JP5413522B1 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP5413522B1 JP5413522B1 JP2012553132A JP2012553132A JP5413522B1 JP 5413522 B1 JP5413522 B1 JP 5413522B1 JP 2012553132 A JP2012553132 A JP 2012553132A JP 2012553132 A JP2012553132 A JP 2012553132A JP 5413522 B1 JP5413522 B1 JP 5413522B1
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- Prior art keywords
- epoxy resin
- resin composition
- resin
- inorganic filler
- treated
- Prior art date
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- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
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- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- JTQPTNQXCUMDRK-UHFFFAOYSA-N propan-2-olate;titanium(2+) Chemical compound CC(C)O[Ti]OC(C)C JTQPTNQXCUMDRK-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- VMYXFDVIMUEKNP-UHFFFAOYSA-N trimethoxy-[5-(oxiran-2-yl)pentyl]silane Chemical compound CO[Si](OC)(OC)CCCCCC1CO1 VMYXFDVIMUEKNP-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Applications Claiming Priority (1)
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|---|---|---|---|
| PCT/JP2012/051901 WO2013111345A1 (ja) | 2012-01-23 | 2012-01-23 | 樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
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| JP5413522B1 true JP5413522B1 (ja) | 2014-02-12 |
| JPWO2013111345A1 JPWO2013111345A1 (ja) | 2015-05-11 |
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|---|---|---|---|
| JP2012553132A Active JP5413522B1 (ja) | 2012-01-23 | 2012-01-23 | 樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5413522B1 (ko) |
| KR (1) | KR101897955B1 (ko) |
| CN (1) | CN104053721B (ko) |
| TW (1) | TWI572663B (ko) |
| WO (1) | WO2013111345A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9974169B2 (en) | 2015-02-03 | 2018-05-15 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board |
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| JP6123177B2 (ja) * | 2012-07-04 | 2017-05-10 | 味の素株式会社 | 樹脂組成物 |
| JP6175781B2 (ja) * | 2013-01-29 | 2017-08-09 | 東レ株式会社 | 成形材料および繊維強化複合材料 |
| TWI674972B (zh) * | 2013-08-23 | 2019-10-21 | 日商味之素股份有限公司 | 零件封裝用薄膜之製造方法 |
| JP6279864B2 (ja) * | 2013-09-19 | 2018-02-14 | 静岡県公立大学法人 | 樹脂組成物、樹脂成形体および半導体装置 |
| JP2015151483A (ja) * | 2014-02-17 | 2015-08-24 | 三菱瓦斯化学株式会社 | レジンシート、金属箔張積層板及びプリント配線板 |
| WO2015186744A1 (ja) * | 2014-06-04 | 2015-12-10 | 日立化成株式会社 | フィルム状エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物の製造方法、及び半導体装置の製造方法 |
| JP6672616B2 (ja) * | 2014-06-30 | 2020-03-25 | 味の素株式会社 | 樹脂組成物、接着フィルム、プリント配線板及び半導体装置 |
| CN104194272A (zh) * | 2014-09-03 | 2014-12-10 | 苏州苏月新材料有限公司 | 一种玄武岩纤维预浸料及制备方法 |
| JP6747440B2 (ja) * | 2015-06-16 | 2020-08-26 | 日立化成株式会社 | フィルム形成用樹脂組成物及びこれを用いた封止フィルム、支持体付き封止フィルム、半導体装置 |
| KR102569981B1 (ko) | 2015-06-29 | 2023-08-22 | 니폰 제온 가부시키가이샤 | 2차 전지 다공막용 조성물, 2차 전지용 다공막 및 2차 전지 |
| JP6657865B2 (ja) * | 2015-12-01 | 2020-03-04 | 味の素株式会社 | 樹脂シート |
| JP6848187B2 (ja) * | 2016-02-25 | 2021-03-24 | 住友ベークライト株式会社 | 半導体装置製造用樹脂シート、半導体装置、半導体装置の製造方法、有機樹脂基板および有機樹脂基板の製造方法 |
| JP6834144B2 (ja) * | 2016-02-29 | 2021-02-24 | 味の素株式会社 | 支持体付き樹脂シート |
| JP7024174B2 (ja) * | 2016-08-26 | 2022-02-24 | 味の素株式会社 | 樹脂組成物 |
| CN107722687B (zh) * | 2017-09-19 | 2020-02-07 | 河北晨阳工贸集团有限公司 | 水性可剥离树脂及其制备方法 |
| JP7465093B2 (ja) * | 2017-10-10 | 2024-04-10 | 味の素株式会社 | 硬化体及びその製造方法、樹脂シート及び樹脂組成物 |
| KR102196881B1 (ko) * | 2017-12-11 | 2020-12-30 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체 |
| CN111601860B (zh) * | 2018-02-09 | 2022-12-20 | Dic株式会社 | 胶粘带、物品和物品的制造方法 |
| JP7076263B2 (ja) * | 2018-03-30 | 2022-05-27 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
| JP7259913B2 (ja) * | 2018-05-09 | 2023-04-18 | 味の素株式会社 | 支持体付き接着シート |
| JP6965823B2 (ja) * | 2018-05-09 | 2021-11-10 | 味の素株式会社 | 支持体付き接着シート |
| WO2020186379A1 (en) * | 2019-03-15 | 2020-09-24 | Henkel Ag & Co. Kgaa | Thermally conductive potting composition |
| CN111055585B (zh) * | 2019-12-26 | 2021-12-24 | 艾蒙特成都新材料科技有限公司 | 一种阻燃低介电覆铜板及其制备方法 |
| CN114982049A (zh) | 2020-02-28 | 2022-08-30 | 日本瑞翁株式会社 | 电池单元间隔片和电池模块 |
| TWI724806B (zh) * | 2020-03-02 | 2021-04-11 | 聯茂電子股份有限公司 | 無鹵低介電組成物、積層板以及印刷電路板 |
| CN112724867B (zh) * | 2020-12-10 | 2023-01-10 | 深圳先进技术研究院 | 一种绝缘胶膜材料及其制备方法和应用 |
| WO2022120715A1 (zh) * | 2020-12-10 | 2022-06-16 | 深圳先进技术研究院 | 一种绝缘胶膜材料及其制备方法和应用 |
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| JPH05222165A (ja) * | 1992-02-13 | 1993-08-31 | Shin Etsu Chem Co Ltd | 光透過性エポキシ樹脂組成物及び光半導体装置 |
| JP2002114891A (ja) * | 2000-10-05 | 2002-04-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、これを用いたプリプレグ及び銅張積層板 |
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| US20110223383A1 (en) | 2008-09-24 | 2011-09-15 | Sekisui Chemical Co., Ltd. | Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body |
| KR101051873B1 (ko) | 2008-09-24 | 2011-07-25 | 세키스이가가쿠 고교가부시키가이샤 | 경화체 및 적층체 |
| TWI494364B (zh) * | 2009-01-30 | 2015-08-01 | Ajinomoto Kk | Resin composition |
-
2012
- 2012-01-23 KR KR1020147023391A patent/KR101897955B1/ko active IP Right Grant
- 2012-01-23 CN CN201280067707.3A patent/CN104053721B/zh active Active
- 2012-01-23 JP JP2012553132A patent/JP5413522B1/ja active Active
- 2012-01-23 WO PCT/JP2012/051901 patent/WO2013111345A1/ja active Application Filing
-
2013
- 2013-01-23 TW TW102102469A patent/TWI572663B/zh active
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| JPH04370159A (ja) * | 1991-03-19 | 1992-12-22 | Matsushita Electric Works Ltd | 複合充填材及びこの複合充填材を配合したエポキシ樹脂組 成物 |
| JPH05222165A (ja) * | 1992-02-13 | 1993-08-31 | Shin Etsu Chem Co Ltd | 光透過性エポキシ樹脂組成物及び光半導体装置 |
| JP2002114891A (ja) * | 2000-10-05 | 2002-04-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、これを用いたプリプレグ及び銅張積層板 |
| JP2008174624A (ja) * | 2007-01-17 | 2008-07-31 | Admatechs Co Ltd | 表面処理無機粉体 |
| JP2009235359A (ja) * | 2008-03-28 | 2009-10-15 | Osaka Gas Co Ltd | フルオレン系樹脂組成物 |
| JP2010275334A (ja) * | 2009-05-26 | 2010-12-09 | Panasonic Electric Works Co Ltd | 表面処理シリカ粒子の製造方法、表面処理シリカ粒子、エポキシ樹脂組成物、及び半導体装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9974169B2 (en) | 2015-02-03 | 2018-05-15 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013111345A1 (ja) | 2013-08-01 |
| KR101897955B1 (ko) | 2018-09-12 |
| JPWO2013111345A1 (ja) | 2015-05-11 |
| CN104053721A (zh) | 2014-09-17 |
| TW201348324A (zh) | 2013-12-01 |
| CN104053721B (zh) | 2016-12-21 |
| TWI572663B (zh) | 2017-03-01 |
| KR20140124792A (ko) | 2014-10-27 |
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