JP5413261B2 - 半導体パッケージの防水構造 - Google Patents
半導体パッケージの防水構造 Download PDFInfo
- Publication number
- JP5413261B2 JP5413261B2 JP2010057845A JP2010057845A JP5413261B2 JP 5413261 B2 JP5413261 B2 JP 5413261B2 JP 2010057845 A JP2010057845 A JP 2010057845A JP 2010057845 A JP2010057845 A JP 2010057845A JP 5413261 B2 JP5413261 B2 JP 5413261B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- heat
- heat sink
- fixing
- radiating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
110 ヒートシンク
112 パワー素子
116、118 リードフレーム
124 絶縁シート
126 制御回路
130 モールド樹脂
150、160 固定用端子
200、200A、200B 放熱部材
210 伝熱材
220 壁部
230 凹部
240 段差部
250 リブ
Claims (1)
- ヒートシンクと、前記ヒートシンクの一方の面に搭載された半導体素子とを有し、前記半導体素子が搭載された面を少なくとも含んで樹脂モールドされた半導体パッケージと、
前記半導体素子が搭載された面と反対側の前記ヒートシンクの他方の面に伝熱材を介して配置された放熱部材と、
を備え、前記放熱部材は、側面が前記ヒートシンクとの接合面を覆う壁部となる凹部を有するとともに、前記半導体パッケージは、1組以上の対向する辺のそれぞれに固定用端子を有し、
前記固定用端子を用いて前記放熱部材に前記半導体パッケージをネジ固定する固定部を有し、
前記放熱部材は、前記固定用端子を内包する段差部を有し、
前記半導体パッケージを前記放熱部材にネジ固定する際に、前記段差部を前記固定用端子のガイドとして用いることを特徴とする半導体パッケージの防水構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010057845A JP5413261B2 (ja) | 2010-03-15 | 2010-03-15 | 半導体パッケージの防水構造 |
DE102011000374A DE102011000374A1 (de) | 2010-01-29 | 2011-01-27 | Wasserdichte Struktur für Halbleitergehäuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010057845A JP5413261B2 (ja) | 2010-03-15 | 2010-03-15 | 半導体パッケージの防水構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011192806A JP2011192806A (ja) | 2011-09-29 |
JP5413261B2 true JP5413261B2 (ja) | 2014-02-12 |
Family
ID=44797431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010057845A Expired - Fee Related JP5413261B2 (ja) | 2010-01-29 | 2010-03-15 | 半導体パッケージの防水構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5413261B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021199384A1 (ja) * | 2020-04-01 | 2021-10-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4839860U (ja) * | 1971-09-13 | 1973-05-18 | ||
JPH0629433A (ja) * | 1992-07-07 | 1994-02-04 | Nec Corp | 発熱部品の筐体実装具 |
JP2004200264A (ja) * | 2002-12-17 | 2004-07-15 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4738192B2 (ja) * | 2006-02-08 | 2011-08-03 | 株式会社東芝 | 電力変換器用冷却器 |
JP5050633B2 (ja) * | 2007-05-02 | 2012-10-17 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びパワーモジュール |
-
2010
- 2010-03-15 JP JP2010057845A patent/JP5413261B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011192806A (ja) | 2011-09-29 |
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