JP5346593B2 - 官能基を有するかご開裂型シロキサン樹脂とその製造方法 - Google Patents
官能基を有するかご開裂型シロキサン樹脂とその製造方法 Download PDFInfo
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- JP5346593B2 JP5346593B2 JP2008558100A JP2008558100A JP5346593B2 JP 5346593 B2 JP5346593 B2 JP 5346593B2 JP 2008558100 A JP2008558100 A JP 2008558100A JP 2008558100 A JP2008558100 A JP 2008558100A JP 5346593 B2 JP5346593 B2 JP 5346593B2
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- JP
- Japan
- Prior art keywords
- group
- cage
- meth
- siloxane resin
- vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 239000011347 resin Substances 0.000 title claims abstract description 73
- 229920005989 resin Polymers 0.000 title claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 125000000524 functional group Chemical group 0.000 title claims description 15
- -1 siloxane compound Chemical class 0.000 claims abstract description 45
- 239000003054 catalyst Substances 0.000 claims abstract description 36
- 239000012454 non-polar solvent Substances 0.000 claims abstract description 32
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 31
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 27
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 18
- 125000000466 oxiranyl group Chemical group 0.000 claims abstract description 17
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 12
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 7
- 125000005843 halogen group Chemical group 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 76
- 238000003776 cleavage reaction Methods 0.000 claims description 41
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 27
- 238000006460 hydrolysis reaction Methods 0.000 claims description 22
- 230000007017 scission Effects 0.000 claims description 14
- 238000011067 equilibration Methods 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 9
- 238000009833 condensation Methods 0.000 claims description 8
- 230000005494 condensation Effects 0.000 claims description 8
- 230000036961 partial effect Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 abstract description 15
- 150000001875 compounds Chemical class 0.000 abstract description 11
- 239000002798 polar solvent Substances 0.000 abstract description 8
- 150000003377 silicon compounds Chemical class 0.000 abstract description 4
- 230000003301 hydrolyzing effect Effects 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 238000006068 polycondensation reaction Methods 0.000 abstract description 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 78
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 27
- 239000000243 solution Substances 0.000 description 25
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 19
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- 238000010992 reflux Methods 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 8
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 8
- 230000007062 hydrolysis Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- 230000035484 reaction time Effects 0.000 description 6
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- ZIFLDVXQTMSDJE-UHFFFAOYSA-N 3-[[dimethyl-[3-(2-methylprop-2-enoyloxy)propyl]silyl]oxy-dimethylsilyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](C)(C)O[Si](C)(C)CCCOC(=O)C(C)=C ZIFLDVXQTMSDJE-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- MFIBZDZRPYQXOM-UHFFFAOYSA-N [dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silyl]oxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C1OC1COCCC[Si](C)(C)O[Si](C)(C)CCCOCC1CO1 MFIBZDZRPYQXOM-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- FKPSBYZGRQJIMO-UHFFFAOYSA-M benzyl(triethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC1=CC=CC=C1 FKPSBYZGRQJIMO-UHFFFAOYSA-M 0.000 description 2
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 2
- 238000004949 mass spectrometry Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- YQJPWWLJDNCSCN-UHFFFAOYSA-N 1,3-diphenyltetramethyldisiloxane Chemical compound C=1C=CC=CC=1[Si](C)(C)O[Si](C)(C)C1=CC=CC=C1 YQJPWWLJDNCSCN-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- AMZNFNXOVYDPBW-UHFFFAOYSA-N 3-[[dimethyl(3-prop-2-enoyloxypropyl)silyl]oxy-dimethylsilyl]propyl prop-2-enoate Chemical compound C=CC(=O)OCCC[Si](C)(C)O[Si](C)(C)CCCOC(=O)C=C AMZNFNXOVYDPBW-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- UDKHNARLWNTSGT-UHFFFAOYSA-N [[dimethyl(2-methylprop-2-enoyloxymethyl)silyl]oxy-dimethylsilyl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC[Si](C)(C)O[Si](C)(C)COC(=O)C(C)=C UDKHNARLWNTSGT-UHFFFAOYSA-N 0.000 description 1
- JOQIXYHRBTZINZ-UHFFFAOYSA-N [[dimethyl(prop-2-enoyloxymethyl)silyl]oxy-dimethylsilyl]methyl prop-2-enoate Chemical compound C=CC(=O)OC[Si](C)(C)O[Si](C)(C)COC(=O)C=C JOQIXYHRBTZINZ-UHFFFAOYSA-N 0.000 description 1
- BKPKTOIGWIYKJZ-UHFFFAOYSA-N [bis(ethenyl)-methylsilyl]oxy-bis(ethenyl)-methylsilane Chemical compound C=C[Si](C=C)(C)O[Si](C)(C=C)C=C BKPKTOIGWIYKJZ-UHFFFAOYSA-N 0.000 description 1
- VZSZUXBTVQNMOY-UHFFFAOYSA-N [dimethyl(octyl)silyl]oxy-dimethyl-octylsilane Chemical compound CCCCCCCC[Si](C)(C)O[Si](C)(C)CCCCCCCC VZSZUXBTVQNMOY-UHFFFAOYSA-N 0.000 description 1
- WRFKIQJSBJCNCF-UHFFFAOYSA-N [dimethyl(pentyl)silyl]oxy-dimethyl-pentylsilane Chemical compound CCCCC[Si](C)(C)O[Si](C)(C)CCCCC WRFKIQJSBJCNCF-UHFFFAOYSA-N 0.000 description 1
- KYTGWYJWMAKBPN-UHFFFAOYSA-N [dimethyl(prop-2-enyl)silyl]oxy-dimethyl-prop-2-enylsilane Chemical compound C=CC[Si](C)(C)O[Si](C)(C)CC=C KYTGWYJWMAKBPN-UHFFFAOYSA-N 0.000 description 1
- YIIAFYZYURUBMN-UHFFFAOYSA-N [dimethyl(propyl)silyl]oxy-dimethyl-propylsilane Chemical compound CCC[Si](C)(C)O[Si](C)(C)CCC YIIAFYZYURUBMN-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000000668 atmospheric pressure chemical ionisation mass spectrometry Methods 0.000 description 1
- WUPZNKGVDMHMBS-UHFFFAOYSA-N azane;dihydrate Chemical compound [NH4+].[NH4+].[OH-].[OH-] WUPZNKGVDMHMBS-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- RYBVCZSZPZFJOK-UHFFFAOYSA-N butyl-[butyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound CCCC[Si](C)(C)O[Si](C)(C)CCCC RYBVCZSZPZFJOK-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- XUKFPAQLGOOCNJ-UHFFFAOYSA-N dimethyl(trimethylsilyloxy)silicon Chemical compound C[Si](C)O[Si](C)(C)C XUKFPAQLGOOCNJ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- XODWWDLLPURTOQ-UHFFFAOYSA-N ethyl-[ethyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound CC[Si](C)(C)O[Si](C)(C)CC XODWWDLLPURTOQ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- WILBTFWIBAOWLN-UHFFFAOYSA-N triethyl(triethylsilyloxy)silane Chemical compound CC[Si](CC)(CC)O[Si](CC)(CC)CC WILBTFWIBAOWLN-UHFFFAOYSA-N 0.000 description 1
- FCVNATXRSJMIDT-UHFFFAOYSA-N trihydroxy(phenyl)silane Chemical compound O[Si](O)(O)C1=CC=CC=C1 FCVNATXRSJMIDT-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- HILHCDFHSDUYNX-UHFFFAOYSA-N trimethoxy(pentyl)silane Chemical compound CCCCC[Si](OC)(OC)OC HILHCDFHSDUYNX-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- LZWMWONAYYGKMP-UHFFFAOYSA-N trimethyl-[methyl-bis[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silyl]oxysilane Chemical compound C1CC2OC2CC1CC[Si](C)(O[Si](C)(C)C)CCC1CC2OC2CC1 LZWMWONAYYGKMP-UHFFFAOYSA-N 0.000 description 1
- IVZTVZJLMIHPEY-UHFFFAOYSA-N triphenyl(triphenylsilyloxy)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 IVZTVZJLMIHPEY-UHFFFAOYSA-N 0.000 description 1
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Description
[R1R2 2SiO1/2]m[R1SiO3/2]n (2)
〔但し、繰り返し単位mの構造におけるR1はビニル基、アルキル基、フェニル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であり、繰り返し単位nの構造におけるR1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、(m+n)個あるR1のうちの少なくとも2つは不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基から選ばれた反応性有機官能基であり、かつ、繰り返し単位nにおいてn個あるR1のうち少なくとも1つは不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基を有する基から選ばれた反応性有機官能基であり、R2はメチル基を示す。mは1〜4の整数、nは8〜16の整数であり、mとnの和は10〜20である。〕で表されるかご開裂型シロキサン樹脂である。
R1SiX3 (1)
〔但し、R1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、Xはアルコキシ基、ハロゲン原子又はヒドロキシル基から選ばれた加水分解性基を示す〕で表される1種又は2種以上であって、少なくとも1種のR1は不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基であるケイ素化合物を、塩基性触媒存在下、非極性溶媒又は極性溶媒のどちらか一方又は両方を合わせた溶媒中で加水分解反応させると共に一部縮合させ、得られた重縮合物を更に非極性溶媒及び塩基性触媒の存在下で再縮合させ、得られた再縮合物にジシロキサン化合物を平衡化反応させることにより得られるかご開裂型シロキサン樹脂である。
R1SiX3 (1)
〔但し、R1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、Xはアルコキシ基、ハロゲン原子又はヒドロキシル基から選ばれた加水分解性基を示す〕で表される1種又は2種以上であって、少なくとも1種のR1は不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基であるケイ素化合物を、塩基性触媒存在下、非極性溶媒又は極性溶媒のどちらか一方又は両方を合わせた溶媒中で加水分解反応させると共に一部縮合させ、得られた重縮合物を更に非極性溶媒及び塩基性触媒の存在下で再縮合させ、得られた再縮合物にジシロキサン化合物を平衡化反応させることを特徴とするかご開裂型シロキサン樹脂の製造方法である。
(R1R2 2Si)2O (3)
(但し、R1はビニル基、アルキル基、フェニル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基から選択される1種または2種の基であり、R2はメチル基を示す)
[R1R2 2SiO1/2]m[R1SiO3/2]n (2)
[R1R2 2SiO1/2]m[R1SiO3/2]n (2)
(但し、mが1〜4、nが8〜16であり、mとnの和が10〜20)に相当する分子量範囲の数平均分子量とその面積比率をまとめた結果を示す。
Claims (11)
- 下記一般式(2)
[R1R2 2SiO1/2]m[R1SiO3/2]n (2)
〔但し、繰り返し単位mの構造におけるR1はビニル基、アルキル基、フェニル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であり、繰り返し単位nの構造におけるR1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、(m+n)個あるR1のうちの少なくとも2つは不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基から選ばれた反応性有機官能基であり、かつ、繰り返し単位nにおいてn個あるR1のうち少なくとも1つは不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基を有する基から選ばれた反応性有機官能基であり、R2はメチル基を示す。mは1〜4の整数、nは8〜16の整数であり、mとnの和は10〜20である。〕で表されるかご開裂型シロキサン樹脂。 - 数平均分子量Mnが600〜10000の範囲であり、GPCチャートにおける最大面積を有するピークの占める割合が50%以上である請求項1に記載のかご開裂型シロキサン樹脂。
- 数平均分子量Mnが900〜2000の範囲であり、分子量分散度(Mw/Mn)が1.0〜3.5である請求項1記載のかご開裂型シロキサン樹脂。
- 下記一般式(1)
R1SiX3 (1)
〔但し、R1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、Xはアルコキシ基、ハロゲン原子又はヒドロキシル基から選ばれた加水分解性基を示す〕で表される1種又は2種以上であって、少なくとも1種のR1は不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基であるケイ素化合物を、塩基性触媒存在下、非極性溶媒又は極性溶媒のどちらか一方又は両方を合わせた溶媒中で加水分解反応させると共に一部縮合させ、得られた重縮合物を更に非極性溶媒及び塩基性触媒の存在下で再縮合させ、得られた再縮合物にジシロキサン化合物を平衡化反応させることにより得られるかご開裂型シロキサン樹脂。 - ジシロキサン化合物が、下記一般式(3)
(R1R2 2Si)2O (3)
〔但し、R1はビニル基、アルキル基、フェニル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であり、R2はメチル基を示す〕で表される請求項4記載のかご開裂型シロキサン樹脂。 - 数平均分子量Mnが600〜10000の範囲であり、分子量分散度(Mw/Mn)が1.0〜3.5である請求項4記載のかご開裂型シロキサン樹脂。
- 下記一般式(1)
R1SiX3 (1)
〔但し、R1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、Xはアルコキシ基、ハロゲン原子又はヒドロキシル基から選ばれた加水分解性基を示す〕で表される1種又は2種以上であって、少なくとも1種のR1は不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基であるケイ素化合物を、塩基性触媒存在下、非極性溶媒又は極性溶媒のどちらか一方又は両方を合わせた溶媒中で加水分解反応させると共に一部縮合させ、得られた重縮合物を更に非極性溶媒及び塩基性触媒の存在下で再縮合させ、得られた再縮合物にジシロキサン化合物を平衡化反応させることを特徴とするかご開裂型シロキサン樹脂の製造方法。 - かご開裂型シロキサン樹脂が、下記一般式(2)
[R1R2 2SiO1/2]m[R1SiO3/2]n (2)
〔但し、繰り返し単位mの構造におけるR1はビニル基、アルキル基、フェニル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であり、繰り返し単位nの構造におけるR1はビニル基、アルキル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であって、(m+n)個あるR1のうちの少なくとも2つは不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基を有する基から選ばれた反応性有機官能基であり、かつ、繰り返し単位nにおいてn個あるR1のうち少なくとも1つは不飽和二重結合を有するビニル基、(メタ)アクリロイル基又はアリル基を有する基から選ばれた反応性有機官能基であり、R2はメチル基を示す。mは1〜4の整数、nは8〜16の整数であり、mとnの和は10〜20である〕で表される請求項7記載のかご開裂型シロキサン樹脂の製造方法。 - 再縮合物に対するジシロキサン化合物の平衡化反応は非極性溶媒及び塩基性触媒の存在下で行うものであって、塩基性触媒の使用量が再縮合物中の[R1SiO1.5]10で表される構造単位1モルに対して0.05〜0.15モルの範囲であり、かつ、ジシロキサン化合物が、下記一般式(3)
(R1R2 2Si)2O (3)
〔但し、R1はビニル基、アルキル基、フェニル基、(メタ)アクリロイル基、アリル基又はオキシラン環を有する基であり、R2はメチル基を示す〕で表される請求項7に記載のかご開裂型シロキサン樹脂の製造方法。 - 得られるかご開裂型シロキサン樹脂の数平均分子量Mnが600〜10000の範囲であり、分子量分散度(Mw/Mn)が1.0〜3.5である請求項7記載のかご開裂型シロキサン樹脂の製造方法。
- 再縮合物中の[R1SiO1.5]10で表される構造単位1モルに対し、ジシロキサン化合物を0.5〜4.0モルの範囲で加水分解付加させる請求項7に記載のかご開裂型シロキサン樹脂の製造方法。
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