor Angriff durch Ammoniak und Anlage, umfassend ein passives elektrisches Bauteil, das gegen Angriff von Ammoniak geschützt ist
US11380863B2 (en) * 2019-03-19 2022-07-05 Nanosys, Inc. Flexible electroluminescent devices
KR102351155B1 (ko) * 2020-01-30 2022-01-14 성균관대학교산학협력단 멀티 패시베이션을 이용한 인쇄 전자소자 제조 방법 및 인쇄 전자소자
CN115505907A (zh) * 2021-06-22 2022-12-23 江苏菲沃泰纳米科技股份有限公司 应用于柔性基材的复合膜及其制备方法和产品

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5718976A (en) * 1991-05-03 1998-02-17 Advanced Refractory Technologies, Inc. Erosion resistant diamond-like nanocomposite coatings for optical components
US5298587A (en) * 1992-12-21 1994-03-29 The Dow Chemical Company Protective film for articles and method
US5440446A (en) * 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
ATE233939T1 (de) * 1993-10-04 2003-03-15 3M Innovative Properties Co Vernetztes acrylatbeschichtungsmaterial zur herstellung von kondensatordielektrika und sauerstoffbarrieren
US5682043A (en) * 1994-06-28 1997-10-28 Uniax Corporation Electrochemical light-emitting devices
US5877895A (en) * 1995-03-20 1999-03-02 Catalina Coatings, Inc. Multicolor interference coating
US5948166A (en) 1996-11-05 1999-09-07 3M Innovative Properties Company Process and apparatus for depositing a carbon-rich coating on a moving substrate
US5888594A (en) * 1996-11-05 1999-03-30 Minnesota Mining And Manufacturing Company Process for depositing a carbon-rich coating on a moving substrate
EP0856592A1 (en) 1997-02-04 1998-08-05 N.V. Bekaert S.A. A coating comprising layers of diamond like carbon and diamond like nanocomposite compositions
US6203898B1 (en) * 1997-08-29 2001-03-20 3M Innovatave Properties Company Article comprising a substrate having a silicone coating
EP1524708A3 (en) * 1998-12-16 2006-07-26 Battelle Memorial Institute Environmental barrier material and methods of making.
US6083313A (en) * 1999-07-27 2000-07-04 Advanced Refractory Technologies, Inc. Hardcoats for flat panel display substrates
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6696157B1 (en) 2000-03-05 2004-02-24 3M Innovative Properties Company Diamond-like glass thin films
US6492026B1 (en) * 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
DE10044841B4 (de) * 2000-09-11 2006-11-30 Osram Opto Semiconductors Gmbh Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
DE10130666A1 (de) * 2001-06-28 2003-01-23 Applied Films Gmbh & Co Kg Softcoat
US7106939B2 (en) * 2001-09-19 2006-09-12 3M Innovative Properties Company Optical and optoelectronic articles
US6878419B2 (en) * 2001-12-14 2005-04-12 3M Innovative Properties Co. Plasma treatment of porous materials
GB0208261D0 (en) * 2002-04-10 2002-05-22 Dow Corning An atmospheric pressure plasma assembly
US6743524B2 (en) * 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
TW569644B (en) * 2002-08-06 2004-01-01 Chi Mei Optoelectronics Corp Plastic substrate for organic electroluminescent display element, manufacturing method thereof and organic electroluminescent display element made by the substrate
US7387081B2 (en) * 2003-01-23 2008-06-17 3M Innovative Properties Company Plasma reactor including helical electrodes
JP4653964B2 (ja) 2003-04-08 2011-03-16 株式会社栗田製作所 Ｄｌｃ膜の成膜方法およびｄｌｃ成膜物
CN1879238B (zh) * 2003-11-13 2010-04-28 皇家飞利浦电子股份有限公司 包括保护性阻挡层叠层的电子器件
CN1563243A (zh) * 2004-03-25 2005-01-12 复旦大学 一种高热导性和高气密性的薄膜封装材料及其制备方法
US7342356B2 (en) * 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US8124434B2 (en) * 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US20070020451A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings

Also Published As

Publication number Publication date
US20080196664A1 (en) 2008-08-21
KR20090113323A (ko) 2009-10-29
EP2115798A1 (en) 2009-11-11
WO2008103558A1 (en) 2008-08-28
CN104332564A (zh) 2015-02-04
EP2115798B1 (en) 2016-05-18
US8241713B2 (en) 2012-08-14
JP2010519705A (ja) 2010-06-03
US20120273976A1 (en) 2012-11-01
CN101632184A (zh) 2010-01-20
BRPI0807753A2 (pt) 2014-06-17
CN104332564B (zh) 2017-12-01
KR101481191B1 (ko) 2015-01-09

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