JP5339974B2 - インダクタ装置及びその製造方法 - Google Patents
インダクタ装置及びその製造方法 Download PDFInfo
- Publication number
- JP5339974B2 JP5339974B2 JP2009057414A JP2009057414A JP5339974B2 JP 5339974 B2 JP5339974 B2 JP 5339974B2 JP 2009057414 A JP2009057414 A JP 2009057414A JP 2009057414 A JP2009057414 A JP 2009057414A JP 5339974 B2 JP5339974 B2 JP 5339974B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- planar coil
- insulating layer
- pattern layer
- inductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/008—Electric or magnetic shielding of printed inductances
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009057414A JP5339974B2 (ja) | 2009-03-11 | 2009-03-11 | インダクタ装置及びその製造方法 |
| US12/708,829 US8004382B2 (en) | 2009-03-11 | 2010-02-19 | Inductor device, and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009057414A JP5339974B2 (ja) | 2009-03-11 | 2009-03-11 | インダクタ装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010212468A JP2010212468A (ja) | 2010-09-24 |
| JP2010212468A5 JP2010212468A5 (enExample) | 2012-02-23 |
| JP5339974B2 true JP5339974B2 (ja) | 2013-11-13 |
Family
ID=42730219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009057414A Active JP5339974B2 (ja) | 2009-03-11 | 2009-03-11 | インダクタ装置及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8004382B2 (enExample) |
| JP (1) | JP5339974B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6283158B2 (ja) * | 2012-04-12 | 2018-02-21 | 新光電気工業株式会社 | 配線基板、及び、配線基板の製造方法 |
| KR20140011693A (ko) * | 2012-07-18 | 2014-01-29 | 삼성전기주식회사 | 파워 인덕터용 자성체 모듈, 파워 인덕터 및 그 제조 방법 |
| KR101771749B1 (ko) * | 2012-12-28 | 2017-08-25 | 삼성전기주식회사 | 인덕터 |
| KR20140094324A (ko) * | 2013-01-22 | 2014-07-30 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
| JP6514708B2 (ja) * | 2014-09-03 | 2019-05-15 | ローム株式会社 | 配線内蔵基板およびその製造方法、およびモジュールおよびその製造方法 |
| KR20160037652A (ko) * | 2014-09-29 | 2016-04-06 | 엘지이노텍 주식회사 | 무선 전력 송신 장치 및 무선 전력 수신 장치 |
| JP7529414B2 (ja) * | 2020-02-26 | 2024-08-06 | 株式会社村田製作所 | インダクタ部品 |
| TWI888813B (zh) * | 2022-03-30 | 2025-07-01 | 韓商斯天克有限公司 | 線圈基板及其製造方法和電子裝置 |
| US20250246357A1 (en) * | 2024-01-31 | 2025-07-31 | Avago Technologies International Sales Pte. Limited | Systems and methods for integrating inductors within printed circuit boards |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960006848B1 (ko) * | 1990-05-31 | 1996-05-23 | 가부시끼가이샤 도시바 | 평면형 자기소자 |
| JP3382215B2 (ja) * | 1990-05-31 | 2003-03-04 | 株式会社東芝 | 平面型磁気素子及びその製造方法並びに平面型磁気素子を備えた半導体装置 |
| JP3114392B2 (ja) * | 1992-10-15 | 2000-12-04 | 富士電機株式会社 | 薄膜形磁気誘導素子 |
| JPH0765650A (ja) * | 1993-08-31 | 1995-03-10 | Kyocera Corp | 透明導電膜上の金属電極層およびその製造方法 |
| AU6468198A (en) * | 1997-05-02 | 1998-11-27 | Board Of Trustees Of The Leland Stanford Junior University | Patterned ground shields for integrated circuit inductors |
| JPH11354323A (ja) | 1998-06-05 | 1999-12-24 | Mitsubishi Electric Corp | インダクタ |
| JP2000269035A (ja) * | 1999-03-15 | 2000-09-29 | Toshiba Corp | 平面磁気素子 |
| DE19945855A1 (de) * | 1999-09-24 | 2001-03-29 | Bosch Gmbh Robert | Mikrospule |
| JP4811543B2 (ja) | 2000-09-08 | 2011-11-09 | 学校法人早稲田大学 | 微細パターンの作製方法 |
| US6593838B2 (en) * | 2000-12-19 | 2003-07-15 | Atheros Communications Inc. | Planar inductor with segmented conductive plane |
| US6373121B1 (en) * | 2001-03-23 | 2002-04-16 | United Microelectronics Corp. | Silicon chip built-in inductor structure |
| KR101001429B1 (ko) * | 2002-03-05 | 2010-12-14 | 히다치 가세고교 가부시끼가이샤 | 수지 부착 금속박, 그를 이용한 프린트 배선판 및 그의 제조 방법 |
| US20040195650A1 (en) * | 2003-04-04 | 2004-10-07 | Tsung-Ju Yang | High-Q inductor device with a shielding pattern embedded in a substrate |
| WO2005032226A1 (ja) * | 2003-09-29 | 2005-04-07 | Tamura Corporation | 多層積層回路基板 |
| DE102004022139B4 (de) * | 2004-05-05 | 2007-10-18 | Atmel Germany Gmbh | Verfahren zur Herstellung einer Spiralinduktivität auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement |
| JP2006059959A (ja) * | 2004-08-19 | 2006-03-02 | Oki Electric Ind Co Ltd | 半導体装置、及び半導体装置の製造方法 |
| JP4638322B2 (ja) * | 2005-10-25 | 2011-02-23 | Tdk株式会社 | コモンモードフィルタ |
| US7323948B2 (en) * | 2005-08-23 | 2008-01-29 | International Business Machines Corporation | Vertical LC tank device |
| JP2008010697A (ja) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Ind Co Ltd | インダクタンス部品 |
| JP2008010695A (ja) | 2006-06-30 | 2008-01-17 | Matsushita Electric Ind Co Ltd | インダクタンス部品 |
| JP4336996B2 (ja) * | 2006-10-03 | 2009-09-30 | セイコーエプソン株式会社 | めっき基板の製造方法 |
| TWI303957B (en) * | 2006-12-11 | 2008-12-01 | Ind Tech Res Inst | Embedded inductor devices and fabrication methods thereof |
| JP2008205179A (ja) | 2007-02-20 | 2008-09-04 | Tdk Corp | 薄膜磁気デバイス |
| WO2010140297A1 (ja) * | 2009-06-04 | 2010-12-09 | 日本電気株式会社 | 半導体装置及び信号伝達方法 |
-
2009
- 2009-03-11 JP JP2009057414A patent/JP5339974B2/ja active Active
-
2010
- 2010-02-19 US US12/708,829 patent/US8004382B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010212468A (ja) | 2010-09-24 |
| US20100231344A1 (en) | 2010-09-16 |
| US8004382B2 (en) | 2011-08-23 |
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