WO2012063682A1 - Module de circuit comprenant un boîtier métallique fixé à celui-ci, ensemble module de circuit comprenant un boîtier métallique fixé à celui-ci, et procédé de production de module de circuit comprenant un boîtier métallique fixé à celui-ci - Google Patents

Module de circuit comprenant un boîtier métallique fixé à celui-ci, ensemble module de circuit comprenant un boîtier métallique fixé à celui-ci, et procédé de production de module de circuit comprenant un boîtier métallique fixé à celui-ci Download PDF

Info

Publication number
WO2012063682A1
WO2012063682A1 PCT/JP2011/075190 JP2011075190W WO2012063682A1 WO 2012063682 A1 WO2012063682 A1 WO 2012063682A1 JP 2011075190 W JP2011075190 W JP 2011075190W WO 2012063682 A1 WO2012063682 A1 WO 2012063682A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal case
circuit board
circuit module
circuit
bonding material
Prior art date
Application number
PCT/JP2011/075190
Other languages
English (en)
Japanese (ja)
Inventor
昌由 高木
隆学 高森
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2012542877A priority Critical patent/JP5348442B2/ja
Publication of WO2012063682A1 publication Critical patent/WO2012063682A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a circuit module with a metal case in which electronic components are mounted on a circuit board.
  • the present invention also relates to a circuit module assembly with a metal case in which a plurality of circuit modules with a metal case are joined together.
  • the present invention relates to a method for manufacturing a circuit module with a metal case.
  • FIG. 6 shows the circuit module 90 with a metal case.
  • electronic components 101a, 101b, and 101c are mounted on a circuit board 100 on which a metal case land electrode 100a having a ground potential is formed.
  • the lower end 102a of the side wall of the metal case 102 provided with the ceiling is joined to the land electrode 100a for the metal case of the circuit board 100 so as to cover these electronic components 101a, 101b, and 101c.
  • Solder is used for joining the lower end 102a of the side wall and the land electrode 100a for the metal case.
  • the metal case land electrode 100a and the electronic component are avoided in order to avoid interference between the coating nozzle and the electronic components 101a and 101c already mounted on the substrate. A considerable clearance is provided between 101a and 101c.
  • the present invention provides a metal case land electrode for joining a circuit board and a metal case, and a metal case land capable of reducing a clearance to an electronic component mounted in the vicinity thereof. It is an object of the present invention to provide a circuit module with a metal case provided with a bonding material supply unit for supplying a conductive bonding material to an electrode.
  • the present invention provides a circuit module with a metal case configured as follows.
  • a circuit module with a metal case includes a circuit board having at least four sides, an electronic component mounted on the circuit board, and a metal case that covers the electronic component and is attached to the circuit board.
  • a metal case land electrode for attaching a metal case is formed in the vicinity of the side on the surface, and the metal case land electrode extends from the main electrode part to the side of the circuit board from the main electrode part.
  • a supply case wherein the metal case is bonded to the main electrode portion by a conductive bonding material.
  • a nozzle for applying a bonding material such as solder paste and an electronic component mounted on a substrate are provided between a land electrode for a metal case and the electronic component in order to avoid interference.
  • the clearance can be made as small as possible and can be eliminated in some cases.
  • the circuit module with a metal case can be reduced in size.
  • solder or a conductive adhesive can be used as the conductive bonding material.
  • the bonding material supply unit may be formed so as to reach the side of the circuit board. In this case, since the distance between the electronic component mounted on the circuit board and the bonding material supply unit increases, the bonding material application nozzle interferes with the electronic component when applying the bonding material to the bonding material supply unit. There is nothing to do.
  • the bonding material supply unit may be provided with a plurality of line-shaped electrodes. In this case, the liquid bonding material is smoothly supplied from the bonding material supply unit to the main electrode unit by capillary action.
  • metal case land electrode may be provided in the vicinity of two opposite sides of the circuit board, or may be provided in all of the vicinity of the four sides. A plurality of metal case land electrodes may be provided in the vicinity of one side.
  • circuit module assembly with a metal case is not only an intermediate manufactured in the middle of manufacturing a circuit module with a metal case, but also from an electronic component manufacturer that manufactured the circuit module assembly with a metal case.
  • the product is sold as a product to an electrical / electronic equipment manufacturer that manufactures electrical / electronic equipment using a circuit module with a case.
  • a discard area that does not belong to any circuit board is provided between the circuit board of one circuit module and the circuit board of another adjacent circuit module. It is preferable to make it. In this case, it becomes possible to provide a part or all of the bonding material supply section in the disposal area, and after dividing each circuit module with a metal case, the disposal area is discarded to attach the metal case. The remaining unnecessary bonding material of the used bonding material can be discarded at the same time, and no unnecessary bonding material remains in the circuit module with a metal case.
  • the circuit module with a metal case can be downsized.
  • FIG. 1A is an exploded perspective view showing a circuit module assembly 10a with a metal case according to the first embodiment of the present invention.
  • FIG.1 (b) is a perspective view which shows the circuit module aggregate
  • Fig.5 (a) is a top view which shows the circuit board aggregate
  • FIG.5 (b) is a top view which shows the circuit board aggregate
  • FIG. 1A and FIG. 1B show a circuit module assembly 10a with a metal case according to this embodiment.
  • FIG. 2 shows a circuit board assembly 11a of the circuit module assembly 10a with the metal case.
  • FIG. 3 shows a circuit module 10 with a metal case according to the present embodiment obtained by dividing the circuit module assembly 10a with a metal case.
  • circuit module assembly 10a with the metal case and the method of manufacturing the circuit module 10 with the metal case will be described to clarify these structures.
  • a circuit board assembly 11a in which a plurality of circuit boards 11 are integrated to prepare a plurality of circuit modules 10 with metal cases is prepared.
  • the circuit board assembly 11a is integrated with four circuit boards 11 for manufacturing four circuit modules with metal cases. It has become.
  • the circuit board assembly 11a is made of, for example, ceramic, glass, epoxy resin, or the like.
  • the circuit board assembly 11a is virtually provided with a dividing line 12 for later division into individual circuit modules 10 with metal cases.
  • the dividing line 12 corresponds to the side of the circuit board 11 of each circuit module 10 with a metal case.
  • two dividing lines 12 are formed in parallel between adjacent circuit boards 11 with a discard region 18 interposed therebetween (see FIG. 2).
  • the circuit board assembly 11a is virtually provided with a metal case mounting line 17b for mounting a metal case 17 described later.
  • circuit board assembly 11a On the surface of the circuit board assembly 11a, although not shown, electronic component land electrodes for mounting electronic components are formed.
  • the metal case land electrode 13 is formed on the metal case mounting line 17b on the surface of the circuit board assembly 11a.
  • the metal case land electrode 13 is formed by integrally forming a main electrode portion 13a and a bonding material supply portion 13b extending from the main electrode portion 13a.
  • the main electrode portion 13a is formed on the metal case attachment line 17b.
  • the bonding material supply unit 13b is formed by arranging a plurality (three) of line-shaped electrodes side by side. The leading end of the bonding material supply unit 13 b exceeds the adjacent dividing line 12 and reaches the disposal area 18.
  • the shape of the joining member supply part 13b may be one planar electrode instead of a plurality of line-shaped electrodes.
  • the metal case land electrode 13 is preferably grounded to the ground. In this case, the noise received by the metal case 17 can be discharged to the ground.
  • the electronic component 16 is mounted on the circuit board assembly 11a having such a structure. Specifically, the electronic component 16 is attached to the electronic component land electrode (not shown) of the circuit board assembly 11a by reflow soldering. For example, a capacitor, a resistor, a filter, an inductor, an IC, or the like is used as the electronic component 16.
  • a conductive bonding material is applied to the application region 14 where the bonding material supply portion 13b of the metal case land electrode 13 of the circuit board assembly 11a is formed.
  • a solder paste paste solder
  • a liquid conductive adhesive may be applied.
  • the coating nozzle for applying the solder paste does not interfere with the electronic component 16.
  • the circuit board assembly 11a is heated to melt the solder paste applied to the bonding material supply unit 13b.
  • the molten solder flows from the bonding material supply unit 13b to the main electrode unit 13a.
  • the solder for mounting the electronic component 16 is a solder for attaching a metal case. It is desirable to use one having a higher melting temperature.
  • the conductive adhesive is supplied from the bonding material supply part 13b to the main electrode part 13a without heating the circuit board assembly 11a. To flow.
  • the metal case 17 is arranged on each metal case attachment line 17b of the circuit board assembly 11a.
  • the metal case 17 is made of a case that is formed by bending a thin metal plate or the like, and has four side walls 17a.
  • the side wall 17 a may be provided with a notch so that the solder can easily spread inside the metal case 17.
  • the circuit board assembly 11 a is cooled or naturally cooled to solidify the molten solder on the main electrode portion 13 a of the metal case land electrode 13.
  • the lower end portion of the side wall 17a of the metal case 17 is soldered to the main electrode portion 13a.
  • the conductive adhesive is heated in reverse. Is cured, the lower end portion of the side wall 17a of the metal case 17 is attached to the main electrode portion 13a.
  • circuit module assembly 10a with the metal case is divided by the dividing line 12 of the circuit board assembly 11a to complete the individual circuit modules 10 with the metal case as shown in FIG.
  • the application area 13a where the solder paste for attaching the metal case is applied can be kept away from the electronic component 16 already mounted on the substrate. Therefore, in order to avoid interference between the solder paste coating nozzle and the electronic component mounted on the substrate, conventionally, the clearance provided between the wiring land and the electronic component is made as small as possible. It can be lost. As a result, the circuit module with a metal case can be reduced in size.
  • the present invention is not limited to the above-described contents, Various changes can be made along the spirit of the invention.
  • the number of circuit boards 11 formed in the circuit board assembly 11a is not limited to four as described above, and may be more or less.
  • one circuit board 11 may be prepared without using the circuit board assembly 11a, and a circuit module with a metal case may be manufactured using the circuit board 11.
  • FIG. 4 shows a circuit board assembly 11a of a circuit module assembly with a metal case according to the second embodiment.
  • the circuit board assembly 11a of the circuit module assembly with a metal case of the present embodiment has a length of the bonding material supply portion 23b of the metal case land electrode 23 as compared with the substrate assembly 11a of the first embodiment described above. It is short and its tip does not reach the dividing line 12.
  • reference numeral 23a denotes a main electrode portion
  • 24 denotes a coating region.
  • FIG. 5A shows a circuit board assembly 11a of a circuit module assembly with a metal case according to the third embodiment.
  • the bonding material supply portions 33b of the metal case land electrodes 33 formed on the circuit boards 11 adjacent to the circuit board assembly 11a are connected to each other. It is characterized by being.
  • 33a is a main electrode portion
  • 34 is a coating region.
  • the bonding material can be applied to the bonding material supply portions 33b of the two metal case land electrodes 33 by applying the bonding material to one application region 34.
  • Productivity of circuit modules with cases is improved.
  • the disposal area 18 formed between the adjacent circuit boards 11 is as shown in FIG. May be omitted.
  • the number of steps for dividing the circuit board assembly 11a can be reduced, and the productivity can be improved.
  • the number of circuit boards 11 that can be obtained from one circuit board assembly 11a can be increased, and the cost can be reduced.
  • Circuit module with metal case 10a Circuit module assembly with metal case 11: Circuit board 11a: Circuit board assembly 12: Dividing lines 13, 23, 33: Land electrodes for metal case 13a, 23a, 33a: Main electrode portion 13b, 23b, 33b: Bonding material supply unit 14, 24, 34: Application region 16: Electronic component 17: Metal case 17a: Side wall 17b: Metal case attachment line 18: Waste region

Abstract

Cette invention concerne un module de circuit plus compact comprenant un boîtier métallique fixé à celui-ci. Ledit module de circuit comprenant un boîtier métallique fixé à celui-ci est caractérisé en ce qu'il comprend : une carte de circuit imprimé présentant au moins quatre côtés ; un composant électronique monté sur ladite carte de circuit imprimé ; et un boîtier métallique fixé à la carte de circuit imprimé de façon à recouvrir le composant électronique. Le module de circuit comprenant un boîtier métallique fixé à celui-ci est en outre caractérisé par une électrode de terre de boîtier métallique pour fixer le boîtier métallique formé à proximité d'un côté sur la surface de la carte de circuit imprimé. Ladite électrode de terre de boîtier métallique est dotée d'une section d'électrode principale et d'une section d'alimentation en matériau de liaison qui s'étend dans la direction du côté de la carte de circuit imprimé à partir de la section d'électrode principale. Ledit boîtier métallique est relié à la section d'électrode principale au moyen d'un matériau de jonction conducteur.
PCT/JP2011/075190 2010-11-08 2011-11-01 Module de circuit comprenant un boîtier métallique fixé à celui-ci, ensemble module de circuit comprenant un boîtier métallique fixé à celui-ci, et procédé de production de module de circuit comprenant un boîtier métallique fixé à celui-ci WO2012063682A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012542877A JP5348442B2 (ja) 2010-11-08 2011-11-01 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-249801 2010-11-08
JP2010249801 2010-11-08

Publications (1)

Publication Number Publication Date
WO2012063682A1 true WO2012063682A1 (fr) 2012-05-18

Family

ID=46050832

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/075190 WO2012063682A1 (fr) 2010-11-08 2011-11-01 Module de circuit comprenant un boîtier métallique fixé à celui-ci, ensemble module de circuit comprenant un boîtier métallique fixé à celui-ci, et procédé de production de module de circuit comprenant un boîtier métallique fixé à celui-ci

Country Status (2)

Country Link
JP (1) JP5348442B2 (fr)
WO (1) WO2012063682A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314899A (ja) * 1987-06-18 1988-12-22 Ibiden Co Ltd 表面実装部品用シ−ルドパッケ−ジ
JPH0478190A (ja) * 1990-07-20 1992-03-12 Furukawa Electric Co Ltd:The 機能回路モジュール
JP2007103749A (ja) * 2005-10-06 2007-04-19 Murata Mfg Co Ltd シールドケース付き電子部品の製造方法
JP2007258741A (ja) * 2007-05-23 2007-10-04 Kyocera Corp 電子部品、シールドカバー、多数個取り用母基板、配線基板及び電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2870021B2 (ja) * 1989-07-05 1999-03-10 日本電気株式会社 部品搭載用回路基板
JPH0563346A (ja) * 1991-08-12 1993-03-12 Nec Kansai Ltd チツプ型電子部品を搭載した装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314899A (ja) * 1987-06-18 1988-12-22 Ibiden Co Ltd 表面実装部品用シ−ルドパッケ−ジ
JPH0478190A (ja) * 1990-07-20 1992-03-12 Furukawa Electric Co Ltd:The 機能回路モジュール
JP2007103749A (ja) * 2005-10-06 2007-04-19 Murata Mfg Co Ltd シールドケース付き電子部品の製造方法
JP2007258741A (ja) * 2007-05-23 2007-10-04 Kyocera Corp 電子部品、シールドカバー、多数個取り用母基板、配線基板及び電子機器

Also Published As

Publication number Publication date
JPWO2012063682A1 (ja) 2014-05-12
JP5348442B2 (ja) 2013-11-20

Similar Documents

Publication Publication Date Title
JP6257047B2 (ja) 多層電子機器アセンブリおよび３次元モジュールに電気回路素子を埋設する方法
CN103097282B (zh) 被配置成用于电气连接到印刷电路板上的气腔封装体以及其提供方法
JP4203666B2 (ja) 電子部品実装方法および電子部品実装構造
US5996222A (en) Soldering process with minimal thermal impact on substrate
KR20010092350A (ko) 전자 회로 장치
JPWO2008047918A1 (ja) 電子機器のパッケージ構造及びパッケージ製造方法
KR100722481B1 (ko) 전자회로기판
EP2709430A1 (fr) Structure de substrat, procédé de montage de puce semi-conductrice et relais à l'état solide
KR20140132880A (ko) 인쇄회로기판 어셈블리 및 그 제조방법
DE102011085170A1 (de) Steuermodul mit verklebter Trägerplatte
JPWO2020122180A1 (ja) 樹脂多層基板および電子機器
TW201436667A (zh) 電路板
JP6239999B2 (ja) 電子部品収納用パッケージおよび電子装置
JP5348442B2 (ja) 金属ケース付き回路モジュール、金属ケース付き回路モジュール集合体、および金属ケース付き回路モジュールの製造方法
CN207531171U (zh) 一种柔性电路板焊接结构
US20070215378A1 (en) Circuit board
JP6214030B2 (ja) 回路基板、回路モジュール、回路基板の製造方法及び回路モジュールの製造方法
US7633016B2 (en) Coupling structure between circuit board and frame member
WO2015004952A1 (fr) Substrat de circuit
US6049466A (en) Substrate with embedded member for improving solder joint strength
WO2020162473A1 (fr) Substrat multicouche en résine et procédé de production de substrat multicouche en résine
JP2003188521A5 (fr)
JP2014503115A (ja) 表面実装機により真空保持されるようにするための電気モジュール
JP2005216884A (ja) 回路基板およびチップ部品実装方法
WO2011040480A1 (fr) Carte de circuit imprimé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11840338

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2012542877

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11840338

Country of ref document: EP

Kind code of ref document: A1