JP5431232B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5431232B2
JP5431232B2 JP2010083911A JP2010083911A JP5431232B2 JP 5431232 B2 JP5431232 B2 JP 5431232B2 JP 2010083911 A JP2010083911 A JP 2010083911A JP 2010083911 A JP2010083911 A JP 2010083911A JP 5431232 B2 JP5431232 B2 JP 5431232B2
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JP
Japan
Prior art keywords
semiconductor element
protrusion
semiconductor device
support member
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010083911A
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English (en)
Japanese (ja)
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JP2011216691A5 (https=
JP2011216691A (ja
Inventor
芳央 岡山
恭典 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2010083911A priority Critical patent/JP5431232B2/ja
Priority to US12/980,023 priority patent/US8471289B2/en
Publication of JP2011216691A publication Critical patent/JP2011216691A/ja
Publication of JP2011216691A5 publication Critical patent/JP2011216691A5/ja
Application granted granted Critical
Publication of JP5431232B2 publication Critical patent/JP5431232B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

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  • Semiconductor Lasers (AREA)
JP2010083911A 2009-12-28 2010-03-31 半導体装置 Expired - Fee Related JP5431232B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010083911A JP5431232B2 (ja) 2010-03-31 2010-03-31 半導体装置
US12/980,023 US8471289B2 (en) 2009-12-28 2010-12-28 Semiconductor laser device, optical pickup device and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010083911A JP5431232B2 (ja) 2010-03-31 2010-03-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2011216691A JP2011216691A (ja) 2011-10-27
JP2011216691A5 JP2011216691A5 (https=) 2013-03-21
JP5431232B2 true JP5431232B2 (ja) 2014-03-05

Family

ID=44946131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010083911A Expired - Fee Related JP5431232B2 (ja) 2009-12-28 2010-03-31 半導体装置

Country Status (1)

Country Link
JP (1) JP5431232B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5551135B2 (ja) 2011-09-30 2014-07-16 京セラドキュメントソリューションズ株式会社 後処理装置
JP2014027179A (ja) * 2012-07-27 2014-02-06 Harison Toshiba Lighting Corp 発光装置およびその製造方法、並びにパッケージ部材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4020624B2 (ja) * 2001-11-08 2007-12-12 三洋電機株式会社 半導体装置の製造方法
JP3782406B2 (ja) * 2003-07-01 2006-06-07 松下電器産業株式会社 固体撮像装置およびその製造方法
JP3993862B2 (ja) * 2003-10-10 2007-10-17 松下電器産業株式会社 光学デバイスおよびその製造方法
JP2006351568A (ja) * 2005-06-13 2006-12-28 Sumitomo Metal Electronics Devices Inc 発光素子搭載パッケージの製造方法
JP4783718B2 (ja) * 2006-11-27 2011-09-28 新光電気工業株式会社 照明装置
JP5013905B2 (ja) * 2007-02-28 2012-08-29 スタンレー電気株式会社 半導体発光装置
JP5061010B2 (ja) * 2008-03-31 2012-10-31 三洋電機株式会社 半導体モジュール
JP5484694B2 (ja) * 2008-07-31 2014-05-07 三洋電機株式会社 半導体モジュールおよび半導体モジュールを備える携帯機器
JP2011165737A (ja) * 2010-02-05 2011-08-25 Denki Kagaku Kogyo Kk 発光素子搭載用基板およびその製造方法

Also Published As

Publication number Publication date
JP2011216691A (ja) 2011-10-27

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