JP5431967B2 - 有機発光ダイオードデバイスのための水分障壁コーティング - Google Patents

有機発光ダイオードデバイスのための水分障壁コーティング Download PDF

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Publication number
JP5431967B2
JP5431967B2 JP2009550960A JP2009550960A JP5431967B2 JP 5431967 B2 JP5431967 B2 JP 5431967B2 JP 2009550960 A JP2009550960 A JP 2009550960A JP 2009550960 A JP2009550960 A JP 2009550960A JP 5431967 B2 JP5431967 B2 JP 5431967B2
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Japan
Prior art keywords
film
amorphous diamond
plasma
silicone oil
layer
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Expired - Fee Related
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JP2009550960A
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English (en)
Japanese (ja)
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JP2010519705A (ja
JP2010519705A5 (enExample
Inventor
エム． デイビッド，モーゼス
ビー． マコーミック，フレッド
エー． ローリグ，マーク
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2010519705A5 publication Critical patent/JP2010519705A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
JP2009550960A 2007-02-21 2008-02-07 有機発光ダイオードデバイスのための水分障壁コーティング Expired - Fee Related JP5431967B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/677,327 US8241713B2 (en) 2007-02-21 2007-02-21 Moisture barrier coatings for organic light emitting diode devices
US11/677,327 2007-02-21
PCT/US2008/053265 WO2008103558A1 (en) 2007-02-21 2008-02-07 Moisture barrier coatings for organic light emitting diode devices

Publications (3)

Publication Number Publication Date
JP2010519705A JP2010519705A (ja) 2010-06-03
JP2010519705A5 JP2010519705A5 (enExample) 2011-03-17
JP5431967B2 true JP5431967B2 (ja) 2014-03-05

Family

ID=39493283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009550960A Expired - Fee Related JP5431967B2 (ja) 2007-02-21 2008-02-07 有機発光ダイオードデバイスのための水分障壁コーティング

Country Status (7)

Country Link
US (2) US8241713B2 (enExample)
EP (1) EP2115798B1 (enExample)
JP (1) JP5431967B2 (enExample)
KR (1) KR101481191B1 (enExample)
CN (2) CN101632184A (enExample)
BR (1) BRPI0807753A2 (enExample)
WO (1) WO2008103558A1 (enExample)

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Also Published As

Publication number Publication date
EP2115798B1 (en) 2016-05-18
KR101481191B1 (ko) 2015-01-09
US20080196664A1 (en) 2008-08-21
JP2010519705A (ja) 2010-06-03
WO2008103558A1 (en) 2008-08-28
US20120273976A1 (en) 2012-11-01
US8241713B2 (en) 2012-08-14
CN104332564B (zh) 2017-12-01
CN101632184A (zh) 2010-01-20
EP2115798A1 (en) 2009-11-11
KR20090113323A (ko) 2009-10-29
CN104332564A (zh) 2015-02-04
BRPI0807753A2 (pt) 2014-06-17

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