CA2745558C - Device and system for measuring material thickness - Google Patents
Device and system for measuring material thickness Download PDFInfo
- Publication number
- CA2745558C CA2745558C CA2745558A CA2745558A CA2745558C CA 2745558 C CA2745558 C CA 2745558C CA 2745558 A CA2745558 A CA 2745558A CA 2745558 A CA2745558 A CA 2745558A CA 2745558 C CA2745558 C CA 2745558C
- Authority
- CA
- Canada
- Prior art keywords
- piezoelectric element
- substrate
- piezoelectric
- sensing device
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 229910000679 solder Inorganic materials 0.000 claims abstract description 28
- 238000005259 measurement Methods 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 40
- 239000000919 ceramic Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010276 construction Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000009659 non-destructive testing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000009795 derivation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002592 echocardiography Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- -1 refinery Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920001166 Poly(vinylidene fluoride-co-trifluoroethylene) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/11—Analysing solids by measuring attenuation of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/228—Details, e.g. general constructional or apparatus details related to high temperature conditions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/840,485 | 2010-07-21 | ||
| US12/840,485 US8264129B2 (en) | 2010-07-21 | 2010-07-21 | Device and system for measuring material thickness |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2745558A1 CA2745558A1 (en) | 2012-01-21 |
| CA2745558C true CA2745558C (en) | 2018-09-04 |
Family
ID=44584009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2745558A Expired - Fee Related CA2745558C (en) | 2010-07-21 | 2011-07-07 | Device and system for measuring material thickness |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8264129B2 (https=) |
| EP (1) | EP2410587A3 (https=) |
| JP (1) | JP5342608B2 (https=) |
| CN (1) | CN102346022A (https=) |
| CA (1) | CA2745558C (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19644079A1 (de) * | 1996-10-31 | 1998-05-07 | Focke & Co | Vorrichtung zum Herstellen von Verpackungen aus dünnem Verpackungsmaterial |
| WO2013063676A1 (en) * | 2010-11-05 | 2013-05-10 | National Research Council Of Canada | Ultrasonic transducer assembly and system for monitoring structural integrity |
| DE102012106236A1 (de) | 2012-07-11 | 2014-01-16 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Fügen von Keramikkörpern mittels eines Aktivhartlots, Baugruppe mit mindestens zwei miteinander gefügten Keramikkörpern, insbesondere Druckmesszelle |
| US20140144238A1 (en) * | 2012-11-28 | 2014-05-29 | General Electric Company | Sensor array for pipeline corrosion monitoring |
| JP6108523B2 (ja) * | 2012-12-07 | 2017-04-05 | 三菱重工業株式会社 | センサを備えた測定ツール |
| US9822470B2 (en) * | 2012-12-14 | 2017-11-21 | Intel Corporation | Flexible embedded interconnects |
| US10081887B2 (en) | 2012-12-14 | 2018-09-25 | Intel Corporation | Electrically functional fabric for flexible electronics |
| NO336558B1 (no) | 2012-12-20 | 2015-09-28 | Tecom Analytical Systems | Sensorsystem for korrosjonsovervåking |
| US10768066B2 (en) * | 2013-07-10 | 2020-09-08 | Sekisui Chemical Co., Ltd. | Piezoelectric sensor including overlapping cutout sections in a signal electrode, a first ground electrode, and a second electrode |
| US10545581B2 (en) * | 2017-10-05 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
| CN110815147B (zh) * | 2019-11-06 | 2022-07-22 | 青岛理工大学 | 一种由压电陶瓷驱动的微位移平台 |
| EP4208736A4 (en) * | 2020-09-03 | 2024-09-04 | National Research Council of Canada | DEVICE, SYSTEM AND METHOD FOR STRUCTURAL INTEGRITY MONITORING USING ULTRASOUND |
| AT524656B1 (de) * | 2021-03-01 | 2022-08-15 | Ac2T Res Gmbh | Vorrichtung zur in-situ Bestimmung der Veränderung der Wanddicke einer rohrförmigen Komponente |
| CN113834454B (zh) * | 2021-09-07 | 2024-01-26 | 青岛理工大学 | 单个超声探头实现宽范围润滑膜厚度测量的方法及验证平台 |
| JP7730739B2 (ja) * | 2021-12-06 | 2025-08-28 | 日立Ｇｅベルノバニュークリアエナジー株式会社 | 配管検査装置 |
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| US4926875A (en) | 1988-01-25 | 1990-05-22 | Baylor College Of Medicine | Implantable and extractable biological sensor probe |
| JPH02140991A (ja) * | 1988-11-22 | 1990-05-30 | Fujikura Ltd | フレキシブル印刷配線板 |
| US6413589B1 (en) * | 1988-11-29 | 2002-07-02 | Chou H. Li | Ceramic coating method |
| JP3039971B2 (ja) * | 1989-09-19 | 2000-05-08 | 株式会社日立製作所 | 接合型圧電装置及び製造方法並びに接合型圧電素子 |
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| JPH0677555A (ja) * | 1992-08-27 | 1994-03-18 | Murata Mfg Co Ltd | 積層型圧電素子の製造方法 |
| DE69516444T2 (de) | 1994-03-11 | 2001-01-04 | Intravascular Research Ltd., London | Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung |
| US6225728B1 (en) | 1994-08-18 | 2001-05-01 | Agilent Technologies, Inc. | Composite piezoelectric transducer arrays with improved acoustical and electrical impedance |
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| JP2009276085A (ja) * | 2008-05-12 | 2009-11-26 | Nikko Kensa Service Kk | 曲面に追随する超音波探傷装置 |
| JP2010123845A (ja) * | 2008-11-21 | 2010-06-03 | Konica Minolta Medical & Graphic Inc | 有機圧電体、有機圧電材料、超音波振動子および超音波探触子 |
-
2010
- 2010-07-21 US US12/840,485 patent/US8264129B2/en not_active Expired - Fee Related
-
2011
- 2011-07-07 CA CA2745558A patent/CA2745558C/en not_active Expired - Fee Related
- 2011-07-14 EP EP11173957.9A patent/EP2410587A3/en not_active Ceased
- 2011-07-15 JP JP2011156181A patent/JP5342608B2/ja not_active Expired - Fee Related
- 2011-07-21 CN CN2011102178081A patent/CN102346022A/zh active Pending
-
2012
- 2012-08-06 US US13/567,274 patent/US20120294124A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP2410587A3 (en) | 2013-07-17 |
| EP2410587A2 (en) | 2012-01-25 |
| US20120019105A1 (en) | 2012-01-26 |
| JP2012027020A (ja) | 2012-02-09 |
| CN102346022A (zh) | 2012-02-08 |
| US8264129B2 (en) | 2012-09-11 |
| CA2745558A1 (en) | 2012-01-21 |
| JP5342608B2 (ja) | 2013-11-13 |
| US20120294124A1 (en) | 2012-11-22 |
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