JP5379971B2 - 接合複合体の製造方法 - Google Patents

接合複合体の製造方法 Download PDF

Info

Publication number
JP5379971B2
JP5379971B2 JP2007501114A JP2007501114A JP5379971B2 JP 5379971 B2 JP5379971 B2 JP 5379971B2 JP 2007501114 A JP2007501114 A JP 2007501114A JP 2007501114 A JP2007501114 A JP 2007501114A JP 5379971 B2 JP5379971 B2 JP 5379971B2
Authority
JP
Japan
Prior art keywords
nano
fluorine
damaged
polymer
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007501114A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007526147A (ja
JP2007526147A5 (enExample
Inventor
ダンツィガー・マンフレート
Original Assignee
イスト・イオーネンシュトラールテヒノロギー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イスト・イオーネンシュトラールテヒノロギー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング filed Critical イスト・イオーネンシュトラールテヒノロギー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
Publication of JP2007526147A publication Critical patent/JP2007526147A/ja
Publication of JP2007526147A5 publication Critical patent/JP2007526147A5/ja
Application granted granted Critical
Publication of JP5379971B2 publication Critical patent/JP5379971B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP2007501114A 2004-03-02 2005-03-01 接合複合体の製造方法 Expired - Fee Related JP5379971B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004011567.2 2004-03-02
DE200410011567 DE102004011567A1 (de) 2004-03-02 2004-03-02 Haftfester Verbund und Verfahren zur Herstellung
PCT/DE2005/000422 WO2005084940A1 (de) 2004-03-02 2005-03-01 Haftfester verbund und verfahren zur herstellung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011156703A Division JP5380496B2 (ja) 2004-03-02 2011-07-15 接合複合体

Publications (3)

Publication Number Publication Date
JP2007526147A JP2007526147A (ja) 2007-09-13
JP2007526147A5 JP2007526147A5 (enExample) 2013-01-10
JP5379971B2 true JP5379971B2 (ja) 2013-12-25

Family

ID=34877564

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007501114A Expired - Fee Related JP5379971B2 (ja) 2004-03-02 2005-03-01 接合複合体の製造方法
JP2011156703A Expired - Fee Related JP5380496B2 (ja) 2004-03-02 2011-07-15 接合複合体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011156703A Expired - Fee Related JP5380496B2 (ja) 2004-03-02 2011-07-15 接合複合体

Country Status (6)

Country Link
US (1) US7955697B2 (enExample)
EP (1) EP1725398A1 (enExample)
JP (2) JP5379971B2 (enExample)
KR (1) KR101197324B1 (enExample)
DE (1) DE102004011567A1 (enExample)
WO (1) WO2005084940A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2308112C1 (ru) * 2005-12-26 2007-10-10 Общество с ограниченной ответственностью "Восток" Анодная многослойная пленка
DE102007040098A1 (de) * 2007-08-24 2009-02-26 Elringklinger Ag Trägerfolie
RU2339110C1 (ru) 2007-11-12 2008-11-20 Ооо "Восток" Многослойный анод
DE202008015506U1 (de) 2008-01-17 2009-02-19 Vostock Ltd. Mehrschichtige Anode
DE102008040782A1 (de) * 2008-07-28 2010-02-04 Robert Bosch Gmbh Bauteilverbund sowie Verfahren zum Herstellen eines Bauteilverbundes
RU2390978C1 (ru) * 2008-09-15 2010-05-27 Игорь Валерьевич Реутов Способ формирования проводящих дорожек в пористой полимерной пленке
WO2010078527A2 (en) * 2008-12-31 2010-07-08 Saint-Gobain Performance Plastics Corporation Multilayer polymeric articles and methods for making same
RU2402830C1 (ru) * 2009-09-17 2010-10-27 Владимир Владимирович Слепцов Пленочный конденсатор
DE102014005441A1 (de) 2014-04-11 2015-10-29 Elena Danziger Verfahren zur Herstellung eines haftfesten Verbundes
GB2536650A (en) 2015-03-24 2016-09-28 Augmedics Ltd Method and system for combining video-based and optic-based augmented reality in a near eye display
US12458411B2 (en) 2017-12-07 2025-11-04 Augmedics Ltd. Spinous process clamp
US11980507B2 (en) 2018-05-02 2024-05-14 Augmedics Ltd. Registration of a fiducial marker for an augmented reality system
US11766296B2 (en) 2018-11-26 2023-09-26 Augmedics Ltd. Tracking system for image-guided surgery
US12178666B2 (en) 2019-07-29 2024-12-31 Augmedics Ltd. Fiducial marker
US11980506B2 (en) 2019-07-29 2024-05-14 Augmedics Ltd. Fiducial marker
US11382712B2 (en) 2019-12-22 2022-07-12 Augmedics Ltd. Mirroring in image guided surgery
US11389252B2 (en) 2020-06-15 2022-07-19 Augmedics Ltd. Rotating marker for image guided surgery
US12239385B2 (en) 2020-09-09 2025-03-04 Augmedics Ltd. Universal tool adapter
US11896445B2 (en) 2021-07-07 2024-02-13 Augmedics Ltd. Iliac pin and adapter
US12150821B2 (en) 2021-07-29 2024-11-26 Augmedics Ltd. Rotating marker and adapter for image-guided surgery
WO2023021450A1 (en) 2021-08-18 2023-02-23 Augmedics Ltd. Stereoscopic display and digital loupe for augmented-reality near-eye display
WO2023203521A1 (en) 2022-04-21 2023-10-26 Augmedics Ltd. Systems and methods for medical image visualization
EP4587881A1 (en) 2022-09-13 2025-07-23 Augmedics Ltd. Augmented reality eyewear for image-guided medical intervention

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB816641A (en) * 1957-03-20 1959-07-15 Britl Dielectric Res Ltd Improvements in the manufacture of metallised polytetrafluoroethylene and products thereof
US4199650A (en) * 1978-11-07 1980-04-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modification of the electrical and optical properties of polymers
US4390567A (en) * 1981-03-11 1983-06-28 The United States Of America As Represented By The United States Department Of Energy Method of forming graded polymeric coatings or films
JPH0397861A (ja) 1989-09-07 1991-04-23 Matsushita Electric Ind Co Ltd コンデンサ用金属化フィルムの製造方法
US5389195A (en) * 1991-03-07 1995-02-14 Minnesota Mining And Manufacturing Company Surface modification by accelerated plasma or ions
JPH04346651A (ja) * 1991-05-24 1992-12-02 Hitachi Ltd メタライジング法
JPH09143684A (ja) * 1995-11-17 1997-06-03 Nissin Electric Co Ltd 金属膜被覆高分子物品及びその製造方法
US6342307B1 (en) * 1997-11-24 2002-01-29 The Board Of Trustees Of The University Of Illinois Embedded cluster metal-polymeric micro interface and process for producing the same
JP3066863B2 (ja) * 1997-12-17 2000-07-17 日新電機株式会社 耐紫外線物品の製造方法
DE19817388A1 (de) * 1998-04-20 1999-10-28 Atotech Deutschland Gmbh Verfahren zum Herstellen von metallisierten Substratmaterialien
JP2000340166A (ja) * 1999-05-27 2000-12-08 Sony Corp 成膜方法及び成膜物
JP2000345322A (ja) * 1999-05-31 2000-12-12 Sony Corp ポリカーボネート基板及びその表面処理方法
US6887332B1 (en) * 2000-04-21 2005-05-03 International Business Machines Corporation Patterning solution deposited thin films with self-assembled monolayers
DE10058822A1 (de) 2000-11-27 2002-06-20 Danziger Manfred Verfahren zur Bearbeitung von Trägerfolien durch Bestrahlen mit Schwerionen
JP2003049013A (ja) * 2001-08-08 2003-02-21 Tadamasa Fujimura プラズマアシストによるイオンプレーティング法を用いた２層フレキシブル基板の製法
DE10163437A1 (de) * 2001-12-21 2003-07-17 Karlsruhe Forschzent Verfahren zur haftfesten Beschichtung von Fluorpolymeren und Verwendung der haftfesten Beschichtung
DE10234614B3 (de) 2002-07-24 2004-03-04 Fractal Ag Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess

Also Published As

Publication number Publication date
JP2007526147A (ja) 2007-09-13
KR20060125883A (ko) 2006-12-06
JP5380496B2 (ja) 2014-01-08
US20080035266A1 (en) 2008-02-14
WO2005084940A1 (de) 2005-09-15
EP1725398A1 (de) 2006-11-29
US7955697B2 (en) 2011-06-07
JP2012020583A (ja) 2012-02-02
DE102004011567A1 (de) 2005-09-22
KR101197324B1 (ko) 2012-11-05

Similar Documents

Publication Publication Date Title
JP5380496B2 (ja) 接合複合体
JP2007526147A5 (enExample)
KR101141619B1 (ko) 초소수성 표면을 갖는 재료의 제조방법 및 이에 따라제조된 초소수성 재료
KR101305072B1 (ko) 탄소 섬유상 금속 복합체 및 그 제조방법
CN1189125A (zh) 无粘合剂柔韧层合制品及其制作方法
Lee et al. Fabrication of flexible field emitter arrays of carbon nanotubes using self-assembly monolayers
CN111902971A (zh) 箔状功能材料及其制造方法
KR20150052034A (ko) 가요성 회로의 제조방법
Gan et al. Boosting the supercapacitive properties of polypyrrole with chitosan and hybrid silver nanoparticles/nanoclusters
KR101802932B1 (ko) 면상발열체와, 면상발열체의 제조방법
JP2008208458A (ja) 無応力の軟性回路基板の製造装置及び方法
JPWO2014175432A1 (ja) Ｄｌｃ層を有する構造体及びｄｌｃ層の生成方法
CN103596374B (zh) 在柔性电路板上形成导电线路的方法
KR20140120672A (ko) 전자파 차폐특성이 우수한 탄소나노섬유 복합체의 제조방법
JP2006049893A (ja) フレキシブル回路基板用積層構造体の製造方法
CN103813639A (zh) 在柔性基板上形成导电线路的方法
JP5651849B2 (ja) 樹脂皮膜の形成方法及び樹脂皮膜の形成システム
JP2012237032A (ja) プラズマ発生装置による絶縁性膜層の成膜方法、プラズマ発生装置による導電性膜層の成膜方法、絶縁性膜層、導電性膜層およびプラズマ発生装置
JP2005317888A (ja) 電磁波遮蔽用フィルターの製造方法
KR20160051430A (ko) 투명 전극 필름의 제조방법 및 투명 전극 필름
JP4734573B2 (ja) マイクロ・ナノ構造体の製造方法及びマイクロ・ナノ構造体
CN107214946A (zh) 一种复频电流体动力学打印装置及其打印方法
JP7298786B2 (ja) プリント配線基板用積層体および多層プリント配線基板用接合体
CN1251142A (zh) 薄膜的制造方法及制造装置,薄膜层叠体和电子元件
JP7613728B2 (ja) 炭素化合物及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080130

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080130

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100527

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110118

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110415

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110422

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110517

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110524

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110617

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110715

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120522

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120821

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120828

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20121116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121119

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130910

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130930

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees