KR101197324B1 - 접착 본드 및 그 제조 방법 - Google Patents

접착 본드 및 그 제조 방법 Download PDF

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Publication number
KR101197324B1
KR101197324B1 KR1020067017864A KR20067017864A KR101197324B1 KR 101197324 B1 KR101197324 B1 KR 101197324B1 KR 1020067017864 A KR1020067017864 A KR 1020067017864A KR 20067017864 A KR20067017864 A KR 20067017864A KR 101197324 B1 KR101197324 B1 KR 101197324B1
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KR
South Korea
Prior art keywords
substrate material
nano
adhesive bond
nanocomposite
transition region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067017864A
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English (en)
Korean (ko)
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KR20060125883A (ko
Inventor
만프레드 단지게르
Original Assignee
이스트 이오넨스트랄테크놀로지 게엠베하
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Publication of KR20060125883A publication Critical patent/KR20060125883A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020067017864A 2004-03-02 2005-03-01 접착 본드 및 그 제조 방법 Expired - Fee Related KR101197324B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004011567.2 2004-03-02
DE200410011567 DE102004011567A1 (de) 2004-03-02 2004-03-02 Haftfester Verbund und Verfahren zur Herstellung
PCT/DE2005/000422 WO2005084940A1 (de) 2004-03-02 2005-03-01 Haftfester verbund und verfahren zur herstellung

Publications (2)

Publication Number Publication Date
KR20060125883A KR20060125883A (ko) 2006-12-06
KR101197324B1 true KR101197324B1 (ko) 2012-11-05

Family

ID=34877564

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067017864A Expired - Fee Related KR101197324B1 (ko) 2004-03-02 2005-03-01 접착 본드 및 그 제조 방법

Country Status (6)

Country Link
US (1) US7955697B2 (enExample)
EP (1) EP1725398A1 (enExample)
JP (2) JP5379971B2 (enExample)
KR (1) KR101197324B1 (enExample)
DE (1) DE102004011567A1 (enExample)
WO (1) WO2005084940A1 (enExample)

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* Cited by examiner, † Cited by third party
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RU2308112C1 (ru) * 2005-12-26 2007-10-10 Общество с ограниченной ответственностью "Восток" Анодная многослойная пленка
DE102007040098A1 (de) * 2007-08-24 2009-02-26 Elringklinger Ag Trägerfolie
RU2339110C1 (ru) 2007-11-12 2008-11-20 Ооо "Восток" Многослойный анод
DE202008015506U1 (de) 2008-01-17 2009-02-19 Vostock Ltd. Mehrschichtige Anode
DE102008040782A1 (de) * 2008-07-28 2010-02-04 Robert Bosch Gmbh Bauteilverbund sowie Verfahren zum Herstellen eines Bauteilverbundes
RU2390978C1 (ru) * 2008-09-15 2010-05-27 Игорь Валерьевич Реутов Способ формирования проводящих дорожек в пористой полимерной пленке
WO2010078527A2 (en) * 2008-12-31 2010-07-08 Saint-Gobain Performance Plastics Corporation Multilayer polymeric articles and methods for making same
RU2402830C1 (ru) * 2009-09-17 2010-10-27 Владимир Владимирович Слепцов Пленочный конденсатор
DE102014005441A1 (de) 2014-04-11 2015-10-29 Elena Danziger Verfahren zur Herstellung eines haftfesten Verbundes
GB2536650A (en) 2015-03-24 2016-09-28 Augmedics Ltd Method and system for combining video-based and optic-based augmented reality in a near eye display
US12458411B2 (en) 2017-12-07 2025-11-04 Augmedics Ltd. Spinous process clamp
US11980507B2 (en) 2018-05-02 2024-05-14 Augmedics Ltd. Registration of a fiducial marker for an augmented reality system
US11766296B2 (en) 2018-11-26 2023-09-26 Augmedics Ltd. Tracking system for image-guided surgery
US12178666B2 (en) 2019-07-29 2024-12-31 Augmedics Ltd. Fiducial marker
US11980506B2 (en) 2019-07-29 2024-05-14 Augmedics Ltd. Fiducial marker
US11382712B2 (en) 2019-12-22 2022-07-12 Augmedics Ltd. Mirroring in image guided surgery
US11389252B2 (en) 2020-06-15 2022-07-19 Augmedics Ltd. Rotating marker for image guided surgery
US12239385B2 (en) 2020-09-09 2025-03-04 Augmedics Ltd. Universal tool adapter
US11896445B2 (en) 2021-07-07 2024-02-13 Augmedics Ltd. Iliac pin and adapter
US12150821B2 (en) 2021-07-29 2024-11-26 Augmedics Ltd. Rotating marker and adapter for image-guided surgery
WO2023021450A1 (en) 2021-08-18 2023-02-23 Augmedics Ltd. Stereoscopic display and digital loupe for augmented-reality near-eye display
WO2023203521A1 (en) 2022-04-21 2023-10-26 Augmedics Ltd. Systems and methods for medical image visualization
EP4587881A1 (en) 2022-09-13 2025-07-23 Augmedics Ltd. Augmented reality eyewear for image-guided medical intervention

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GB816641A (en) * 1957-03-20 1959-07-15 Britl Dielectric Res Ltd Improvements in the manufacture of metallised polytetrafluoroethylene and products thereof
US4199650A (en) * 1978-11-07 1980-04-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modification of the electrical and optical properties of polymers
US4390567A (en) * 1981-03-11 1983-06-28 The United States Of America As Represented By The United States Department Of Energy Method of forming graded polymeric coatings or films
JPH0397861A (ja) 1989-09-07 1991-04-23 Matsushita Electric Ind Co Ltd コンデンサ用金属化フィルムの製造方法
US5389195A (en) * 1991-03-07 1995-02-14 Minnesota Mining And Manufacturing Company Surface modification by accelerated plasma or ions
JPH04346651A (ja) * 1991-05-24 1992-12-02 Hitachi Ltd メタライジング法
JPH09143684A (ja) * 1995-11-17 1997-06-03 Nissin Electric Co Ltd 金属膜被覆高分子物品及びその製造方法
US6342307B1 (en) * 1997-11-24 2002-01-29 The Board Of Trustees Of The University Of Illinois Embedded cluster metal-polymeric micro interface and process for producing the same
JP3066863B2 (ja) * 1997-12-17 2000-07-17 日新電機株式会社 耐紫外線物品の製造方法
DE19817388A1 (de) * 1998-04-20 1999-10-28 Atotech Deutschland Gmbh Verfahren zum Herstellen von metallisierten Substratmaterialien
JP2000340166A (ja) * 1999-05-27 2000-12-08 Sony Corp 成膜方法及び成膜物
JP2000345322A (ja) * 1999-05-31 2000-12-12 Sony Corp ポリカーボネート基板及びその表面処理方法
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JP2003049013A (ja) * 2001-08-08 2003-02-21 Tadamasa Fujimura プラズマアシストによるイオンプレーティング法を用いた２層フレキシブル基板の製法
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DE10234614B3 (de) 2002-07-24 2004-03-04 Fractal Ag Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess

Also Published As

Publication number Publication date
JP2007526147A (ja) 2007-09-13
KR20060125883A (ko) 2006-12-06
JP5380496B2 (ja) 2014-01-08
JP5379971B2 (ja) 2013-12-25
US20080035266A1 (en) 2008-02-14
WO2005084940A1 (de) 2005-09-15
EP1725398A1 (de) 2006-11-29
US7955697B2 (en) 2011-06-07
JP2012020583A (ja) 2012-02-02
DE102004011567A1 (de) 2005-09-22

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