JP5380496B2 - 接合複合体 - Google Patents
接合複合体 Download PDFInfo
- Publication number
- JP5380496B2 JP5380496B2 JP2011156703A JP2011156703A JP5380496B2 JP 5380496 B2 JP5380496 B2 JP 5380496B2 JP 2011156703 A JP2011156703 A JP 2011156703A JP 2011156703 A JP2011156703 A JP 2011156703A JP 5380496 B2 JP5380496 B2 JP 5380496B2
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- JP
- Japan
- Prior art keywords
- nano
- nanocomposite
- composite
- transition region
- ptfe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
・ ポリマーの表面に、密な金属層を形成せず5〜20nmの範囲内の寸法を有する金属微粒子の状態で被覆するように金属を適用する。この場合の方法条件(ガラス変移温度以下の温度)はポリマー表面に影響が生じない様に選択する。
・次にポリマー表面をガラス転移温度以上にまで加熱しそして該微粒子がポリマーの表面層中に少なくとも半分まで、しかしポリマー中に完全には埋め込まれないように導入する。冷却した後には、ポリマー表面から未だ飛び出している粒子が該表面にしっかり係留されている。
・次いでこの様に予備処理された表面に新たに金属を析出させ、その際に密な金属層が形成される様に方法を誘導する。この場合には新たに加わった金属はポリマーの表面から突き出している金属微粒子と結合する。ポリマー中に埋め込まれている粒子部分によってポリマー表面にしっかり係留された金属層が生じる。
少なくとも20μmの厚さのPTFE−表面層を持つガラス繊維織物−PTFE−複合材料よりなるシート状材料(1)を減圧室中で周期的にイオン源の所に通しそしてその際に向けられたイオンビームで加工する。イオンは5keVの電圧で加速されている。イオン源とシート表面との間の距離は約10cmである。プロセスガスとしてアルゴンを2×10−4mbarの圧力で使用する。照射密度は1mA/cm2である。この方法はシート全面が約1分の効果的な露光時間が達成されるまでの間実施する。その後にPTFE表面層は図1あるいは図2に概略的に示す様に、2〜6μmの範囲に亙って、ナノ岩礁部(3)を持つナノ破損部(2)を有している。PTFE−表面層はイオン照射によって活性化され、すなわちポリマー分子が物理的におよび/または化学的に励起されている。時間的に遅れることなく、その後にPTFE表面層の励起したナノ破損領域を、電磁管によって銅粒子をナノ破損したPTFE表面に適用しそしてこれにPTFE−表面層のナノ破損した領域(2)の別のイオン衝撃を交互に行う様にして更に加工する。カソードスパッタリング法による銅粒子の適用およびさらなるイオン衝撃を約3秒の時間的リズムで交互に行い、その際に粒子数、即ち適用速度を段階的に高める。従って両方の方法はあたかも一様な全方法として織り込まれる。ナノ破損したPTFE−表面上の銅微粒子の適用およびイオン衝撃の交互加工の(PTFE−表面層の全ての面積要素に関して)約20秒の作用時間の後に、密封された銅層(4)が形成され、これを次に電磁管中でのカソードスパッタリングによって0.3〜1.0μmの層厚までに形成する。
表面が既にイオンスパッタリング技術によって所定の加工段階で加工されそして図1および2に示した、ナノ岩礁(3)を持つナノ破損した表面構造(2)を有しているポリエチレンテレフタレート(PET)(1)を、減圧室においてイオン源からのイオン照射で8×10−4mbarの圧力で3kVのビーム電圧に通してそして活性化する。活性化は約20秒の有効加工時間の間に行う。直ぐ次に電磁管によって、ナノ岩礁(3)を持つナノ破損された表面構造(2)を持つ活性化されたシート表面に酸素雰囲気でアルミニウム微粒子を適用し、このアルミニウム微粒子を塗工する間に酸素によって専ら酸化アルミニウム微粒子に酸化する。このカソードスパッタリング法と交互にPET−シート(1)を新たにイオン源の所に通す。カソードスパッタリング法およびイオン衝撃は交互に、即ち約3秒の時間交代で、両方の方法の効果があたかも全方法にオーバーラップするように行う。交互のカソードスパッタリング法とイオン衝撃との約20秒の有効加工時間の後に、PET、アルミニウムおよび酸化アルミニウムよりなるナノ複合材料(5)を含む変移領域(6)がPET−基体(1)から酸化アルミニウム(4)に向って生じ、そのナノ複合材料(5)の内部では変移領域(6)のPET−基体(1)を向く側からPETの割合が高く、変移領域(6)のPET−基体(1)に背を向ける側で酸化アルミニウムの割合の多いナノ複合材料(5)の方に変移している。この変移領域(6)の上に次に、酸素の添加下にアルミニウムを熱で蒸発させ、それを酸素によって酸化しそして酸化アルミニウムとして変移領域(6)の表面に析出させることによって、5×10−3〜7×10−3mbarの圧力のもとで酸化アルミニウムを適用する。この方法は10〜20μmの酸化アルミニウム層厚になるまで続ける。
2・・・ナノ破損領域
3・・・ナノ岩礁
4・・・他の材料
5・・・ナノ複合材料
6・・・変移領域
Claims (2)
- 表面および表面近傍の固体領域に弗素系ポリマーを有する基体材料と他の材料である銅及び/又はアルミニウムとの接合複合体において、接合される物質(1,4)相互の間に、基体材料のナノ岩礁(3)及び前記他の材料の微粒子を有するナノ組織化されたナノ複合材料(5)を有する変移領域(6)が、該変移領域が20nm〜20μmの層厚を有しそして専らナノ複合材料(5)で形成されており、該ナノ複合体は基体材料(1)と他の材料(4)で構成されそして基体材料(1)と他の材料(4)との割合が基体材料(1)の直ぐ近くの専ら基体材料から他の材料(4)の直ぐ近くの専ら他の材料に亙って変化するように形成されており、その結果基体材料(1)が他の材料(4)中でナノ組織化されて変移することを特徴とする、上記接合複合体。
- 変移領域(6)が銅及び/又はアルミニウムの金属成分および/または金属化合物を含有するナノ複合材料(5)を有する、請求項1に記載の接合複合体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410011567 DE102004011567A1 (de) | 2004-03-02 | 2004-03-02 | Haftfester Verbund und Verfahren zur Herstellung |
DE102004011567.2 | 2004-03-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007501114A Division JP5379971B2 (ja) | 2004-03-02 | 2005-03-01 | 接合複合体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012020583A JP2012020583A (ja) | 2012-02-02 |
JP5380496B2 true JP5380496B2 (ja) | 2014-01-08 |
Family
ID=34877564
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007501114A Expired - Fee Related JP5379971B2 (ja) | 2004-03-02 | 2005-03-01 | 接合複合体の製造方法 |
JP2011156703A Expired - Fee Related JP5380496B2 (ja) | 2004-03-02 | 2011-07-15 | 接合複合体 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007501114A Expired - Fee Related JP5379971B2 (ja) | 2004-03-02 | 2005-03-01 | 接合複合体の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7955697B2 (ja) |
EP (1) | EP1725398A1 (ja) |
JP (2) | JP5379971B2 (ja) |
KR (1) | KR101197324B1 (ja) |
DE (1) | DE102004011567A1 (ja) |
WO (1) | WO2005084940A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007040098A1 (de) | 2007-08-24 | 2009-02-26 | Elringklinger Ag | Trägerfolie |
RU2339110C1 (ru) | 2007-11-12 | 2008-11-20 | Ооо "Восток" | Многослойный анод |
DE102008005008A1 (de) | 2008-01-17 | 2009-07-23 | Vostock Ltd. | Mehrschichtige Anode |
DE102008040782A1 (de) * | 2008-07-28 | 2010-02-04 | Robert Bosch Gmbh | Bauteilverbund sowie Verfahren zum Herstellen eines Bauteilverbundes |
WO2010078527A2 (en) * | 2008-12-31 | 2010-07-08 | Saint-Gobain Performance Plastics Corporation | Multilayer polymeric articles and methods for making same |
DE102014005441A1 (de) | 2014-04-11 | 2015-10-29 | Elena Danziger | Verfahren zur Herstellung eines haftfesten Verbundes |
GB2536650A (en) | 2015-03-24 | 2016-09-28 | Augmedics Ltd | Method and system for combining video-based and optic-based augmented reality in a near eye display |
EP3787543A4 (en) | 2018-05-02 | 2022-01-19 | Augmedics Ltd. | REGISTRATION OF A REFERENCE MARK FOR AN AUGMENTED REALITY SYSTEM |
US11766296B2 (en) | 2018-11-26 | 2023-09-26 | Augmedics Ltd. | Tracking system for image-guided surgery |
US11980506B2 (en) | 2019-07-29 | 2024-05-14 | Augmedics Ltd. | Fiducial marker |
US11896445B2 (en) | 2021-07-07 | 2024-02-13 | Augmedics Ltd. | Iliac pin and adapter |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB816641A (en) * | 1957-03-20 | 1959-07-15 | Britl Dielectric Res Ltd | Improvements in the manufacture of metallised polytetrafluoroethylene and products thereof |
US4199650A (en) * | 1978-11-07 | 1980-04-22 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Modification of the electrical and optical properties of polymers |
US4390567A (en) * | 1981-03-11 | 1983-06-28 | The United States Of America As Represented By The United States Department Of Energy | Method of forming graded polymeric coatings or films |
JPH0397861A (ja) * | 1989-09-07 | 1991-04-23 | Matsushita Electric Ind Co Ltd | コンデンサ用金属化フィルムの製造方法 |
US5389195A (en) | 1991-03-07 | 1995-02-14 | Minnesota Mining And Manufacturing Company | Surface modification by accelerated plasma or ions |
JPH04346651A (ja) * | 1991-05-24 | 1992-12-02 | Hitachi Ltd | メタライジング法 |
JPH09143684A (ja) * | 1995-11-17 | 1997-06-03 | Nissin Electric Co Ltd | 金属膜被覆高分子物品及びその製造方法 |
US6342307B1 (en) * | 1997-11-24 | 2002-01-29 | The Board Of Trustees Of The University Of Illinois | Embedded cluster metal-polymeric micro interface and process for producing the same |
JP3066863B2 (ja) * | 1997-12-17 | 2000-07-17 | 日新電機株式会社 | 耐紫外線物品の製造方法 |
DE19817388A1 (de) * | 1998-04-20 | 1999-10-28 | Atotech Deutschland Gmbh | Verfahren zum Herstellen von metallisierten Substratmaterialien |
JP2000340166A (ja) * | 1999-05-27 | 2000-12-08 | Sony Corp | 成膜方法及び成膜物 |
JP2000345322A (ja) * | 1999-05-31 | 2000-12-12 | Sony Corp | ポリカーボネート基板及びその表面処理方法 |
US6887332B1 (en) * | 2000-04-21 | 2005-05-03 | International Business Machines Corporation | Patterning solution deposited thin films with self-assembled monolayers |
DE10058822A1 (de) | 2000-11-27 | 2002-06-20 | Danziger Manfred | Verfahren zur Bearbeitung von Trägerfolien durch Bestrahlen mit Schwerionen |
JP2003049013A (ja) * | 2001-08-08 | 2003-02-21 | Tadamasa Fujimura | プラズマアシストによるイオンプレーティング法を用いた2層フレキシブル基板の製法 |
DE10163437A1 (de) * | 2001-12-21 | 2003-07-17 | Karlsruhe Forschzent | Verfahren zur haftfesten Beschichtung von Fluorpolymeren und Verwendung der haftfesten Beschichtung |
DE10234614B3 (de) | 2002-07-24 | 2004-03-04 | Fractal Ag | Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess |
-
2004
- 2004-03-02 DE DE200410011567 patent/DE102004011567A1/de not_active Withdrawn
-
2005
- 2005-03-01 WO PCT/DE2005/000422 patent/WO2005084940A1/de active Application Filing
- 2005-03-01 EP EP05715086A patent/EP1725398A1/de not_active Withdrawn
- 2005-03-01 US US10/589,293 patent/US7955697B2/en not_active Expired - Fee Related
- 2005-03-01 JP JP2007501114A patent/JP5379971B2/ja not_active Expired - Fee Related
- 2005-03-01 KR KR1020067017864A patent/KR101197324B1/ko not_active IP Right Cessation
-
2011
- 2011-07-15 JP JP2011156703A patent/JP5380496B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012020583A (ja) | 2012-02-02 |
JP2007526147A (ja) | 2007-09-13 |
US20080035266A1 (en) | 2008-02-14 |
DE102004011567A1 (de) | 2005-09-22 |
KR20060125883A (ko) | 2006-12-06 |
EP1725398A1 (de) | 2006-11-29 |
US7955697B2 (en) | 2011-06-07 |
WO2005084940A1 (de) | 2005-09-15 |
JP5379971B2 (ja) | 2013-12-25 |
KR101197324B1 (ko) | 2012-11-05 |
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