JP5339678B2 - 活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置 - Google Patents

活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置 Download PDF

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Publication number
JP5339678B2
JP5339678B2 JP2006528165A JP2006528165A JP5339678B2 JP 5339678 B2 JP5339678 B2 JP 5339678B2 JP 2006528165 A JP2006528165 A JP 2006528165A JP 2006528165 A JP2006528165 A JP 2006528165A JP 5339678 B2 JP5339678 B2 JP 5339678B2
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active
fluorinated
layer
active material
liquid medium
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Expired - Fee Related
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JP2006528165A
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Japanese (ja)
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JP2007506547A (ja
JP2007506547A5 (https=
Inventor
アレキサンドロビック ペトロフ ヴィヤチェスラフ
デイヴィッド ルクルークス ダニエル
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30—Coordination compounds
    • H10K85/311—Phthalocyanine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/30—Coordination compounds
    • H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
    • H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
JP2006528165A 2003-09-24 2004-09-22 活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置 Expired - Fee Related JP5339678B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/669,403 2003-09-24
US10/669,403 US7686978B2 (en) 2003-09-24 2003-09-24 Method for the application of active materials onto active surfaces and devices made with such methods
PCT/US2004/031246 WO2005031889A2 (en) 2003-09-24 2004-09-22 Method for the application of active materials onto active surfaces and devices made with such methods

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012065874A Division JP5602173B2 (ja) 2003-09-24 2012-03-22 活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置

Publications (3)

Publication Number Publication Date
JP2007506547A JP2007506547A (ja) 2007-03-22
JP2007506547A5 JP2007506547A5 (https=) 2007-11-15
JP5339678B2 true JP5339678B2 (ja) 2013-11-13

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JP2006528165A Expired - Fee Related JP5339678B2 (ja) 2003-09-24 2004-09-22 活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置
JP2012065874A Expired - Fee Related JP5602173B2 (ja) 2003-09-24 2012-03-22 活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置
JP2013265744A Expired - Lifetime JP5757989B2 (ja) 2003-09-24 2013-12-24 活性材料を活性表面上に塗布する方法によって製造される装置

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JP2012065874A Expired - Fee Related JP5602173B2 (ja) 2003-09-24 2012-03-22 活性材料を活性表面上に塗布する方法およびかかる方法によって製造される装置
JP2013265744A Expired - Lifetime JP5757989B2 (ja) 2003-09-24 2013-12-24 活性材料を活性表面上に塗布する方法によって製造される装置

Country Status (5)

Country Link
US (3) US7686978B2 (https=)
JP (3) JP5339678B2 (https=)
KR (1) KR101176678B1 (https=)
TW (1) TW200525793A (https=)
WO (1) WO2005031889A2 (https=)

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Also Published As

Publication number Publication date
JP2007506547A (ja) 2007-03-22
JP5757989B2 (ja) 2015-08-05
JP2012157859A (ja) 2012-08-23
KR20070029625A (ko) 2007-03-14
US8287766B2 (en) 2012-10-16
KR101176678B1 (ko) 2012-08-23
US20110180761A1 (en) 2011-07-28
WO2005031889A3 (en) 2005-06-23
WO2005031889A2 (en) 2005-04-07
US7686978B2 (en) 2010-03-30
US20050062021A1 (en) 2005-03-24
JP5602173B2 (ja) 2014-10-08
TW200525793A (en) 2005-08-01
US8465850B2 (en) 2013-06-18
US20050269550A1 (en) 2005-12-08
JP2014090195A (ja) 2014-05-15

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