JP5342608B2 - 材料厚みを測定する装置及びシステム - Google Patents
材料厚みを測定する装置及びシステム Download PDFInfo
- Publication number
- JP5342608B2 JP5342608B2 JP2011156181A JP2011156181A JP5342608B2 JP 5342608 B2 JP5342608 B2 JP 5342608B2 JP 2011156181 A JP2011156181 A JP 2011156181A JP 2011156181 A JP2011156181 A JP 2011156181A JP 5342608 B2 JP5342608 B2 JP 5342608B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor device
- substrate
- piezoelectric element
- piezoelectric
- piezoelectric sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/11—Analysing solids by measuring attenuation of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/228—Details, e.g. general constructional or apparatus details related to high temperature conditions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/840,485 | 2010-07-21 | ||
| US12/840,485 US8264129B2 (en) | 2010-07-21 | 2010-07-21 | Device and system for measuring material thickness |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012027020A JP2012027020A (ja) | 2012-02-09 |
| JP2012027020A5 JP2012027020A5 (https=) | 2012-11-29 |
| JP5342608B2 true JP5342608B2 (ja) | 2013-11-13 |
Family
ID=44584009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011156181A Expired - Fee Related JP5342608B2 (ja) | 2010-07-21 | 2011-07-15 | 材料厚みを測定する装置及びシステム |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8264129B2 (https=) |
| EP (1) | EP2410587A3 (https=) |
| JP (1) | JP5342608B2 (https=) |
| CN (1) | CN102346022A (https=) |
| CA (1) | CA2745558C (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19644079A1 (de) * | 1996-10-31 | 1998-05-07 | Focke & Co | Vorrichtung zum Herstellen von Verpackungen aus dünnem Verpackungsmaterial |
| WO2013063676A1 (en) * | 2010-11-05 | 2013-05-10 | National Research Council Of Canada | Ultrasonic transducer assembly and system for monitoring structural integrity |
| DE102012106236A1 (de) | 2012-07-11 | 2014-01-16 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Fügen von Keramikkörpern mittels eines Aktivhartlots, Baugruppe mit mindestens zwei miteinander gefügten Keramikkörpern, insbesondere Druckmesszelle |
| US20140144238A1 (en) * | 2012-11-28 | 2014-05-29 | General Electric Company | Sensor array for pipeline corrosion monitoring |
| JP6108523B2 (ja) * | 2012-12-07 | 2017-04-05 | 三菱重工業株式会社 | センサを備えた測定ツール |
| US9822470B2 (en) * | 2012-12-14 | 2017-11-21 | Intel Corporation | Flexible embedded interconnects |
| US10081887B2 (en) | 2012-12-14 | 2018-09-25 | Intel Corporation | Electrically functional fabric for flexible electronics |
| NO336558B1 (no) | 2012-12-20 | 2015-09-28 | Tecom Analytical Systems | Sensorsystem for korrosjonsovervåking |
| US10768066B2 (en) * | 2013-07-10 | 2020-09-08 | Sekisui Chemical Co., Ltd. | Piezoelectric sensor including overlapping cutout sections in a signal electrode, a first ground electrode, and a second electrode |
| US10545581B2 (en) * | 2017-10-05 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
| CN110815147B (zh) * | 2019-11-06 | 2022-07-22 | 青岛理工大学 | 一种由压电陶瓷驱动的微位移平台 |
| EP4208736A4 (en) * | 2020-09-03 | 2024-09-04 | National Research Council of Canada | DEVICE, SYSTEM AND METHOD FOR STRUCTURAL INTEGRITY MONITORING USING ULTRASOUND |
| AT524656B1 (de) * | 2021-03-01 | 2022-08-15 | Ac2T Res Gmbh | Vorrichtung zur in-situ Bestimmung der Veränderung der Wanddicke einer rohrförmigen Komponente |
| CN113834454B (zh) * | 2021-09-07 | 2024-01-26 | 青岛理工大学 | 单个超声探头实现宽范围润滑膜厚度测量的方法及验证平台 |
| JP7730739B2 (ja) * | 2021-12-06 | 2025-08-28 | 日立Geベルノバニュークリアエナジー株式会社 | 配管検査装置 |
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| US4926875A (en) | 1988-01-25 | 1990-05-22 | Baylor College Of Medicine | Implantable and extractable biological sensor probe |
| JPH02140991A (ja) * | 1988-11-22 | 1990-05-30 | Fujikura Ltd | フレキシブル印刷配線板 |
| US6413589B1 (en) * | 1988-11-29 | 2002-07-02 | Chou H. Li | Ceramic coating method |
| JP3039971B2 (ja) * | 1989-09-19 | 2000-05-08 | 株式会社日立製作所 | 接合型圧電装置及び製造方法並びに接合型圧電素子 |
| US5262696A (en) * | 1991-07-05 | 1993-11-16 | Rockwell International Corporation | Biaxial transducer |
| US5327895A (en) | 1991-07-10 | 1994-07-12 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic diagnosing system using ultrasonic probe |
| JPH0677555A (ja) * | 1992-08-27 | 1994-03-18 | Murata Mfg Co Ltd | 積層型圧電素子の製造方法 |
| DE69516444T2 (de) | 1994-03-11 | 2001-01-04 | Intravascular Research Ltd., London | Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung |
| US6225728B1 (en) | 1994-08-18 | 2001-05-01 | Agilent Technologies, Inc. | Composite piezoelectric transducer arrays with improved acoustical and electrical impedance |
| JP3114526B2 (ja) * | 1994-10-17 | 2000-12-04 | 株式会社村田製作所 | チップ型圧電共振部品 |
| WO1997008761A1 (en) * | 1995-08-28 | 1997-03-06 | Accuweb, Inc. | Ultrasonic transducer units for web edge detection |
| US5923115A (en) | 1996-11-22 | 1999-07-13 | Acuson Corporation | Low mass in the acoustic path flexible circuit interconnect and method of manufacture thereof |
| US6437989B1 (en) * | 1999-07-10 | 2002-08-20 | Endress + Hauser Gmbh + Co. | Circuit board with an electronic component and a method for producing a connection between the circuit board and the component |
| US6414417B1 (en) * | 1999-08-31 | 2002-07-02 | Kyocera Corporation | Laminated piezoelectric actuator |
| JP2002026411A (ja) * | 1999-10-01 | 2002-01-25 | Ngk Insulators Ltd | 圧電/電歪デバイス及びその製造方法 |
| US6915547B2 (en) * | 1999-10-01 | 2005-07-12 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device and method of manufacturing same |
| JP3427038B2 (ja) * | 2000-03-31 | 2003-07-14 | 京セラ株式会社 | 圧電装置の製造方法 |
| US6640634B2 (en) | 2000-03-31 | 2003-11-04 | Kabushiki Kaisha Toshiba | Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus |
| JP2001291907A (ja) * | 2000-04-06 | 2001-10-19 | Matsushita Electric Ind Co Ltd | 可撓性圧電素子 |
| DE10031793C1 (de) * | 2000-07-04 | 2002-02-07 | Peter Apel | Piezoelektrischer Sensor |
| JP3551141B2 (ja) | 2000-09-28 | 2004-08-04 | 松下電器産業株式会社 | 圧電体の製造方法 |
| US6490228B2 (en) | 2001-02-16 | 2002-12-03 | Koninklijke Philips Electronics N.V. | Apparatus and method of forming electrical connections to an acoustic transducer |
| JP2002271113A (ja) * | 2001-03-09 | 2002-09-20 | Ngk Insulators Ltd | 積層型誘電体共振器及び積層型誘電体フィルタ |
| US7291110B2 (en) | 2001-10-12 | 2007-11-06 | Boston Scientific Corporation | Catheter lesion diagnostics |
| JP3908512B2 (ja) * | 2001-11-16 | 2007-04-25 | セイコーインスツル株式会社 | 圧電トランスデューサ及び脈波検出装置 |
| US20040224482A1 (en) * | 2001-12-20 | 2004-11-11 | Kub Francis J. | Method for transferring thin film layer material to a flexible substrate using a hydrogen ion splitting technique |
| US6789427B2 (en) | 2002-09-16 | 2004-09-14 | General Electric Company | Phased array ultrasonic inspection method for industrial applications |
| US6822376B2 (en) | 2002-11-19 | 2004-11-23 | General Electric Company | Method for making electrical connection to ultrasonic transducer |
| US6925869B2 (en) | 2003-01-28 | 2005-08-09 | The Boeing Company | Ultrasonic fuel-gauging system |
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| US7293461B1 (en) | 2003-10-22 | 2007-11-13 | Richard Girndt | Ultrasonic tubulars inspection device |
| US7017245B2 (en) | 2003-11-11 | 2006-03-28 | General Electric Company | Method for making multi-layer ceramic acoustic transducer |
| US7156938B2 (en) | 2003-11-11 | 2007-01-02 | General Electric Company | Method for making multi-layer ceramic acoustic transducer |
| CN1890031B (zh) * | 2003-12-04 | 2010-09-29 | 皇家飞利浦电子股份有限公司 | 超声变换器和将倒装二维阵列技术应用于弯曲阵列的方法 |
| US7082655B2 (en) | 2003-12-18 | 2006-08-01 | Ge Inspection Technologies, Lp | Process for plating a piezoelectric composite |
| US8063540B2 (en) * | 2004-03-08 | 2011-11-22 | Emantec As | High frequency ultrasound transducers based on ceramic films |
| US7692559B2 (en) * | 2004-06-19 | 2010-04-06 | Face International Corp | Self-powered switch initiation system |
| US7420317B2 (en) * | 2004-10-15 | 2008-09-02 | Fujifilm Dimatix, Inc. | Forming piezoelectric actuators |
| JPWO2006040962A1 (ja) | 2004-10-15 | 2008-05-15 | オリンパスメディカルシステムズ株式会社 | 超音波振動子およびその製造方法 |
| ES2313298T3 (es) | 2005-02-03 | 2009-03-01 | Ge Inspection Technologies, Lp | Procedimiento para metalizar un material compuesto piezoelectrico. |
| US7127948B2 (en) * | 2005-02-17 | 2006-10-31 | The Boeing Company | Piezoelectric sensor, sensor array, and associated method for measuring pressure |
| KR100722370B1 (ko) | 2005-02-22 | 2007-05-29 | 주식회사 휴먼스캔 | 적층형 초음파 탐촉자 및 이의 제조방법 |
| US7369250B2 (en) * | 2005-03-25 | 2008-05-06 | Lockheed Martin Corporation | System and method to inspect components having non-parallel surfaces |
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| CN101237947B (zh) * | 2005-08-05 | 2013-03-27 | 皇家飞利浦电子股份有限公司 | 弯曲的二维阵列换能器 |
| CN101237946B (zh) * | 2005-08-08 | 2013-03-27 | 皇家飞利浦电子股份有限公司 | 超声换能器阵列 |
| JP4281726B2 (ja) * | 2005-10-11 | 2009-06-17 | 株式会社村田製作所 | 圧電磁器組成物、圧電磁器および圧電セラミック素子 |
| WO2007058668A1 (en) * | 2005-11-18 | 2007-05-24 | Imarx Therapeutics, Inc. | Ultrasound apparatus and method to treat an ischemic stroke |
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| JP2009276085A (ja) * | 2008-05-12 | 2009-11-26 | Nikko Kensa Service Kk | 曲面に追随する超音波探傷装置 |
| JP2010123845A (ja) * | 2008-11-21 | 2010-06-03 | Konica Minolta Medical & Graphic Inc | 有機圧電体、有機圧電材料、超音波振動子および超音波探触子 |
-
2010
- 2010-07-21 US US12/840,485 patent/US8264129B2/en not_active Expired - Fee Related
-
2011
- 2011-07-07 CA CA2745558A patent/CA2745558C/en not_active Expired - Fee Related
- 2011-07-14 EP EP11173957.9A patent/EP2410587A3/en not_active Ceased
- 2011-07-15 JP JP2011156181A patent/JP5342608B2/ja not_active Expired - Fee Related
- 2011-07-21 CN CN2011102178081A patent/CN102346022A/zh active Pending
-
2012
- 2012-08-06 US US13/567,274 patent/US20120294124A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP2410587A3 (en) | 2013-07-17 |
| EP2410587A2 (en) | 2012-01-25 |
| US20120019105A1 (en) | 2012-01-26 |
| JP2012027020A (ja) | 2012-02-09 |
| CN102346022A (zh) | 2012-02-08 |
| US8264129B2 (en) | 2012-09-11 |
| CA2745558A1 (en) | 2012-01-21 |
| CA2745558C (en) | 2018-09-04 |
| US20120294124A1 (en) | 2012-11-22 |
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