JP5373970B2 - 電解銅箔及びその製造方法 - Google Patents
電解銅箔及びその製造方法 Download PDFInfo
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- JP5373970B2 JP5373970B2 JP2012522711A JP2012522711A JP5373970B2 JP 5373970 B2 JP5373970 B2 JP 5373970B2 JP 2012522711 A JP2012522711 A JP 2012522711A JP 2012522711 A JP2012522711 A JP 2012522711A JP 5373970 B2 JP5373970 B2 JP 5373970B2
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- copper foil
- electrolytic copper
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- iodine
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 252
- 239000011889 copper foil Substances 0.000 title claims description 216
- 238000004519 manufacturing process Methods 0.000 title claims description 40
- 239000011630 iodine Substances 0.000 claims description 73
- 229910052740 iodine Inorganic materials 0.000 claims description 73
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 72
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 63
- 229910001416 lithium ion Inorganic materials 0.000 claims description 63
- 238000010438 heat treatment Methods 0.000 claims description 57
- 238000005452 bending Methods 0.000 claims description 50
- 239000000460 chlorine Substances 0.000 claims description 40
- 229910052801 chlorine Inorganic materials 0.000 claims description 40
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 39
- 229910052802 copper Inorganic materials 0.000 claims description 37
- 239000010949 copper Substances 0.000 claims description 37
- 239000003792 electrolyte Substances 0.000 claims description 27
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- 239000008151 electrolyte solution Substances 0.000 claims description 19
- 239000007773 negative electrode material Substances 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 11
- 238000001556 precipitation Methods 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 description 76
- 230000000052 comparative effect Effects 0.000 description 42
- 238000000034 method Methods 0.000 description 18
- 230000000704 physical effect Effects 0.000 description 16
- 239000011888 foil Substances 0.000 description 15
- 230000008602 contraction Effects 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 230000003746 surface roughness Effects 0.000 description 12
- 239000000243 solution Substances 0.000 description 11
- 238000005868 electrolysis reaction Methods 0.000 description 10
- 238000009864 tensile test Methods 0.000 description 9
- 238000007599 discharging Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Substances [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 4
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000009614 chemical analysis method Methods 0.000 description 3
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000011149 active material Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XLVAVZLFABUPKX-UHFFFAOYSA-J S(=O)(=O)([O-])[O-].[Cu+4].S(=O)(=O)([O-])[O-] Chemical compound S(=O)(=O)([O-])[O-].[Cu+4].S(=O)(=O)([O-])[O-] XLVAVZLFABUPKX-UHFFFAOYSA-J 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001804 chlorine Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 150000002496 iodine Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000035777 life prolongation Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
- H01M2004/027—Negative electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Description
銅箔としての基本物性の対比: 表1、表2及び図面を参照しつつ、実施例と比較例との対比を行うこととする。
1. 引張り試験用の1cm×10cmの短冊状の銅箔試料を、大気雰囲気中で所定の加熱温度(特殊法の加熱温度350℃、その他180℃)で60分間の加熱処理を行い、放冷する。
2. その後、当該試料を折り曲げ、15kgの負荷をかけた状態で1分間の180°曲げ応力を負荷して折曲部を形成し、元の短冊形状に戻す。
3. 引張り試験機にて、引張強さと伸び率とを室温雰囲気中で測定する。
4. 評価項目
・耐熱引張り強さ(耐熱折り曲げ引張り試験手順の(2)を省略したもの)
・耐熱折り曲げ引張り強さ
Claims (14)
- 銅電解液を電解することにより得られる電解銅箔であって、
電解銅箔中のヨウ素含有量が0.003質量%以上であることを特徴とする電解銅箔。 - 前記ヨウ素含有量が、0.03質量%以下であることを特徴とする請求項1に記載の電解銅箔。
- 塩素含有量が、0.0018質量%以下の範囲にある請求項1又は請求項2に記載の電解銅箔。
- Rzjisの値が、0.70μm〜2.0μmの範囲にある析出面を備える請求項1〜請求項4のいずれかに記載の電解銅箔。
- 常態引張強さ(F0)の値が、48kgf/mm2〜72kgf/mm2の範囲である請求項1〜請求項5のいずれかに記載の電解銅箔。
- 180℃×60分の加熱処理後の熱後引張強さ(Fa)の値が、38kgf/mm2〜72kgf/mm2である請求項1〜請求項6のいずれかに記載の電解銅箔。
- 銅電解液を電解することにより得られる電解銅箔であって、
常態引張強さ(F 0 )の値が、48kgf/mm 2 〜72kgf/mm 2 であり、且つ、350℃×60分の加熱処理後の熱後引張強さ(Fb)の値が、30kgf/mm2以上であることを特徴とする電解銅箔。 - バルク厚さが18μm±1.8μmの場合において、180℃×60分の加熱処理後の耐屈曲試験での折り曲げ回数が、3000回以上である請求項1〜請求項9のいずれかに記載の電解銅箔。
- 請求項1〜請求項10のいずれかに記載の電解銅箔の表面に表面処理を施したことを特徴とする表面処理銅箔。
- 請求項1〜請求項11のいずれかに記載の電解銅箔の製造方法であって、
銅電解液として、ヨウ素濃度が1.5mg/L〜15.0mg/Lの範囲の硫酸酸性硫酸銅電解液を用いることを特徴とする電解銅箔の製造方法。 - 塩素濃度が1.0mg/L以下である硫酸酸性硫酸銅電解液を用いる請求項12に記載の電解銅箔の製造方法。
- 請求項11に記載の表面処理銅箔に負極活物質を担持したことを特徴とするリチウムイオン二次電池用負極。
Priority Applications (1)
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JP2012522711A JP5373970B2 (ja) | 2010-07-01 | 2011-07-01 | 電解銅箔及びその製造方法 |
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JP2010151503 | 2010-07-01 | ||
JP2010151503 | 2010-07-01 | ||
JP2012522711A JP5373970B2 (ja) | 2010-07-01 | 2011-07-01 | 電解銅箔及びその製造方法 |
PCT/JP2011/065147 WO2012002526A1 (ja) | 2010-07-01 | 2011-07-01 | 電解銅箔及びその製造方法 |
Publications (2)
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JPWO2012002526A1 JPWO2012002526A1 (ja) | 2013-08-29 |
JP5373970B2 true JP5373970B2 (ja) | 2013-12-18 |
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Country Status (4)
Country | Link |
---|---|
JP (1) | JP5373970B2 (ja) |
KR (2) | KR101385760B1 (ja) |
CN (2) | CN105386088B (ja) |
WO (1) | WO2012002526A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3569741A1 (en) | 2018-05-16 | 2019-11-20 | Iljin Materials Co., Ltd. | Electrolytic copper foil and secondary battery using the same |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140041804A (ko) * | 2011-06-30 | 2014-04-04 | 후루카와 덴키 고교 가부시키가이샤 | 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지 |
JP5722813B2 (ja) * | 2012-03-02 | 2015-05-27 | Jx日鉱日石金属株式会社 | 電解銅箔及び二次電池用負極集電体 |
CN104583461A (zh) * | 2012-06-27 | 2015-04-29 | 古河电气工业株式会社 | 电解铜箔、锂离子二次电池的负电极以及锂离子二次电池 |
JP5698196B2 (ja) * | 2012-08-17 | 2015-04-08 | Jx日鉱日石金属株式会社 | 電解銅箔、並びにこれを用いた二次電池集電体及び二次電池 |
TWI518210B (zh) * | 2013-01-31 | 2016-01-21 | 三井金屬鑛業股份有限公司 | 電解銅箔、該電解銅箔之製造方法及使用該電解銅箔而得之表面處理銅箔 |
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KR101385761B1 (ko) | 2014-04-17 |
WO2012002526A1 (ja) | 2012-01-05 |
CN105386088B (zh) | 2018-06-29 |
CN102959135B (zh) | 2016-03-09 |
KR20130006504A (ko) | 2013-01-16 |
CN102959135A (zh) | 2013-03-06 |
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