JP5395734B2 - 光電気複合基板の製造方法 - Google Patents

光電気複合基板の製造方法 Download PDF

Info

Publication number
JP5395734B2
JP5395734B2 JP2010106956A JP2010106956A JP5395734B2 JP 5395734 B2 JP5395734 B2 JP 5395734B2 JP 2010106956 A JP2010106956 A JP 2010106956A JP 2010106956 A JP2010106956 A JP 2010106956A JP 5395734 B2 JP5395734 B2 JP 5395734B2
Authority
JP
Japan
Prior art keywords
layer
core layer
optical path
connection pad
path conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010106956A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011237503A5 (enExample
JP2011237503A (ja
Inventor
和尚 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010106956A priority Critical patent/JP5395734B2/ja
Priority to US13/079,951 priority patent/US8693815B2/en
Publication of JP2011237503A publication Critical patent/JP2011237503A/ja
Publication of JP2011237503A5 publication Critical patent/JP2011237503A5/ja
Application granted granted Critical
Publication of JP5395734B2 publication Critical patent/JP5395734B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2010106956A 2010-05-07 2010-05-07 光電気複合基板の製造方法 Active JP5395734B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010106956A JP5395734B2 (ja) 2010-05-07 2010-05-07 光電気複合基板の製造方法
US13/079,951 US8693815B2 (en) 2010-05-07 2011-04-05 Optoelectronic composite substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010106956A JP5395734B2 (ja) 2010-05-07 2010-05-07 光電気複合基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011237503A JP2011237503A (ja) 2011-11-24
JP2011237503A5 JP2011237503A5 (enExample) 2013-02-07
JP5395734B2 true JP5395734B2 (ja) 2014-01-22

Family

ID=44901985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010106956A Active JP5395734B2 (ja) 2010-05-07 2010-05-07 光電気複合基板の製造方法

Country Status (2)

Country Link
US (1) US8693815B2 (enExample)
JP (1) JP5395734B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104115043B (zh) * 2011-12-08 2019-09-17 Lg伊诺特有限公司 光学印刷电路板及其制造方法
JP6168602B2 (ja) * 2013-10-31 2017-07-26 日東電工株式会社 光電気混載モジュール
JP6235878B2 (ja) * 2013-11-25 2017-11-22 新光電気工業株式会社 光導波路装置及びその製造方法
JP6492169B2 (ja) 2015-04-27 2019-03-27 京セラ株式会社 光伝送基板および光伝送モジュール
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
JP6623102B2 (ja) * 2016-03-31 2019-12-18 古河電気工業株式会社 光導波回路装置
JP6637368B2 (ja) * 2016-04-06 2020-01-29 新光電気工業株式会社 光導波路装置及びその製造方法
JP7352653B2 (ja) * 2019-12-20 2023-09-28 京セラ株式会社 光回路基板
JP2023008205A (ja) * 2021-07-05 2023-01-19 イビデン株式会社 配線基板
WO2024262042A1 (ja) * 2023-06-23 2024-12-26 株式会社レゾナック 光電複合配線板の製造方法、光電複合配線板、半導体パッケージ及び積層フィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4366751B2 (ja) * 1999-04-13 2009-11-18 凸版印刷株式会社 光・電気配線基板及び製造方法並びに実装基板
TWI239798B (en) * 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate
JP2002277694A (ja) * 2001-03-19 2002-09-25 Mitsubishi Electric Corp 光導波路および電気回路を有する基板およびその製造方法
JP2003098371A (ja) * 2001-09-20 2003-04-03 Fujitsu Ltd 平坦化電気配線を有する光配線基板
JP2003240997A (ja) * 2002-02-21 2003-08-27 Fujitsu Ltd 空間反射型構造を有する光集積回路の製造方法
JP4447428B2 (ja) * 2004-10-19 2010-04-07 新光電気工業株式会社 光導波路の製造方法
TWI390264B (zh) 2004-11-17 2013-03-21 Hitachi Chemical Co Ltd A photoelectric hybrid circuit mounting substrate and a transfer device using the same
JP2007004043A (ja) * 2005-06-27 2007-01-11 Nec Corp 配線基板、配線基板を用いたモジュール、およびモジュール集合体
JP5064109B2 (ja) 2007-05-11 2012-10-31 新光電気工業株式会社 光導波路及びその製造方法、並びに光電気混載基板及びその製造方法
JP2010039082A (ja) 2008-08-01 2010-02-18 Furukawa Electric Co Ltd:The 光回路基板およびその製造方法

Also Published As

Publication number Publication date
JP2011237503A (ja) 2011-11-24
US8693815B2 (en) 2014-04-08
US20110274388A1 (en) 2011-11-10

Similar Documents

Publication Publication Date Title
JP5395734B2 (ja) 光電気複合基板の製造方法
KR100720854B1 (ko) 광·전기배선기판, 실장기판 및 광전기배선기판의 제조방법
JP4260650B2 (ja) 光電気複合基板及びその製造方法
JP6437875B2 (ja) 光導波路装置及びその製造方法
JP5670169B2 (ja) 光導波路の製造方法
JP5313849B2 (ja) 光導波路装置及びその製造方法
JP5247880B2 (ja) 光電気配線基板および光モジュール
JPWO2001001176A1 (ja) 光・電気配線基板、実装基板及び光電気配線基板の製造方法
JP2009175418A (ja) 光電気混載基板及びその製造方法
JP5462073B2 (ja) 光導波路装置及びその製造方法
JP6084027B2 (ja) 光導波路装置及びその製造方法
JP5479310B2 (ja) 光導波路及びその製造方法と光導波路装置
JP4690870B2 (ja) 光電気集積配線基板及び光電気集積配線システム
JP6235878B2 (ja) 光導波路装置及びその製造方法
JP4624162B2 (ja) 光電気配線基板
JP4227471B2 (ja) 受発光素子内蔵光電気混載配線モジュールの製造方法
US9244224B2 (en) Optical waveguide device
JP7118731B2 (ja) 光導波路搭載基板、光送受信装置
JP5302177B2 (ja) 光導波路基板および光電気混載装置
JP5976769B2 (ja) 光導波路及び光導波路装置
JP2008111862A (ja) 光伝送基板、光電子混載基板、光モジュールおよび光電気回路システム
JP4698728B2 (ja) 光電気集積配線基板および光電気集積配線システム
JP4691196B2 (ja) 光電気集積配線基板及び光電気集積配線システム
CN119730022A (zh) 具有嵌入式光波导结构的柔性印刷电路板

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121218

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121218

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130730

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130917

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131008

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131018

R150 Certificate of patent or registration of utility model

Ref document number: 5395734

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150