JP5416386B2 - 薄板ガラス基板のスクライブ方法 - Google Patents

薄板ガラス基板のスクライブ方法 Download PDF

Info

Publication number
JP5416386B2
JP5416386B2 JP2008274768A JP2008274768A JP5416386B2 JP 5416386 B2 JP5416386 B2 JP 5416386B2 JP 2008274768 A JP2008274768 A JP 2008274768A JP 2008274768 A JP2008274768 A JP 2008274768A JP 5416386 B2 JP5416386 B2 JP 5416386B2
Authority
JP
Japan
Prior art keywords
substrate
thickness
cooling
scribing
scanning speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008274768A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010100495A5 (https=
JP2010100495A (ja
Inventor
山本　　幸司
宇航 蘇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2008274768A priority Critical patent/JP5416386B2/ja
Publication of JP2010100495A publication Critical patent/JP2010100495A/ja
Publication of JP2010100495A5 publication Critical patent/JP2010100495A5/ja
Application granted granted Critical
Publication of JP5416386B2 publication Critical patent/JP5416386B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2008274768A 2008-10-24 2008-10-24 薄板ガラス基板のスクライブ方法 Expired - Fee Related JP5416386B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008274768A JP5416386B2 (ja) 2008-10-24 2008-10-24 薄板ガラス基板のスクライブ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008274768A JP5416386B2 (ja) 2008-10-24 2008-10-24 薄板ガラス基板のスクライブ方法

Publications (3)

Publication Number Publication Date
JP2010100495A JP2010100495A (ja) 2010-05-06
JP2010100495A5 JP2010100495A5 (https=) 2011-07-14
JP5416386B2 true JP5416386B2 (ja) 2014-02-12

Family

ID=42291490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008274768A Expired - Fee Related JP5416386B2 (ja) 2008-10-24 2008-10-24 薄板ガラス基板のスクライブ方法

Country Status (1)

Country Link
JP (1) JP5416386B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443851B2 (ja) * 2009-06-29 2014-03-19 三星ダイヤモンド工業株式会社 薄板ガラス基板のスクライブ方法およびスクライブ装置
JP5606852B2 (ja) 2010-09-27 2014-10-15 大日本スクリーン製造株式会社 熱処理装置および熱処理方法
JP5729604B2 (ja) * 2011-07-20 2015-06-03 株式会社レミ ガラス基板の加工装置
KR101948382B1 (ko) 2013-01-30 2019-02-14 코닝 인코포레이티드 가요성 유리의 연속 레이저 절단을 위한 장치 및 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006027795A (ja) * 2004-07-14 2006-02-02 Toshiba Corp 吸着装置、ならびに板状部材の搬送方法、液晶表示装置の製造方法
JP2007090860A (ja) * 2005-09-01 2007-04-12 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2007275920A (ja) * 2006-04-05 2007-10-25 Seiko Epson Corp 基体の製造方法、表示装置、電気光学装置、電子機器
JP2008183599A (ja) * 2007-01-31 2008-08-14 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Also Published As

Publication number Publication date
JP2010100495A (ja) 2010-05-06

Similar Documents

Publication Publication Date Title
JP5325209B2 (ja) 脆性材料基板の加工方法
JP5249979B2 (ja) 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
JP5314674B2 (ja) 脆性材料基板の加工方法
JP6397821B2 (ja) ワークピースの分離のための方法及び装置
JP2011079690A (ja) 回折格子を用いた厚板ガラスのレーザ熱応力割断
JPWO2011002089A1 (ja) 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス
JP5416386B2 (ja) 薄板ガラス基板のスクライブ方法
JP2012061681A (ja) レーザ割断装置
JP2010150068A (ja) 脆性材料基板の割断方法
JP5443851B2 (ja) 薄板ガラス基板のスクライブ方法およびスクライブ装置
JP5590642B2 (ja) スクライブ加工装置及びスクライブ加工方法
WO2009128315A1 (ja) 脆性材料基板の加工方法
JP2010030834A (ja) ガラス板の切断方法、及びガラス板切断用テーブル装置
JP2009107304A (ja) 脆性材料の熱応力割断方法
JPWO2014077397A1 (ja) ワーク割断方法
JP5444158B2 (ja) 脆性材料基板の割断方法
WO2021157305A1 (ja) ガラス板の製造方法
JP2008246808A (ja) 高脆性非金属材料製の被加工物の加工方法及びその装置
JP5729604B2 (ja) ガラス基板の加工装置
JP2013082598A (ja) 高強度ガラス基板の加工装置
JP2009196175A (ja) 割断装置、割断方法、およびフラットパネルディスプレイの製造方法
JP2008127224A (ja) 脆性材料をフルカットするレーザ割断方法
JP2011201200A (ja) 脆性材料基板のレーザ加工方法
JP2013023417A (ja) ガラス基板の加工装置
JP2017039213A (ja) ワーク割断方法およびワーク割断装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110527

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121204

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121205

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130201

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131022

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131115

LAPS Cancellation because of no payment of annual fees