JP5409242B2 - インダクタ及びインダクタの製造方法 - Google Patents

インダクタ及びインダクタの製造方法 Download PDF

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Publication number
JP5409242B2
JP5409242B2 JP2009233496A JP2009233496A JP5409242B2 JP 5409242 B2 JP5409242 B2 JP 5409242B2 JP 2009233496 A JP2009233496 A JP 2009233496A JP 2009233496 A JP2009233496 A JP 2009233496A JP 5409242 B2 JP5409242 B2 JP 5409242B2
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JP
Japan
Prior art keywords
conductors
columnar
insulating layer
core substrate
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009233496A
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English (en)
Japanese (ja)
Other versions
JP2011082346A (ja
JP2011082346A5 (enExample
Inventor
道夫 堀内
幸男 清水
和成 関川
壮 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009233496A priority Critical patent/JP5409242B2/ja
Priority to US12/895,915 priority patent/US8134444B2/en
Publication of JP2011082346A publication Critical patent/JP2011082346A/ja
Publication of JP2011082346A5 publication Critical patent/JP2011082346A5/ja
Application granted granted Critical
Publication of JP5409242B2 publication Critical patent/JP5409242B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP2009233496A 2009-10-07 2009-10-07 インダクタ及びインダクタの製造方法 Expired - Fee Related JP5409242B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009233496A JP5409242B2 (ja) 2009-10-07 2009-10-07 インダクタ及びインダクタの製造方法
US12/895,915 US8134444B2 (en) 2009-10-07 2010-10-01 Inductor and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009233496A JP5409242B2 (ja) 2009-10-07 2009-10-07 インダクタ及びインダクタの製造方法

Publications (3)

Publication Number Publication Date
JP2011082346A JP2011082346A (ja) 2011-04-21
JP2011082346A5 JP2011082346A5 (enExample) 2012-10-25
JP5409242B2 true JP5409242B2 (ja) 2014-02-05

Family

ID=43822757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009233496A Expired - Fee Related JP5409242B2 (ja) 2009-10-07 2009-10-07 インダクタ及びインダクタの製造方法

Country Status (2)

Country Link
US (1) US8134444B2 (enExample)
JP (1) JP5409242B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9691544B2 (en) 2011-08-18 2017-06-27 Winchester Technologies, LLC Electrostatically tunable magnetoelectric inductors with large inductance tunability
CN103094737A (zh) * 2011-11-05 2013-05-08 宝宸（厦门）光学科技有限公司 引脚结构与引脚连接结构
JP2014038884A (ja) * 2012-08-10 2014-02-27 Murata Mfg Co Ltd 電子部品および電子部品の製造方法
JP6156345B2 (ja) * 2014-12-10 2017-07-05 株式会社村田製作所 電子部品及びその製造方法
JP6808565B2 (ja) * 2017-04-07 2021-01-06 ルネサスエレクトロニクス株式会社 半導体装置、それを備えた電子回路、及び、半導体装置の形成方法
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
KR102837229B1 (ko) * 2020-12-23 2025-07-22 (주)포인트엔지니어링 인덕터 및 인덕터용 바디 부재
CN113514540B (zh) * 2021-04-25 2023-11-14 爱德森（厦门）电子有限公司 一种提高涡流检测线圈分辨能力的方法和装置
KR102655257B1 (ko) * 2022-02-23 2024-04-19 (주)포인트엔지니어링 인덕터 및 그 제조 방법

Family Cites Families (26)

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JP2836039B2 (ja) * 1989-12-28 1998-12-14 ティーディーケイ株式会社 インピーダンス素子
IT1266392B1 (it) * 1993-03-05 1996-12-30 Nordica Spa Struttura di dispositivo di frenatura, particolarmente per pattini
US5573172A (en) * 1993-11-08 1996-11-12 Sawtek, Inc. Surface mount stress relief hidden lead package device and method
US5451770A (en) * 1994-02-28 1995-09-19 Stewart; Jack D. Machine controller having optical elements within annular openings
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US5509815A (en) * 1994-06-08 1996-04-23 At&T Corp. Solder medium for circuit interconnection
US5477933A (en) * 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5586010A (en) * 1995-03-13 1996-12-17 Texas Instruments Incorporated Low stress ball grid array package
JPH0992538A (ja) 1995-09-21 1997-04-04 Canon Inc プリントインダクタおよびプリント基板
US5598033A (en) * 1995-10-16 1997-01-28 Advanced Micro Devices, Inc. Micro BGA stacking scheme
US5700549A (en) * 1996-06-24 1997-12-23 International Business Machines Corporation Structure to reduce stress in multilayer ceramic substrates
US5738531A (en) * 1996-09-09 1998-04-14 International Business Machines Corporation Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
JPH1090594A (ja) * 1996-09-17 1998-04-10 Nikon Corp 焦点検出装置を有する光学系
US5829988A (en) * 1996-11-14 1998-11-03 Amkor Electronics, Inc. Socket assembly for integrated circuit chip carrier package
JPH10335142A (ja) * 1997-05-29 1998-12-18 Citizen Electron Co Ltd チップインダクタとその製造方法
JP3436170B2 (ja) * 1999-02-16 2003-08-11 日本電気株式会社 異方性導電フィルム、これを用いた半導体装置及びその製造方法
JP2003092220A (ja) * 2001-09-18 2003-03-28 Toshiba Corp インダクタ
JP2004273480A (ja) * 2003-03-05 2004-09-30 Sony Corp 配線基板およびその製造方法および半導体装置
JP2005024390A (ja) * 2003-07-02 2005-01-27 Mitsutoyo Corp 誘導型位置検出装置の製造方法
JP2006190394A (ja) * 2005-01-06 2006-07-20 Elpida Memory Inc 半導体記憶装置
JP2007053311A (ja) 2005-08-19 2007-03-01 Shinko Electric Ind Co Ltd コイル構造体及びその製造方法ならびに半導体パッケージ
US7636242B2 (en) * 2006-06-29 2009-12-22 Intel Corporation Integrated inductor
US7340825B2 (en) * 2006-07-06 2008-03-11 Harris Corporation Method of making a transformer
JP2008066672A (ja) * 2006-09-11 2008-03-21 Fuji Electric Device Technology Co Ltd 薄型磁気部品内蔵基板及びそれを用いたスイッチング電源モジュール
JP5344667B2 (ja) * 2007-12-18 2013-11-20 太陽誘電株式会社 回路基板およびその製造方法並びに回路モジュール
JP5460155B2 (ja) * 2009-07-14 2014-04-02 新光電気工業株式会社 キャパシタ及び配線基板

Also Published As

Publication number Publication date
US8134444B2 (en) 2012-03-13
JP2011082346A (ja) 2011-04-21
US20110080247A1 (en) 2011-04-07

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