JP5370861B2 - 口金付ランプおよび照明器具 - Google Patents
口金付ランプおよび照明器具 Download PDFInfo
- Publication number
- JP5370861B2 JP5370861B2 JP2010149410A JP2010149410A JP5370861B2 JP 5370861 B2 JP5370861 B2 JP 5370861B2 JP 2010149410 A JP2010149410 A JP 2010149410A JP 2010149410 A JP2010149410 A JP 2010149410A JP 5370861 B2 JP5370861 B2 JP 5370861B2
- Authority
- JP
- Japan
- Prior art keywords
- electric wire
- substrate
- lamp
- opening
- insulating case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 239000007787 solid Substances 0.000 claims abstract description 20
- 238000003780 insertion Methods 0.000 claims description 55
- 230000037431 insertion Effects 0.000 claims description 55
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- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 description 21
- 230000001070 adhesive effect Effects 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 18
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- 229910052751 metal Inorganic materials 0.000 description 11
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- 238000010292 electrical insulation Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229920002050 silicone resin Polymers 0.000 description 9
- 238000009429 electrical wiring Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
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- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 239000012770 industrial material Substances 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010149410A JP5370861B2 (ja) | 2010-06-30 | 2010-06-30 | 口金付ランプおよび照明器具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010149410A JP5370861B2 (ja) | 2010-06-30 | 2010-06-30 | 口金付ランプおよび照明器具 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013153203A Division JP5517014B2 (ja) | 2013-07-24 | 2013-07-24 | 口金付ランプおよび照明器具 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012014924A JP2012014924A (ja) | 2012-01-19 |
JP2012014924A5 JP2012014924A5 (zh) | 2012-08-09 |
JP5370861B2 true JP5370861B2 (ja) | 2013-12-18 |
Family
ID=45601123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010149410A Active JP5370861B2 (ja) | 2010-06-30 | 2010-06-30 | 口金付ランプおよび照明器具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5370861B2 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5555371B2 (ja) * | 2012-02-17 | 2014-07-23 | パナソニック株式会社 | 照明用光源装置 |
WO2013124925A1 (ja) * | 2012-02-23 | 2013-08-29 | パナソニック株式会社 | ランプ |
JP5988844B2 (ja) * | 2012-11-22 | 2016-09-07 | 日立アプライアンス株式会社 | 照明装置 |
KR102066611B1 (ko) * | 2013-01-10 | 2020-01-15 | 엘지이노텍 주식회사 | 조명 장치 |
KR102066612B1 (ko) * | 2013-01-10 | 2020-01-16 | 엘지이노텍 주식회사 | 조명 장치 |
JP6183644B2 (ja) * | 2013-06-28 | 2017-08-23 | ウシオ電機株式会社 | Led電球 |
JP6175325B2 (ja) * | 2013-09-12 | 2017-08-02 | 株式会社エス・ケー・ジー | 照明装置 |
JP6286791B2 (ja) * | 2013-12-10 | 2018-03-07 | パナソニックIpマネジメント株式会社 | 光源ユニット及びそれを用いた照明器具 |
JP6222466B2 (ja) * | 2014-03-24 | 2017-11-01 | 東芝ライテック株式会社 | ランプ装置および照明器具 |
JP5763240B1 (ja) * | 2014-03-31 | 2015-08-12 | アイリスオーヤマ株式会社 | Led照明装置 |
JP2015204299A (ja) * | 2015-06-23 | 2015-11-16 | アイリスオーヤマ株式会社 | Led照明装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129501A (ja) * | 2008-12-01 | 2010-06-10 | Toshiba Lighting & Technology Corp | 照明装置および照明器具 |
JP3159084U (ja) * | 2010-02-18 | 2010-05-06 | アイリスオーヤマ株式会社 | Led電球 |
-
2010
- 2010-06-30 JP JP2010149410A patent/JP5370861B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012014924A (ja) | 2012-01-19 |
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