JP5408258B2 - 露光装置、露光方法、及びデバイス製造方法 - Google Patents

露光装置、露光方法、及びデバイス製造方法 Download PDF

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Publication number
JP5408258B2
JP5408258B2 JP2011527532A JP2011527532A JP5408258B2 JP 5408258 B2 JP5408258 B2 JP 5408258B2 JP 2011527532 A JP2011527532 A JP 2011527532A JP 2011527532 A JP2011527532 A JP 2011527532A JP 5408258 B2 JP5408258 B2 JP 5408258B2
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liquid
substrate
gap
space
disposed
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JP2012514315A5 (enExample
JP2012514315A (ja
Inventor
真路 佐藤
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011527532A 2008-12-29 2009-12-25 露光装置、露光方法、及びデバイス製造方法 Active JP5408258B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US19383608P 2008-12-29 2008-12-29
US19383408P 2008-12-29 2008-12-29
US19383508P 2008-12-29 2008-12-29
US19383308P 2008-12-29 2008-12-29
US61/193,833 2008-12-29
US61/193,836 2008-12-29
US61/193,835 2008-12-29
US61/193,834 2008-12-29
US12/644,703 2009-12-22
US12/644,703 US8896806B2 (en) 2008-12-29 2009-12-22 Exposure apparatus, exposure method, and device manufacturing method
PCT/JP2009/071914 WO2010076894A1 (en) 2008-12-29 2009-12-25 Exposure apparatus, exposure method, and device manufacturing method

Related Child Applications (1)

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JP2013230683A Division JP5668825B2 (ja) 2008-12-29 2013-11-06 露光装置、液浸部材、露光方法、及びデバイス製造方法

Publications (3)

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JP2012514315A JP2012514315A (ja) 2012-06-21
JP2012514315A5 JP2012514315A5 (enExample) 2013-01-31
JP5408258B2 true JP5408258B2 (ja) 2014-02-05

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JP2011527532A Active JP5408258B2 (ja) 2008-12-29 2009-12-25 露光装置、露光方法、及びデバイス製造方法
JP2013230683A Active JP5668825B2 (ja) 2008-12-29 2013-11-06 露光装置、液浸部材、露光方法、及びデバイス製造方法

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Country Status (5)

Country Link
US (2) US8896806B2 (enExample)
JP (2) JP5408258B2 (enExample)
KR (2) KR102087015B1 (enExample)
TW (4) TWI644182B (enExample)
WO (1) WO2010076894A1 (enExample)

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JP2014027320A (ja) * 2008-12-29 2014-02-06 Nikon Corp 露光装置、及びデバイス製造方法

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US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9823580B2 (en) * 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9494870B2 (en) * 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
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JP6212884B2 (ja) * 2013-03-15 2017-10-18 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
EP3057122B1 (en) * 2013-10-08 2018-11-21 Nikon Corporation Immersion member, exposure apparatus, exposure method, and device manufacturing method
CN106662822A (zh) 2014-07-01 2017-05-10 Asml荷兰有限公司 光刻设备和制造光刻设备的方法
CN113156772A (zh) 2016-09-12 2021-07-23 Asml荷兰有限公司 用于光刻设备的流体处理结构及浸没光刻设备
KR102649164B1 (ko) * 2017-12-15 2024-03-20 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 구조체, 리소그래피 장치, 유체 핸들링 구조체를 사용하는 방법 및 리소그래피 장치를 사용하는 방법
JP6610726B2 (ja) * 2018-07-11 2019-11-27 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
KR20220058559A (ko) 2019-09-13 2022-05-09 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 시스템 및 리소그래피 장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014027320A (ja) * 2008-12-29 2014-02-06 Nikon Corp 露光装置、及びデバイス製造方法

Also Published As

Publication number Publication date
TWI479276B (zh) 2015-04-01
KR20180021907A (ko) 2018-03-05
WO2010076894A1 (en) 2010-07-08
US9612538B2 (en) 2017-04-04
US8896806B2 (en) 2014-11-25
JP2014027320A (ja) 2014-02-06
TW201518877A (zh) 2015-05-16
US20150036112A1 (en) 2015-02-05
KR20110106908A (ko) 2011-09-29
TW201908875A (zh) 2019-03-01
TWI598698B (zh) 2017-09-11
TW201732458A (zh) 2017-09-16
JP2012514315A (ja) 2012-06-21
KR101831984B1 (ko) 2018-02-23
JP5668825B2 (ja) 2015-02-12
TWI709002B (zh) 2020-11-01
TWI644182B (zh) 2018-12-11
US20100304310A1 (en) 2010-12-02
KR102087015B1 (ko) 2020-03-10
TW201030479A (en) 2010-08-16

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