JP5343359B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5343359B2
JP5343359B2 JP2008002170A JP2008002170A JP5343359B2 JP 5343359 B2 JP5343359 B2 JP 5343359B2 JP 2008002170 A JP2008002170 A JP 2008002170A JP 2008002170 A JP2008002170 A JP 2008002170A JP 5343359 B2 JP5343359 B2 JP 5343359B2
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semiconductor device
wire
layer
semiconductor chip
semiconductor
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Expired - Fee Related
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JP2008002170A
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Japanese (ja)
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JP2009164463A (ja
JP2009164463A5 (https=
Inventor
喜孝 愛場
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Fujitsu Semiconductor Ltd
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Fujitsu Semiconductor Ltd
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Priority to JP2008002170A priority Critical patent/JP5343359B2/ja
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Publication of JP2009164463A5 publication Critical patent/JP2009164463A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2008002170A 2008-01-09 2008-01-09 半導体装置の製造方法 Expired - Fee Related JP5343359B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008002170A JP5343359B2 (ja) 2008-01-09 2008-01-09 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008002170A JP5343359B2 (ja) 2008-01-09 2008-01-09 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009164463A JP2009164463A (ja) 2009-07-23
JP2009164463A5 JP2009164463A5 (https=) 2010-11-18
JP5343359B2 true JP5343359B2 (ja) 2013-11-13

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ID=40966705

Family Applications (1)

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JP2008002170A Expired - Fee Related JP5343359B2 (ja) 2008-01-09 2008-01-09 半導体装置の製造方法

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JP (1) JP5343359B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7821388B2 (ja) * 2020-05-29 2026-02-27 株式会社Ｓｓテクノ 半導体パッケージの製造方法および半導体パッケージ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4014912B2 (ja) * 2001-09-28 2007-11-28 株式会社ルネサステクノロジ 半導体装置
JP2005175019A (ja) * 2003-12-08 2005-06-30 Sharp Corp 半導体装置及び積層型半導体装置
JP2007059493A (ja) * 2005-08-23 2007-03-08 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

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Publication number Publication date
JP2009164463A (ja) 2009-07-23

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