JP5398258B2 - 誘電体スタック及びそれを備える相互接続構造体 - Google Patents
誘電体スタック及びそれを備える相互接続構造体 Download PDFInfo
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- JP5398258B2 JP5398258B2 JP2008500925A JP2008500925A JP5398258B2 JP 5398258 B2 JP5398258 B2 JP 5398258B2 JP 2008500925 A JP2008500925 A JP 2008500925A JP 2008500925 A JP2008500925 A JP 2008500925A JP 5398258 B2 JP5398258 B2 JP 5398258B2
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Laminated Bodies (AREA)
- Chemical Vapour Deposition (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/906,815 US7265437B2 (en) | 2005-03-08 | 2005-03-08 | Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties |
| US10/906,815 | 2005-03-08 | ||
| PCT/US2006/008449 WO2006096813A2 (en) | 2005-03-08 | 2006-03-08 | Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008537639A JP2008537639A (ja) | 2008-09-18 |
| JP2008537639A5 JP2008537639A5 (enExample) | 2009-02-12 |
| JP5398258B2 true JP5398258B2 (ja) | 2014-01-29 |
Family
ID=36954026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008500925A Active JP5398258B2 (ja) | 2005-03-08 | 2006-03-08 | 誘電体スタック及びそれを備える相互接続構造体 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7265437B2 (enExample) |
| EP (1) | EP1856735A4 (enExample) |
| JP (1) | JP5398258B2 (enExample) |
| CN (1) | CN101138085B (enExample) |
| TW (1) | TWI414623B (enExample) |
| WO (1) | WO2006096813A2 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7288292B2 (en) * | 2003-03-18 | 2007-10-30 | International Business Machines Corporation | Ultra low k (ULK) SiCOH film and method |
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| EP1856735A2 (en) | 2007-11-21 |
| CN101138085A (zh) | 2008-03-05 |
| TWI414623B (zh) | 2013-11-11 |
| US20060202311A1 (en) | 2006-09-14 |
| CN101138085B (zh) | 2013-03-27 |
| WO2006096813A3 (en) | 2006-12-28 |
| WO2006096813A2 (en) | 2006-09-14 |
| JP2008537639A (ja) | 2008-09-18 |
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