JP5348442B2 - 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 - Google Patents

金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 Download PDF

Info

Publication number
JP5348442B2
JP5348442B2 JP2012542877A JP2012542877A JP5348442B2 JP 5348442 B2 JP5348442 B2 JP 5348442B2 JP 2012542877 A JP2012542877 A JP 2012542877A JP 2012542877 A JP2012542877 A JP 2012542877A JP 5348442 B2 JP5348442 B2 JP 5348442B2
Authority
JP
Japan
Prior art keywords
metal case
circuit board
circuit
circuit module
bonding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012542877A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2012063682A1 (ja
Inventor
昌由 ▲高▼木
隆学 高森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2012542877A priority Critical patent/JP5348442B2/ja
Application granted granted Critical
Publication of JP5348442B2 publication Critical patent/JP5348442B2/ja
Publication of JPWO2012063682A1 publication Critical patent/JPWO2012063682A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2012542877A 2010-11-08 2011-11-01 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法 Active JP5348442B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012542877A JP5348442B2 (ja) 2010-11-08 2011-11-01 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010249801 2010-11-08
JP2010249801 2010-11-08
PCT/JP2011/075190 WO2012063682A1 (fr) 2010-11-08 2011-11-01 Module de circuit comprenant un boîtier métallique fixé à celui-ci, ensemble module de circuit comprenant un boîtier métallique fixé à celui-ci, et procédé de production de module de circuit comprenant un boîtier métallique fixé à celui-ci
JP2012542877A JP5348442B2 (ja) 2010-11-08 2011-11-01 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法

Publications (2)

Publication Number Publication Date
JP5348442B2 true JP5348442B2 (ja) 2013-11-20
JPWO2012063682A1 JPWO2012063682A1 (ja) 2014-05-12

Family

ID=46050832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012542877A Active JP5348442B2 (ja) 2010-11-08 2011-11-01 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法

Country Status (2)

Country Link
JP (1) JP5348442B2 (fr)
WO (1) WO2012063682A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314899A (ja) * 1987-06-18 1988-12-22 Ibiden Co Ltd 表面実装部品用シ−ルドパッケ−ジ
JPH0338895A (ja) * 1989-07-05 1991-02-19 Nec Corp 部品搭載用回路基板
JPH0478190A (ja) * 1990-07-20 1992-03-12 Furukawa Electric Co Ltd:The 機能回路モジュール
JPH0563346A (ja) * 1991-08-12 1993-03-12 Nec Kansai Ltd チツプ型電子部品を搭載した装置
JP2007103749A (ja) * 2005-10-06 2007-04-19 Murata Mfg Co Ltd シールドケース付き電子部品の製造方法
JP2007258741A (ja) * 2007-05-23 2007-10-04 Kyocera Corp 電子部品、シールドカバー、多数個取り用母基板、配線基板及び電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314899A (ja) * 1987-06-18 1988-12-22 Ibiden Co Ltd 表面実装部品用シ−ルドパッケ−ジ
JPH0338895A (ja) * 1989-07-05 1991-02-19 Nec Corp 部品搭載用回路基板
JPH0478190A (ja) * 1990-07-20 1992-03-12 Furukawa Electric Co Ltd:The 機能回路モジュール
JPH0563346A (ja) * 1991-08-12 1993-03-12 Nec Kansai Ltd チツプ型電子部品を搭載した装置
JP2007103749A (ja) * 2005-10-06 2007-04-19 Murata Mfg Co Ltd シールドケース付き電子部品の製造方法
JP2007258741A (ja) * 2007-05-23 2007-10-04 Kyocera Corp 電子部品、シールドカバー、多数個取り用母基板、配線基板及び電子機器

Also Published As

Publication number Publication date
WO2012063682A1 (fr) 2012-05-18
JPWO2012063682A1 (ja) 2014-05-12

Similar Documents

Publication Publication Date Title
TWI357784B (en) Printed wiring board and connection configuration
JP2007234781A (ja) 半導体装置及び放熱部材
US9245829B2 (en) Substrate structure, method of mounting semiconductor chip, and solid state relay
KR20010092350A (ko) 전자 회로 장치
JPWO2008047918A1 (ja) 電子機器のパッケージ構造及びパッケージ製造方法
KR100722481B1 (ko) 전자회로기판
TW201436667A (zh) 電路板
JP5348442B2 (ja) 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法
JP6239999B2 (ja) 電子部品収納用パッケージおよび電子装置
CN207531171U (zh) 一种柔性电路板焊接结构
CN111527596A (zh) 电路基板、电子部件搭载用基板及其制造方法
WO2015004952A1 (fr) Substrat de circuit
TW201804584A (zh) 雙側電子封裝件
US20110174525A1 (en) Method and Electronic Assembly to Attach a Component to a Substrate
US7633016B2 (en) Coupling structure between circuit board and frame member
JP5693748B2 (ja) 表面実装機により真空保持されるようにするための電気モジュール
JPWO2020162473A1 (ja) 樹脂多層基板および樹脂多層基板の製造方法
JP2015012091A (ja) 回路基板、回路モジュール、回路基板の製造方法及び回路モジュールの製造方法
US6049466A (en) Substrate with embedded member for improving solder joint strength
JP2005216884A (ja) 回路基板およびチップ部品実装方法
JP2003188521A5 (fr)
WO2020261969A1 (fr) Module électronique
US20080149380A1 (en) Material Board for Producing Hybrid Circuit Board with Metallic Terminal Plate and Method for Producing Hybrid Circuit Board
JP5461860B2 (ja) 電子回路ユニットの製造方法
JP4023093B2 (ja) 電子部品の固定方法

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130724

R150 Certificate of patent or registration of utility model

Ref document number: 5348442

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150