JP5412131B2 - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法 Download PDFInfo
- Publication number
- JP5412131B2 JP5412131B2 JP2009033382A JP2009033382A JP5412131B2 JP 5412131 B2 JP5412131 B2 JP 5412131B2 JP 2009033382 A JP2009033382 A JP 2009033382A JP 2009033382 A JP2009033382 A JP 2009033382A JP 5412131 B2 JP5412131 B2 JP 5412131B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- microbubbles
- substrate
- chamber
- nanobubbles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009033382A JP5412131B2 (ja) | 2009-02-17 | 2009-02-17 | 基板処理装置および基板処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009033382A JP5412131B2 (ja) | 2009-02-17 | 2009-02-17 | 基板処理装置および基板処理方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010192549A JP2010192549A (ja) | 2010-09-02 |
JP2010192549A5 JP2010192549A5 (enrdf_load_stackoverflow) | 2012-03-29 |
JP5412131B2 true JP5412131B2 (ja) | 2014-02-12 |
Family
ID=42818293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009033382A Expired - Fee Related JP5412131B2 (ja) | 2009-02-17 | 2009-02-17 | 基板処理装置および基板処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5412131B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012090815A1 (ja) * | 2010-12-28 | 2012-07-05 | シャープ株式会社 | レジスト除去装置及びレジスト除去方法 |
JP2012250301A (ja) * | 2011-05-31 | 2012-12-20 | Kyocera Crystal Device Corp | ナノバブル循環型研磨装置 |
JP5854668B2 (ja) * | 2011-07-07 | 2016-02-09 | 芝浦メカトロニクス株式会社 | 気液混合流体生成装置、気液混合流体生成方法、処理装置及び処理方法 |
KR101945566B1 (ko) * | 2011-07-29 | 2019-02-07 | 도쿄엘렉트론가부시키가이샤 | 처리액 공급 장치, 처리액 공급 방법 및 컴퓨터 기억 매체 |
JP5781015B2 (ja) * | 2012-05-31 | 2015-09-16 | 三菱電機株式会社 | ウェハ洗浄装置及び洗浄槽の洗浄方法 |
JP6372329B2 (ja) * | 2014-12-03 | 2018-08-15 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
TWI718962B (zh) * | 2020-06-11 | 2021-02-11 | 威光自動化科技股份有限公司 | 液管內之氣泡篩選器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3205413B2 (ja) * | 1993-02-15 | 2001-09-04 | 株式会社日立製作所 | 微粒子計測装置及び微粒子計測方法 |
JP2006179765A (ja) * | 2004-12-24 | 2006-07-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置およびパーティクル除去方法 |
JP2007117799A (ja) * | 2005-10-25 | 2007-05-17 | Goto Tekkosho:Kk | 微細気泡生成器及びこれを用いた微細気泡生成装置 |
-
2009
- 2009-02-17 JP JP2009033382A patent/JP5412131B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2010192549A (ja) | 2010-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5412131B2 (ja) | 基板処理装置および基板処理方法 | |
KR102263906B1 (ko) | 노즐 및 워크 연마 장치 | |
CN102725824B (zh) | 改进的超声波清洁液,方法及其设备 | |
KR100904350B1 (ko) | 이류체 노즐, 기판처리장치 및 기판처리방법 | |
JP5243849B2 (ja) | 基板処理装置および基板処理方法 | |
US20080017219A1 (en) | Transducer assembly incorporating a transmitter having through holes, and method and system for cleaning a substrate utilizing the same | |
JP2008080230A (ja) | 基板処理装置および基板処理方法 | |
CN102861521B (zh) | 气液混合流体生成装置、气液混合流体生成方法、处理装置以及处理方法 | |
JP4994279B2 (ja) | 微小気泡生成装置 | |
CN113948420A (zh) | 基板清洗装置、基板处理装置、基板清洗方法以及喷嘴 | |
US12109580B2 (en) | Processing liquid nozzle and cleaning apparatus | |
JP6808696B2 (ja) | 供給装置、塗布装置、および供給方法 | |
JP5490938B2 (ja) | 基板処理装置 | |
JP5435688B2 (ja) | 基板処理装置および基板処理方法 | |
JP4909789B2 (ja) | 基板処理装置 | |
JP4592643B2 (ja) | 基板処理装置 | |
KR20190018245A (ko) | 웨이퍼 연마 장치의 클리닝 유닛 | |
JP2007317790A (ja) | 基板処理装置および基板処理方法 | |
KR101890111B1 (ko) | 초음파 세정 장치 및 이를 포함하는 세정 시스템 | |
US10211074B2 (en) | Substrate treating apparatus and treatment liquid nozzle | |
JP2017176963A (ja) | 励起気液混合装置 | |
JP2005270929A (ja) | 液滴配列方法および液滴配列装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120213 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120213 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130319 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130402 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130531 |
|
TRDD | Decision of grant or rejection written | ||
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131111 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5412131 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |