JP5349742B2 - 表面検査方法及び表面検査装置 - Google Patents

表面検査方法及び表面検査装置 Download PDF

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Publication number
JP5349742B2
JP5349742B2 JP2006187344A JP2006187344A JP5349742B2 JP 5349742 B2 JP5349742 B2 JP 5349742B2 JP 2006187344 A JP2006187344 A JP 2006187344A JP 2006187344 A JP2006187344 A JP 2006187344A JP 5349742 B2 JP5349742 B2 JP 5349742B2
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Japan
Prior art keywords
light
optical system
wafer
inspection object
inspection
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JP2006187344A
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Japanese (ja)
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JP2008014848A (ja
JP2008014848A5 (enExample
Inventor
隆志 大川
健司 三友
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2006187344A priority Critical patent/JP5349742B2/ja
Priority to US11/822,469 priority patent/US7616299B2/en
Publication of JP2008014848A publication Critical patent/JP2008014848A/ja
Publication of JP2008014848A5 publication Critical patent/JP2008014848A5/ja
Priority to US12/576,580 priority patent/US7864310B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006187344A 2006-07-07 2006-07-07 表面検査方法及び表面検査装置 Expired - Fee Related JP5349742B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006187344A JP5349742B2 (ja) 2006-07-07 2006-07-07 表面検査方法及び表面検査装置
US11/822,469 US7616299B2 (en) 2006-07-07 2007-07-06 Surface inspection method and surface inspection apparatus
US12/576,580 US7864310B2 (en) 2006-07-07 2009-10-09 Surface inspection method and surface inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006187344A JP5349742B2 (ja) 2006-07-07 2006-07-07 表面検査方法及び表面検査装置

Publications (3)

Publication Number Publication Date
JP2008014848A JP2008014848A (ja) 2008-01-24
JP2008014848A5 JP2008014848A5 (enExample) 2008-12-04
JP5349742B2 true JP5349742B2 (ja) 2013-11-20

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Family Applications (1)

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JP2006187344A Expired - Fee Related JP5349742B2 (ja) 2006-07-07 2006-07-07 表面検査方法及び表面検査装置

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US (2) US7616299B2 (enExample)
JP (1) JP5349742B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4755040B2 (ja) * 2006-07-25 2011-08-24 株式会社神戸製鋼所 傷検査装置、傷検査方法
JP5355922B2 (ja) * 2008-03-31 2013-11-27 株式会社日立ハイテクノロジーズ 欠陥検査装置
JP5222635B2 (ja) * 2008-06-25 2013-06-26 株式会社日立ハイテクノロジーズ 被検査物の検査装置及び検査方法
US8089374B2 (en) * 2008-11-18 2012-01-03 GE Lighting Solutions, LLC LED signal light
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
US8891079B2 (en) 2010-12-16 2014-11-18 Kla-Tencor Corp. Wafer inspection
JP5637841B2 (ja) * 2010-12-27 2014-12-10 株式会社日立ハイテクノロジーズ 検査装置
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
AU2012368323A1 (en) * 2012-01-31 2014-08-07 Compagnie Generale Des Etablissements Michelin Projecting features molded within submerged tread voids
JP5668113B2 (ja) * 2013-08-28 2015-02-12 株式会社日立ハイテクノロジーズ 欠陥検査装置
US9640449B2 (en) * 2014-04-21 2017-05-02 Kla-Tencor Corporation Automated inline inspection of wafer edge strain profiles using rapid photoreflectance spectroscopy
US10281898B2 (en) * 2015-07-16 2019-05-07 The Boeing Company Method and system for controlling automated operations on a workpiece
JP6752593B2 (ja) * 2016-03-07 2020-09-09 東レエンジニアリング株式会社 欠陥検査装置
JP7379104B2 (ja) * 2019-03-04 2023-11-14 東京エレクトロン株式会社 基板検査装置、基板処理装置、基板検査方法、及びコンピュータ読み取り可能な記録媒体
JP7215411B2 (ja) * 2019-12-26 2023-01-31 株式会社Sumco シリコンウェーハの欠陥検査方法
KR20240146444A (ko) * 2023-03-29 2024-10-08 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410278A (en) * 1979-07-20 1983-10-18 Hitachi, Ltd. Method and apparatus for appearance inspection
JPS5722239U (enExample) * 1980-07-11 1982-02-04
US4598997A (en) * 1982-02-15 1986-07-08 Rca Corporation Apparatus and method for detecting defects and dust on a patterned surface
US4672196A (en) * 1984-02-02 1987-06-09 Canino Lawrence S Method and apparatus for measuring properties of thin materials using polarized light
JPS62148945U (enExample) * 1986-03-13 1987-09-21
US4794264A (en) * 1987-05-08 1988-12-27 Qc Optics, Inc. Surface defect detection and confirmation system and method
US5144495A (en) * 1987-12-03 1992-09-01 Compugrade, Inc Systems for illuminating and evaluating surfaces
JP2538338B2 (ja) * 1989-05-30 1996-09-25 キヤノン株式会社 異物検査装置
JP2589411B2 (ja) * 1990-12-27 1997-03-12 シャープ株式会社 チップ位置検出方法
JP3126546B2 (ja) * 1992-04-27 2001-01-22 キヤノン株式会社 検査装置と検査方法、並びにこれを用いたシステム
US6271916B1 (en) * 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
JP3686160B2 (ja) * 1995-04-10 2005-08-24 株式会社日立ハイテクノロジーズ ウエハ表面検査方法および検査装置
US5903342A (en) * 1995-04-10 1999-05-11 Hitachi Electronics Engineering, Co., Ltd. Inspection method and device of wafer surface
CN1075222C (zh) * 1995-07-27 2001-11-21 松下电器产业株式会社 光盘装置
JPH0989796A (ja) * 1995-09-21 1997-04-04 Nikon Corp 光走査装置及び異物検査装置
AU6942998A (en) * 1997-03-31 1998-10-22 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6104481A (en) * 1997-11-11 2000-08-15 Kabushiki Kaisha Topcon Surface inspection apparatus
AU5566200A (en) * 1999-06-22 2001-01-09 Matsushita Electric Industrial Co., Ltd. Optical disk, optical disk device, and reproducing method for optical disk
KR100361962B1 (ko) * 2000-02-03 2002-11-23 (주) 셀라이트 웨이퍼 테두리 결함 검사장치 및 검사방법
JP3996728B2 (ja) * 2000-03-08 2007-10-24 株式会社日立製作所 表面検査装置およびその方法
JP2002098645A (ja) * 2000-09-26 2002-04-05 Hitachi Electronics Eng Co Ltd 基板の表面検査装置及び表面検査方法
JP2002188999A (ja) * 2000-12-21 2002-07-05 Hitachi Ltd 異物・欠陥検出装置及び検出方法
US7087203B2 (en) * 2000-11-17 2006-08-08 Nagaoka & Co., Ltd. Methods and apparatus for blood typing with optical bio-disc
US20030002043A1 (en) * 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US7083920B2 (en) * 2001-05-18 2006-08-01 Nagaoka & Co. Ltd. Surface assembly for immobilizing DNA capture probes in genetic assays using enzymatic reactions to generate signal in optical bio-discs and methods relating thereto
US7120228B2 (en) * 2004-09-21 2006-10-10 Jordan Valley Applied Radiation Ltd. Combined X-ray reflectometer and diffractometer
JP4500641B2 (ja) * 2004-09-29 2010-07-14 株式会社日立ハイテクノロジーズ 欠陥検査方法およびその装置
JP2006162500A (ja) * 2004-12-09 2006-06-22 Hitachi High-Technologies Corp 欠陥検査装置

Also Published As

Publication number Publication date
US20080007727A1 (en) 2008-01-10
JP2008014848A (ja) 2008-01-24
US7616299B2 (en) 2009-11-10
US20100026996A1 (en) 2010-02-04
US7864310B2 (en) 2011-01-04

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