CN102346022A - 用于测量材料厚度的装置和系统 - Google Patents

用于测量材料厚度的装置和系统 Download PDF

Info

Publication number
CN102346022A
CN102346022A CN2011102178081A CN201110217808A CN102346022A CN 102346022 A CN102346022 A CN 102346022A CN 2011102178081 A CN2011102178081 A CN 2011102178081A CN 201110217808 A CN201110217808 A CN 201110217808A CN 102346022 A CN102346022 A CN 102346022A
Authority
CN
China
Prior art keywords
substrate
piezoelectric element
piezoelectric
sensing apparatus
sensing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102178081A
Other languages
English (en)
Chinese (zh)
Inventor
M·克罗恩
P·A·迈尔
J·N·巴辛格
范颖
F·马修斯
N·史密斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN102346022A publication Critical patent/CN102346022A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/228—Details, e.g. general constructional or apparatus details related to high temperature conditions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
CN2011102178081A 2010-07-21 2011-07-21 用于测量材料厚度的装置和系统 Pending CN102346022A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/840,485 US8264129B2 (en) 2010-07-21 2010-07-21 Device and system for measuring material thickness
US12/840485 2010-07-21

Publications (1)

Publication Number Publication Date
CN102346022A true CN102346022A (zh) 2012-02-08

Family

ID=44584009

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102178081A Pending CN102346022A (zh) 2010-07-21 2011-07-21 用于测量材料厚度的装置和系统

Country Status (5)

Country Link
US (2) US8264129B2 (https=)
EP (1) EP2410587A3 (https=)
JP (1) JP5342608B2 (https=)
CN (1) CN102346022A (https=)
CA (1) CA2745558C (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104470666A (zh) * 2012-07-11 2015-03-25 恩德莱斯和豪瑟尔两合公司 利用活性硬焊料或钎焊料接合陶瓷体的方法、具有彼此接合的至少两个陶瓷体的组件,特别是压力测量单元
CN109638149A (zh) * 2017-10-05 2019-04-16 日月光半导体制造股份有限公司 半导体封装设备
CN113834454A (zh) * 2021-09-07 2021-12-24 青岛理工大学 单个超声探头实现宽范围润滑膜厚度测量的方法及验证平台

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19644079A1 (de) * 1996-10-31 1998-05-07 Focke & Co Vorrichtung zum Herstellen von Verpackungen aus dünnem Verpackungsmaterial
WO2013063676A1 (en) * 2010-11-05 2013-05-10 National Research Council Of Canada Ultrasonic transducer assembly and system for monitoring structural integrity
US20140144238A1 (en) * 2012-11-28 2014-05-29 General Electric Company Sensor array for pipeline corrosion monitoring
JP6108523B2 (ja) * 2012-12-07 2017-04-05 三菱重工業株式会社 センサを備えた測定ツール
US9822470B2 (en) * 2012-12-14 2017-11-21 Intel Corporation Flexible embedded interconnects
US10081887B2 (en) 2012-12-14 2018-09-25 Intel Corporation Electrically functional fabric for flexible electronics
NO336558B1 (no) 2012-12-20 2015-09-28 Tecom Analytical Systems Sensorsystem for korrosjonsovervåking
US10768066B2 (en) * 2013-07-10 2020-09-08 Sekisui Chemical Co., Ltd. Piezoelectric sensor including overlapping cutout sections in a signal electrode, a first ground electrode, and a second electrode
CN110815147B (zh) * 2019-11-06 2022-07-22 青岛理工大学 一种由压电陶瓷驱动的微位移平台
EP4208736A4 (en) * 2020-09-03 2024-09-04 National Research Council of Canada DEVICE, SYSTEM AND METHOD FOR STRUCTURAL INTEGRITY MONITORING USING ULTRASOUND
AT524656B1 (de) * 2021-03-01 2022-08-15 Ac2T Res Gmbh Vorrichtung zur in-situ Bestimmung der Veränderung der Wanddicke einer rohrförmigen Komponente
JP7730739B2 (ja) * 2021-12-06 2025-08-28 日立Ｇｅベルノバニュークリアエナジー株式会社 配管検査装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325012A (en) * 1989-09-19 1994-06-28 Hitachi, Ltd Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element
US5834877A (en) * 1995-08-28 1998-11-10 Accuweb, Inc. Ultrasonic transducer units for web detection and the like
CN1419895A (zh) * 2001-11-16 2003-05-28 精工电子有限公司 压电传感器，压电传感器的制造方法和脉波检测器
US6915547B2 (en) * 1999-10-01 2005-07-12 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of manufacturing same
US7127948B2 (en) * 2005-02-17 2006-10-31 The Boeing Company Piezoelectric sensor, sensor array, and associated method for measuring pressure
JP2008173790A (ja) * 2007-01-16 2008-07-31 Toray Ind Inc 溶液製膜フイルムの製造方法
US20090039738A1 (en) * 2004-03-08 2009-02-12 Angelsen Bjorn A J High frequency ultrasound transducers based on ceramic films

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4926875A (en) 1988-01-25 1990-05-22 Baylor College Of Medicine Implantable and extractable biological sensor probe
JPH02140991A (ja) * 1988-11-22 1990-05-30 Fujikura Ltd フレキシブル印刷配線板
US6413589B1 (en) * 1988-11-29 2002-07-02 Chou H. Li Ceramic coating method
US5262696A (en) * 1991-07-05 1993-11-16 Rockwell International Corporation Biaxial transducer
US5327895A (en) 1991-07-10 1994-07-12 Kabushiki Kaisha Toshiba Ultrasonic probe and ultrasonic diagnosing system using ultrasonic probe
JPH0677555A (ja) * 1992-08-27 1994-03-18 Murata Mfg Co Ltd 積層型圧電素子の製造方法
DE69516444T2 (de) 1994-03-11 2001-01-04 Intravascular Research Ltd., London Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung
US6225728B1 (en) 1994-08-18 2001-05-01 Agilent Technologies, Inc. Composite piezoelectric transducer arrays with improved acoustical and electrical impedance
JP3114526B2 (ja) * 1994-10-17 2000-12-04 株式会社村田製作所 チップ型圧電共振部品
US5923115A (en) 1996-11-22 1999-07-13 Acuson Corporation Low mass in the acoustic path flexible circuit interconnect and method of manufacture thereof
US6437989B1 (en) * 1999-07-10 2002-08-20 Endress + Hauser Gmbh + Co. Circuit board with an electronic component and a method for producing a connection between the circuit board and the component
US6414417B1 (en) * 1999-08-31 2002-07-02 Kyocera Corporation Laminated piezoelectric actuator
JP2002026411A (ja) * 1999-10-01 2002-01-25 Ngk Insulators Ltd 圧電／電歪デバイス及びその製造方法
JP3427038B2 (ja) * 2000-03-31 2003-07-14 京セラ株式会社 圧電装置の製造方法
US6640634B2 (en) 2000-03-31 2003-11-04 Kabushiki Kaisha Toshiba Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus
JP2001291907A (ja) * 2000-04-06 2001-10-19 Matsushita Electric Ind Co Ltd 可撓性圧電素子
DE10031793C1 (de) * 2000-07-04 2002-02-07 Peter Apel Piezoelektrischer Sensor
JP3551141B2 (ja) 2000-09-28 2004-08-04 松下電器産業株式会社 圧電体の製造方法
US6490228B2 (en) 2001-02-16 2002-12-03 Koninklijke Philips Electronics N.V. Apparatus and method of forming electrical connections to an acoustic transducer
JP2002271113A (ja) * 2001-03-09 2002-09-20 Ngk Insulators Ltd 積層型誘電体共振器及び積層型誘電体フィルタ
US7291110B2 (en) 2001-10-12 2007-11-06 Boston Scientific Corporation Catheter lesion diagnostics
US20040224482A1 (en) * 2001-12-20 2004-11-11 Kub Francis J. Method for transferring thin film layer material to a flexible substrate using a hydrogen ion splitting technique
US6789427B2 (en) 2002-09-16 2004-09-14 General Electric Company Phased array ultrasonic inspection method for industrial applications
US6822376B2 (en) 2002-11-19 2004-11-23 General Electric Company Method for making electrical connection to ultrasonic transducer
US6925869B2 (en) 2003-01-28 2005-08-09 The Boeing Company Ultrasonic fuel-gauging system
US7413919B2 (en) 2003-06-20 2008-08-19 Acellent Technologies, Inc. Method of manufacturing a structural health monitoring layer
US7293461B1 (en) 2003-10-22 2007-11-13 Richard Girndt Ultrasonic tubulars inspection device
US7017245B2 (en) 2003-11-11 2006-03-28 General Electric Company Method for making multi-layer ceramic acoustic transducer
US7156938B2 (en) 2003-11-11 2007-01-02 General Electric Company Method for making multi-layer ceramic acoustic transducer
CN1890031B (zh) * 2003-12-04 2010-09-29 皇家飞利浦电子股份有限公司 超声变换器和将倒装二维阵列技术应用于弯曲阵列的方法
US7082655B2 (en) 2003-12-18 2006-08-01 Ge Inspection Technologies, Lp Process for plating a piezoelectric composite
US7692559B2 (en) * 2004-06-19 2010-04-06 Face International Corp Self-powered switch initiation system
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JPWO2006040962A1 (ja) 2004-10-15 2008-05-15 オリンパスメディカルシステムズ株式会社 超音波振動子およびその製造方法
ES2313298T3 (es) 2005-02-03 2009-03-01 Ge Inspection Technologies, Lp Procedimiento para metalizar un material compuesto piezoelectrico.
KR100722370B1 (ko) 2005-02-22 2007-05-29 주식회사 휴먼스캔 적층형 초음파 탐촉자 및 이의 제조방법
US7369250B2 (en) * 2005-03-25 2008-05-06 Lockheed Martin Corporation System and method to inspect components having non-parallel surfaces
US7322243B2 (en) 2005-06-16 2008-01-29 Honeywell International Inc. Acoustic wave etch rate sensor system
CN101237947B (zh) * 2005-08-05 2013-03-27 皇家飞利浦电子股份有限公司 弯曲的二维阵列换能器
CN101237946B (zh) * 2005-08-08 2013-03-27 皇家飞利浦电子股份有限公司 超声换能器阵列
JP4281726B2 (ja) * 2005-10-11 2009-06-17 株式会社村田製作所 圧電磁器組成物、圧電磁器および圧電セラミック素子
WO2007058668A1 (en) * 2005-11-18 2007-05-24 Imarx Therapeutics, Inc. Ultrasound apparatus and method to treat an ischemic stroke
US7687976B2 (en) * 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
JP2008241539A (ja) * 2007-03-28 2008-10-09 Citizen Holdings Co Ltd Ｑｃｍセンサー
US7671519B2 (en) * 2007-08-31 2010-03-02 Cts Corporation Bond pad for use with piezoelectric ceramic substrates
JP2009276085A (ja) * 2008-05-12 2009-11-26 Nikko Kensa Service Kk 曲面に追随する超音波探傷装置
JP2010123845A (ja) * 2008-11-21 2010-06-03 Konica Minolta Medical & Graphic Inc 有機圧電体、有機圧電材料、超音波振動子および超音波探触子

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325012A (en) * 1989-09-19 1994-06-28 Hitachi, Ltd Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element
US5834877A (en) * 1995-08-28 1998-11-10 Accuweb, Inc. Ultrasonic transducer units for web detection and the like
US6915547B2 (en) * 1999-10-01 2005-07-12 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of manufacturing same
CN1419895A (zh) * 2001-11-16 2003-05-28 精工电子有限公司 压电传感器，压电传感器的制造方法和脉波检测器
US20090039738A1 (en) * 2004-03-08 2009-02-12 Angelsen Bjorn A J High frequency ultrasound transducers based on ceramic films
US7127948B2 (en) * 2005-02-17 2006-10-31 The Boeing Company Piezoelectric sensor, sensor array, and associated method for measuring pressure
JP2008173790A (ja) * 2007-01-16 2008-07-31 Toray Ind Inc 溶液製膜フイルムの製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104470666A (zh) * 2012-07-11 2015-03-25 恩德莱斯和豪瑟尔两合公司 利用活性硬焊料或钎焊料接合陶瓷体的方法、具有彼此接合的至少两个陶瓷体的组件,特别是压力测量单元
US9631994B2 (en) 2012-07-11 2017-04-25 Endress + Hauser Gmbh + Co. Kg Method for joining ceramic bodies by means of an active hard solder, or braze, assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell
CN104470666B (zh) * 2012-07-11 2018-02-02 恩德莱斯和豪瑟尔两合公司 具有彼此接合的陶瓷体的组件、其压力传感器及制造方法
CN109638149A (zh) * 2017-10-05 2019-04-16 日月光半导体制造股份有限公司 半导体封装设备
CN113834454A (zh) * 2021-09-07 2021-12-24 青岛理工大学 单个超声探头实现宽范围润滑膜厚度测量的方法及验证平台
CN113834454B (zh) * 2021-09-07 2024-01-26 青岛理工大学 单个超声探头实现宽范围润滑膜厚度测量的方法及验证平台

Also Published As

Publication number Publication date
EP2410587A3 (en) 2013-07-17
EP2410587A2 (en) 2012-01-25
US20120019105A1 (en) 2012-01-26
JP2012027020A (ja) 2012-02-09
US8264129B2 (en) 2012-09-11
CA2745558A1 (en) 2012-01-21
JP5342608B2 (ja) 2013-11-13
CA2745558C (en) 2018-09-04
US20120294124A1 (en) 2012-11-22

Similar Documents

Publication Publication Date Title
CA2745558C (en) Device and system for measuring material thickness
CA2799731C (en) Device for measuring material thickness
US10458955B2 (en) Ultrasonic transducer assembly and system for monitoring structural integrity
US20120103097A1 (en) Flexible EMAT Arrays for Monitoring Corrosion and Defect Propagation in Metal Components and Structures
JP5721126B2 (ja) 圧電センサ
JPH05215705A (ja) 構造的健全状態のモニタリング及び査定に適合する回路
CN101360566A (zh) 包括发送器层和接收器层的超声换能器模块
CN108680641A (zh) 基于涡流与超声复合的柔性阵列传感器
US10576499B2 (en) Ultrasonic phased array probe using PCB as matching layer
JPWO2009011089A1 (ja) 超音波探触子とこれを用いた超音波診断装置および超音波探傷装置
US20240053300A1 (en) Ultrasonic structural health monitoring device, system and method
US5724315A (en) Omnidirectional ultrasonic microprobe hydrophone
JP2008302044A (ja) 超音波探触子とこれを用いた超音波診断装置および超音波探傷装置
GB2603887A (en) Tamper proof ultrasound sensor
JP2008151599A (ja) 超音波探触子
US12484449B2 (en) Sensor device and method for manufacturing sensor device
CN220289503U (zh) 核电厂相控阵探头
US20140036633A1 (en) Ultrasonic probe
KR20260017331A (ko) 압전 트랜스듀서 어레이
Moffett Omnidirectional Ultrasonic Microprobe Hydrophone.

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120208