JP5348442B2 - 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 - Google Patents
金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 Download PDFInfo
- Publication number
- JP5348442B2 JP5348442B2 JP2012542877A JP2012542877A JP5348442B2 JP 5348442 B2 JP5348442 B2 JP 5348442B2 JP 2012542877 A JP2012542877 A JP 2012542877A JP 2012542877 A JP2012542877 A JP 2012542877A JP 5348442 B2 JP5348442 B2 JP 5348442B2
- Authority
- JP
- Japan
- Prior art keywords
- metal case
- circuit board
- circuit
- circuit module
- bonding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012542877A JP5348442B2 (ja) | 2010-11-08 | 2011-11-01 | 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010249801 | 2010-11-08 | ||
JP2010249801 | 2010-11-08 | ||
PCT/JP2011/075190 WO2012063682A1 (fr) | 2010-11-08 | 2011-11-01 | Module de circuit comprenant un boîtier métallique fixé à celui-ci, ensemble module de circuit comprenant un boîtier métallique fixé à celui-ci, et procédé de production de module de circuit comprenant un boîtier métallique fixé à celui-ci |
JP2012542877A JP5348442B2 (ja) | 2010-11-08 | 2011-11-01 | 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5348442B2 true JP5348442B2 (ja) | 2013-11-20 |
JPWO2012063682A1 JPWO2012063682A1 (ja) | 2014-05-12 |
Family
ID=46050832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012542877A Active JP5348442B2 (ja) | 2010-11-08 | 2011-11-01 | 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5348442B2 (fr) |
WO (1) | WO2012063682A1 (fr) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63314899A (ja) * | 1987-06-18 | 1988-12-22 | Ibiden Co Ltd | 表面実装部品用シ−ルドパッケ−ジ |
JPH0338895A (ja) * | 1989-07-05 | 1991-02-19 | Nec Corp | 部品搭載用回路基板 |
JPH0478190A (ja) * | 1990-07-20 | 1992-03-12 | Furukawa Electric Co Ltd:The | 機能回路モジュール |
JPH0563346A (ja) * | 1991-08-12 | 1993-03-12 | Nec Kansai Ltd | チツプ型電子部品を搭載した装置 |
JP2007103749A (ja) * | 2005-10-06 | 2007-04-19 | Murata Mfg Co Ltd | シールドケース付き電子部品の製造方法 |
JP2007258741A (ja) * | 2007-05-23 | 2007-10-04 | Kyocera Corp | 電子部品、シールドカバー、多数個取り用母基板、配線基板及び電子機器 |
-
2011
- 2011-11-01 WO PCT/JP2011/075190 patent/WO2012063682A1/fr active Application Filing
- 2011-11-01 JP JP2012542877A patent/JP5348442B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63314899A (ja) * | 1987-06-18 | 1988-12-22 | Ibiden Co Ltd | 表面実装部品用シ−ルドパッケ−ジ |
JPH0338895A (ja) * | 1989-07-05 | 1991-02-19 | Nec Corp | 部品搭載用回路基板 |
JPH0478190A (ja) * | 1990-07-20 | 1992-03-12 | Furukawa Electric Co Ltd:The | 機能回路モジュール |
JPH0563346A (ja) * | 1991-08-12 | 1993-03-12 | Nec Kansai Ltd | チツプ型電子部品を搭載した装置 |
JP2007103749A (ja) * | 2005-10-06 | 2007-04-19 | Murata Mfg Co Ltd | シールドケース付き電子部品の製造方法 |
JP2007258741A (ja) * | 2007-05-23 | 2007-10-04 | Kyocera Corp | 電子部品、シールドカバー、多数個取り用母基板、配線基板及び電子機器 |
Also Published As
Publication number | Publication date |
---|---|
WO2012063682A1 (fr) | 2012-05-18 |
JPWO2012063682A1 (ja) | 2014-05-12 |
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