WO2022118965A1 - センサ装置及びセンサ装置を生産する方法 - Google Patents
センサ装置及びセンサ装置を生産する方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000010410 layer Substances 0.000 claims abstract description 86
- 239000011241 protective layer Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000002131 composite material Substances 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000002788 crimping Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 238000002474 experimental method Methods 0.000 description 7
- 238000012544 monitoring process Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910002115 bismuth titanate Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
Definitions
- the present invention relates to a sensor device and a method for producing a sensor device, and relates to a sensor device or the like that connects a sensor unit and a wiring unit.
- the inventors have proposed a sol-gel complex piezoelectric sensor (see Patent Document 1 and the like).
- Patent Document 2 discloses a structure including wiring of a sol-gel composite piezoelectric sensor.
- Patent Document 1 does not clarify the structure including wiring and the like.
- an object of the present invention is to provide a sensor device or the like suitable for wiring of a flexible sol-gel composite piezoelectric sensor.
- the first aspect of the present invention is a sensor device for connecting a sensor unit and a wiring unit, wherein the sensor unit is a solgel composite piezoelectric sensor, which is formed on the piezoelectric film layer and the piezoelectric film layer.
- the electrode layer is provided with a protective layer, the protective layer is covered except for a part of the electrode layer, the portion of the electrode layer not covered by the protective layer is flat, and the wiring portion is formed.
- An exterior portion including a signal line, the signal line having a crimping tip having a flat portion at the tip, and covering a portion of the electrode layer not covered by the protective layer and a portion not covered by the signal line.
- the exterior portion includes a pressure portion for pressing a flat portion of the crimping tip against a portion of the electrode layer not covered by the protective layer for crimping.
- the second aspect of the present invention is a sensor device on the first aspect, wherein the sensor portion includes a base material layer, the piezoelectric film layer is formed on the base material layer, and the protective layer is formed. Covers except for a part of the base material layer, the wiring portion includes a ground wire, and the ground wire is electrically bonded to a portion of the base material layer not covered by the protective layer. ..
- the third aspect of the present invention is a sensor device on the first or second side surface, wherein one end of the wiring portion is electrically connected to the sensor portion and the other end is electrically connected to the extension wiring portion.
- the heat-resistant temperature of the sensor unit, the wiring unit, and the pressurizing unit is higher than the heat-resistant temperature of the extension wiring unit.
- the fourth aspect of the present invention is a sensor device on any one of the first to third aspects, which includes at least an attachment portion that covers the sensor portion, and the attachment portion includes an attachment portion for attaching to an object. Be prepared.
- the fifth aspect of the present invention is the sensor device of the fourth aspect, and the attachment portion guarantees the transmission of ultrasonic waves between the object and the sensor portion in the attachment portion, and the attachment portion.
- An adjusting unit for adjusting between the sensor unit and the sensor unit is provided, and the adjusting unit includes a blocking unit that blocks reflected waves generated by the adjusting unit.
- the sixth aspect of the present invention is a method of producing a sensor device for connecting a sensor unit and a wiring unit, wherein the sensor unit is a solgel composite piezoelectric sensor, and the piezoelectric film layer and the piezoelectric film layer.
- the electrode layer formed on the electrode layer and the protective layer are provided, the protective layer is covered except for a part of the electrode layer, and the portion of the electrode layer not covered by the protective layer is flat and said.
- the wiring portion includes a signal line, and the signal line has a crimping tip having a flat portion at the tip thereof, and the portion of the electrode layer not covered with the protective layer by the exterior portion included in the sensor device and the portion.
- the flat portion of the crimping tip is pressed against the portion of the electrode layer not covered by the protective layer by the exterior step covering the uncovered portion of the signal line and the pressurizing portion provided in the exterior portion. Includes pressure step.
- the seventh aspect of the present invention is the method of the sixth aspect, wherein the sensor portion includes a base material layer, the piezoelectric film layer is formed on the base material layer, and the protective layer is formed.
- the wiring portion includes a ground wire, and the ground wire is electrically bonded to a portion of the base material layer that is not covered by the protective layer.
- the eighth aspect of the present invention is the method of the sixth or seventh aspect, in which one end of the wiring portion is electrically connected to the sensor portion and the other end is electrically connected to the extension wiring portion.
- the heat-resistant temperature of the sensor unit, the wiring unit, and the pressurizing unit is higher than the heat-resistant temperature of the extension wiring unit.
- a ninth aspect of the present invention is the method of any of the sixth to eighth aspects, comprising at least an attachment portion covering the sensor portion, the attachment portion comprising an attachment portion for attaching to an object. ..
- the tenth aspect of the present invention is the method of the ninth aspect, wherein the attachment part guarantees the transmission of ultrasonic waves between the object and the sensor part in the attachment part, and the attachment part and the attachment part.
- the adjustment unit includes an adjustment unit that adjusts between the sensor unit and the sensor unit, and the adjustment unit includes a blocking unit that blocks the reflected wave generated by the adjustment unit.
- the senor portion in the sensor portion, a certain distance can be provided between the sensitive portion and the wiring joint portion, and the flexibility can be maintained. Further, the exterior portion and the pressure portion can be used to achieve both heat resistance and mechanical strength.
- FIG. 1 is a diagram showing an example of a process of actually creating a sensor device.
- FIG. 2 is a diagram showing an example of a process of actually creating a sensor device.
- FIG. 3 is a diagram showing an example of a process of actually creating a sensor device.
- FIG. 4 is a diagram showing an example of a process of actually creating a sensor device. It is a figure which shows the measurement result by a prototype. It is a figure which shows an example of the piping monitoring system which monitors a piping by using the sensor device of FIG. FIG.
- FIG. 1 is a diagram showing an example of a specific configuration of the attachment unit 53.
- FIG. 2 is a diagram showing an example of a specific configuration of the attachment unit 53. The state where the attachment part and the sensor device are attached to the pipe is shown.
- FIG. 1 is a diagram for explaining a pipe thinning monitoring experiment conducted by the inventors.
- FIG. 2 is a diagram for explaining a pipe thinning monitoring experiment conducted by the inventors.
- FIG. 1 is a diagram showing the appearance of the sensor device 1 of the present invention.
- the sensor device 1 has a structure in which wiring is attached to the sol-gel composite piezoelectric device, and the sol-gel composite piezoelectric device is used for, for example, a tube thickness sensor (ultrasonic probe), a pipe, that is, a sensor, a pressure-sensitive / vibration sensor, and the like. Therefore, it can be used as a sensor with heat resistance up to 600 ° C and flexibility with a radius of curvature of about 10 mm.
- a tube thickness sensor ultrasonic probe
- a pipe that is, a sensor, a pressure-sensitive / vibration sensor, and the like. Therefore, it can be used as a sensor with heat resistance up to 600 ° C and flexibility with a radius of curvature of about 10 mm.
- the sol-gel composite piezoelectric sensor is a piezoelectric ceramic device with flexibility and heat resistance (heat impact).
- the Zolgel composite piezoelectric sensor can be used, for example, for pipe thickness monitoring, pipe clogging detection, pressure / vibration monitoring, and monitoring of breakage occurring in a structure as an AE (Acoustic Emission) sensor.
- the inventors have been demonstrating the features of the sol-gel composite piezoelectric sensor such as heat resistance and flexibility, and developing the manufacturing process.
- the sol-gel composite piezoelectric sensor is expected to be applied to, for example, edge sensors required for IoT in factories, particularly in high temperature areas and narrow places where it is difficult to apply conventional sensors. In commercializing the sensor, it is necessary to attach wiring etc. without impairing the heat resistance and to have practical durability.
- FIG. 1 (a) and 1 (b) are views of the sensor device 1 as viewed from the side and top, respectively.
- FIG. 1 (c) is a perspective view of the sensor device 1.
- the sensor unit 3 With reference to FIG. 1, the sensor unit 3, the wiring unit 5, the upper / exterior unit 7, the lower exterior unit 9, the pressurizing unit 11 , the fixing units 13 1 and 132, and the wiring connector unit 15 are provided. ..
- the sensor unit 3 is, for example, a sol-gel composite piezoelectric device (see Patent Document 1 and the like).
- the wiring unit 5 is heat-resistant wiring.
- it is a wire rod having heat resistance such as an MI cable. Since the distance from the sensor unit 3 to the place where the normal temperature wiring can be used differs depending on the usage environment of the sensor device 1, the high temperature portion is wired by the heat resistant wiring.
- the upper exterior portion 7 and the lower exterior portion 9 cover the portion where the sensor portion 3 and the wiring portion 5 are joined by sandwiching them from above and below, respectively.
- the fixing portions 13 1 and 132 fix the upper exterior portion 7 and the lower exterior portion 9.
- the upper exterior portion 7 and the lower exterior portion 9 are connectors that improve the strength of the joint, and the sensor portion 3 and the wiring portion 5 are fixed by a method (crimping, welding, etc.) in which the mechanical strength is guaranteed.
- the pressurizing portion 11 pressurizes and crimps the wiring portion 5 to the portion to be attached to the sensor portion 3.
- the sensor unit 3, the wiring unit 5, the upper / exterior unit 7, the lower exterior unit 9, the pressurizing unit 11, and the fixing units 13 1 and 132 2 are used at a high temperature (for example, a temperature of room temperature or higher and 600 ° C. or lower). ..
- the wiring connector portion 15 is a connector for handling the wiring extension of the normal temperature portion with the wiring for normal temperature.
- the extension wiring part is connected.
- the high temperature portion is wired with heat-resistant wiring, and the wiring extension of the normal temperature portion is handled by the normal temperature wiring. This is because, in general, wiring for normal temperature is more advantageous for signal transmission in terms of cable performance such as noise resistance, flexibility, and distance attenuation during electrical signal propagation.
- the wiring connector portion 15 is a connector portion (joint portion) for connecting the high temperature wiring and the normal temperature wiring. The wiring may be directly soldered or crimped to each other without using the wiring connector portion 15.
- FIG. 2 is a diagram for specifically explaining each configuration of (a) the sensor unit 3 and (b) the joint portion. Although the same reference numerals are given to the corresponding configurations in FIG. 1, the thickness and the like are changed in order to specifically explain each configuration.
- the sensor unit 3 includes a base material layer 21, a piezoelectric film layer 23, an electrode layer 25, and a protective layer 27.
- the sensor unit 3 includes a piezoelectric film which is the core of the solgel composite piezoelectric sensor, and acquires physical signals used for ultrasonic transmission / reception, pressure sensitive sensor, vibration sensor, AE sensor, and the like.
- the base material layer 21 is selected from materials having conductivity and heat resistance that can withstand firing and use at 600 ° C or higher. For example, stainless steel.
- the piezoelectric film layer 23 is a porous piezoelectric ceramic film formed on the base material layer 21.
- This is a sol-gel mixture of, for example, a ceramic powder such as lead zirconate titanate (PZT), bismuth titanate (BiT), lithium niobate, and a sol-gel solution that is a precursor such as PZT, BiT, and titanic acid. It can be manufactured by coating and sintering by a spray method or the like.
- the electrode layer 25 is a pattern of a conductive material formed on the piezoelectric film layer 23.
- a pattern of a conductive material such as silver, aluminum, titanium, or platinum can be formed by screen printing, vapor deposition, sputtering, or other printing methods.
- the protective layer 27 is a layer for protecting the surfaces of the piezoelectric film layer 23 and the electrode layer 25.
- it can be produced by applying silicone, rubber, ceramic or the like.
- the protective layer 27 basically covers the entire sensor unit 3, but the protective layer 27 is not formed on a part of the electrode layer 25 and the base material layer 21 in order to connect the signal line and the ground line.
- the ground wire mounting portion 31 is a place where the ground wire is mounted, and is present in a portion of the base material layer 21 where the protective layer 27 does not exist.
- the signal line mounting portion 29 is a place where the signal line is mounted, and is a portion where the protective layer 27 does not cover the electrode layer 25 and the electrode layer 25 is exposed to the outside.
- the upper / outer exterior portion 7 and the lower exterior portion 9 cover the portion where the sensor portion 3 and the wiring portion 5 are joined by sandwiching them from above and below.
- the sensor unit 3 has a shape like a rice scoop.
- the ground wire mounting portion 31 and the signal line mounting portion 29 are formed on the handle of the rice scoop.
- the spatula-shaped portion is covered with the protective layer 27.
- the upper exterior portion 7 and the lower exterior portion 9 cover at least the ground line mounting portion 31 and the signal line mounting portion 29.
- the portion of the sensor portion 3 that is not covered by the upper exterior portion 7 and the lower exterior portion 9 is covered with the protective layer 27.
- the upper exterior portion 7 and the lower exterior portion 9 cover at least the uncovered signal line and ground line in the wiring portion 5.
- the portion of the wiring portion 5 that is not covered by the upper exterior portion 7 and the lower exterior portion 9 is covered.
- the wiring unit 5 has a ground line and a signal line.
- the ground wire is electrically joined to the ground wire mounting portion 31 of the base material layer 21.
- the sensor device 1 uses the base material layer 21 as an electrode to join the ground wire.
- the base material layer 21 is a conductive material (stainless steel or the like).
- the ground wire is electrically connected to the base material layer 21 by welding, crimping, eyelets, soldering, or the like.
- a conductive crimping tip 33 is attached to the tip of the signal line by welding, soldering, or the like. Since the electrode layer 25 is flat, it can be crimped by pressing it against the electrode layer 25 with a pressure device using the crimping tip 33 having a flat portion. The crimping tip 33 is smaller than the exposed portion of the signal line mounting portion 29 where the electrode layer 25 is exposed. With the crimping tip 33 present in the signal line mounting portion 29, the pressurizing portion 11 crimps the crimping tip 33 to the electrode layer 25 via the insulating layer 35.
- the pressurizing unit 11 can be realized by a pressurizing device such as a screw in consideration of heat resistance, mechanical strength (stability), mounting workability, and the like. If the pressure device, the lower exterior part that holds the pressure device, the upper exterior part, etc. are made of a conductive material such as stainless steel, an insulating layer is provided using a mica plate, a ceramic plate, etc. for insulation. ..
- the upper exterior portion 7, the lower exterior portion 9, the pressurizing portion 11, and the fixing portions 13 1 and 132 provide heat resistance to the sensor portion 3 which is an electrode portion.
- the wiring portion 5 to be provided can be stably joined without impairing heat resistance and workability.
- electrical bonding welding or crimping
- electrical bonding by crimping the signal transmission line of heat-resistant wiring and the sensor unit is realized. ..
- a crimping tip is attached to the tip of the signal transmission line of the heat-resistant wiring. Therefore, it has a structure that is not destroyed by mechanical external forces such as tension and vibration.
- the sensor unit 3 outputs the transmission / reception and pressure of the sensitive ultrasonic vibration to the outside by the signal line attached to the signal line attachment unit 29. Since it is necessary to attach a signal line, a certain height and dimensions are required between the upper exterior portion 7 and the lower exterior portion 9, but in practice, there is an obstacle when attaching the sensitive portion to the object to be measured. It does not become. A certain distance can be provided between the sensor-sensitive portion and the wiring joint portion, and the sol-gel composite piezoelectric sensor can be configured so as not to impair the features of flexibility and thinness.
- the sensor unit 3 the wiring unit 5, the upper / exterior unit 7, the lower / exterior unit 9, the pressurizing unit 11 , and the fixing portions 13 1 and 132 All elements are composed of heat resistant materials and each configuration can be integrated.
- FIGS. 3, 4, 5 and 6 show an example of the process of actually creating the sensor device.
- FIG. 3A shows an MI cable which is a wiring portion.
- it is a 2-core MI cable having a stainless steel coating and using ceramic powder as an insulating layer.
- One of the two core wires is used as a signal line to be in charge of transmitting the electric signal output from the piezoelectric sensor by ultrasonic waves, pressure, etc., and the other is used as a ground wire for connection to the ground of a circuit or the like. ing.
- the stainless steel coating is also connected to the ground.
- FIG. 3B shows a state in which the core wire of the ground is welded to the outer tube of the MI cable.
- FIG. 3C shows a state in which a SUS sheet is welded as a crimping tip to the core wire of the signal wire on the high voltage side of the MI cable.
- FIG. 3D shows a state in which the base material portion of the sensor portion and the outer tube of the MI cable are welded together.
- FIGS. 4 (a) and 4 (b) show a state in which the upper exterior portion and the lower exterior portion are attached by rivets with the sensor portion and the MI cable sandwiched between them.
- FIGS. 5A and 5B show a state in which the insulating sheet is arranged in the space between the upper / outer part and the sensor part.
- FIG. 5C shows a state in which the core wire (crimping tip) is pressed with an M2 set screw to bring it into contact with the electrode layer, and a double nut is used to prevent loosening.
- FIG. 6A shows a state in which the MI cable is attached to the coaxial cable connector.
- the part marked with a circle in FIG. 6B is fixed with an acrylic adhesive.
- FIG. 6 (c) an experiment can be performed using this prototype.
- FIG. 7 shows the measurement results of the prototype.
- an ultrasonic flaw detection test piece having a thickness of 5 mm was measured.
- the ultrasonic pulse echo waveform can be obtained well, and it can be confirmed that the wiring connection structure by the sensor device is effective.
- FIG. 8 shows an example of a piping monitoring system that monitors piping using the sensor device of FIG.
- the pipe 51 is an example of an object to be inspected by the sensor device.
- the pipe 51 is, for example, a 125A steel pipe.
- a plurality of sensor devices are attached to the outer surface of the pipe 51.
- the attachment portion 53 covers the sensor portion of the sensor device and the like.
- a plurality of sensor devices are attached to the outer surface of the pipe 51 by tightening and attaching the belt portion 55 penetrating the attachment portion 53 on the outer surface of the pipe 51.
- FIGS. 9 and 10 are diagrams showing an example of a specific configuration of the attachment unit 53.
- the attachment portion 53 is attached to the sensor device so as to cover the sensor portion 63 and the exterior portion 65 (combining the upper exterior portion and the lower exterior portion).
- the sensor unit 63 is the same as the sensor unit 3 in FIG.
- the exterior portion 65 is the same as the one in which the upper exterior portion 7 and the lower exterior portion 9 of FIG. 1 are combined.
- the attachment portion 53 includes screw holes 69 1 and 69 2 .
- the attachment portion 53 and the exterior portion 65 can be fixed by using the screw holes 69 1 and 69 2 and the screw holes for fixing the upper exterior portion and the lower exterior portion in the exterior portion 65 with two screws. can. It is possible to realize an integrated design of the sensor and the sensor joint.
- the attachment portion 53 includes a first mounting portion 59 and a second mounting portion 61.
- a belt penetrates the first mounting portion 59 and the second mounting portion 61, respectively, and by tightening the belt, the sensor device can be attached to an object to be inspected.
- the belt is, for example, an all-stainless hose clamp. In this example, it can be attached by a combination of two belts.
- the attachment unit 53 includes an adjustment unit 57.
- the adjusting unit 57 guarantees the transmission of ultrasonic waves between the object and the sensor unit 63 in the attachment unit 53, and adjusts between the attachment unit 53 and the sensor unit 63.
- the attachment portion 53 is, for example, a hose clamp attachment and includes an aluminum block or the like.
- the adjusting unit 57 compresses the sensor unit with, for example, a rubber plate (for example, a columnar).
- the adjusting unit 57 includes a blocking unit that blocks the reflected wave generated by the adjusting unit 57.
- the blocking portion is, for example, an insulating sheet (a substance capable of blocking ultrasonic waves), which is sandwiched between Loctite and the rubber plate to prevent detection of reflected waves of the rubber plate.
- FIG. 11 shows a state in which the attachment unit and the sensor device are attached to the pipe.
- FIGS. 12 and 13 are diagrams for explaining an experiment conducted by the inventors to monitor the wall thinning of the pipe.
- FIG. 12 shows a state in which (a) an ultrasonic processing device used in an experiment and (b) a sensor device are attached to a pipe using an attachment unit.
- the signal line of the sensor device of FIG. 12 (b) is joined to the ultrasonic processing device of FIG. 12 (a) to generate an ultrasonic wave, and the sensor device detects the reflected wave in the pipe and measures the thickness. By doing so, it is possible to monitor the thinning of the pipe.
- the measurement target is 125A (5inch) SUS piping.
- the data names 20210208_134115, 20210208_134336 and 20210208_134552 are for rubber strengths of 20, 30 and 40, respectively, and the data names 20210208_140724 are for fixing with a self-bonding tape and a hose band.
- Data numbers 1 to 4 correspond to the data names 20210208_134115, 20210208_134336, 20210208_134552 and 20210208_140724, respectively.
- FIG. 13A shows the amplitude (vertical axis, volt) of the detected voltage with respect to the passage of time (horizontal axis, microseconds).
- FIG. 13 (b) is an enlarged view of FIG. 13 (a) in the vicinity of 2.8 to 3.6 microseconds.
- FIG. 13C is an amplitude (vertical axis, volt) with respect to frequency (horizontal axis, MHz).
- FIG. 13 (d) is the maximum frequency (Hz) (vertical axis) for each data number (horizontal axis).
- Data number 1 had a maximum frequency of 5.63 Hz and a maximum amplitude of 0.37 V.
- Data number 2 had a maximum frequency of 5.45 Hz and a maximum amplitude of 0.33 V.
- Data number 3 had a maximum frequency of 5.72 Hz and a maximum amplitude of 0.47 V.
- the data number 4 had a maximum frequency of 3.81 Hz and a maximum amplitude of 0.17 V.
- Ultrasound can be detected with any data number. Compared with the case of fixing with a self-bonding tape and a hose band, by fixing using a rubber plate, more accurate detection is possible. Therefore, it can be expected that the accuracy will be improved by using an elastic body such as a rubber plate as the adjusting unit 57.
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Abstract
Description
3 センサ部
5 配線部
7 上外装部
9 下外装部
11 加圧部
131,132 固定部
15 配線コネクタ部
21 基材層
23 圧電膜層
25 電極層
27 保護層
29 信号線取付部
31 グラウンド線取付部
33 圧着チップ
35 絶縁層
51 配管
53 アタッチメント部
55 ベルト部
57 調整部
59 第1取付部
61 第2取付部
63 センサ部
65 外装部
691,692 ネジ穴
Claims (6)
- センサ部と配線部を接続するセンサ装置であって、
前記センサ部は、ゾルゲル複合体圧電センサであって、圧電膜層と、前記圧電膜層の上に形成される電極層と、保護層を備え、
前記保護層は、前記電極層の一部を除いて被覆し、
前記電極層において前記保護層が被覆しない部分は、平坦であり、
前記配線部は、信号線を含み、
前記信号線は、先端に、平坦部分を有する圧着チップを有し、
前記電極層において前記保護層により被覆されていない部分及び前記信号線において被覆されていない部分を覆う外装部を備え、
前記外装部は、前記圧着チップの平坦部分を、前記電極層において前記保護層が被覆しない部分に押し付けて圧着する加圧部を備える、センサ装置。 - 前記センサ部は、基材層を備え、
前記圧電膜層は、前記基材層の上に形成され、
前記保護層は、前記基材層の一部を除いて被覆し、
前記配線部は、グラウンド線を含み、
前記グラウンド線は、前記基材層において前記保護層が被覆していない部分に電気的に接合する、請求項1記載のセンサ装置。 - 前記配線部は、一方端が前記センサ部に電気的に接続し、他方端は、延長配線部に電気的に接続し、
前記センサ部、前記配線部及び前記加圧部の耐熱温度は、前記延長配線部の耐熱温度よりも高い、請求項1又は2に記載のセンサ装置。 - 少なくとも前記センサ部を覆うアタッチメント部を備え、
アタッチメント部は、対象物に取り付けるための取付部を備える、請求項1から3のいずれかに記載のセンサ装置。 - 前記アタッチメント部は、当該アタッチメント部において前記対象物と前記センサ部の間の超音波の伝達を保証し、前記アタッチメント部と前記センサ部との間を調整する調整部を備え、
前記調整部は、当該調整部で生じる反射波を遮断する遮断部を備える、請求項4記載のセンサ装置。 - センサ部と配線部を接続するセンサ装置を生産する方法であって、
前記センサ部は、ゾルゲル複合体圧電センサであって、圧電膜層と、前記圧電膜層の上に形成される電極層と、保護層を備え、
前記保護層は、前記電極層の一部を除いて被覆し、
前記電極層において前記保護層が被覆しない部分は、平坦であり、
前記配線部は、信号線を含み、
前記信号線は、先端に、平坦部分を有する圧着チップを有し、
前記センサ装置が備える外装部により、前記電極層において前記保護層により被覆されていない部分及び前記信号線において被覆されていない部分を覆う外装ステップと、
前記外装部が備える加圧部により、前記圧着チップの平坦部分を、前記電極層において前記保護層が被覆しない部分に押し付けて圧着する加圧ステップを含むセンサ装置を生産する方法。
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JPH08191835A (ja) * | 1995-01-19 | 1996-07-30 | Toshiba Corp | 超音波探触子 |
JPH10241762A (ja) * | 1997-02-20 | 1998-09-11 | Oki Electric Ind Co Ltd | 端子取付構造 |
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