JP5322728B2 - Led光源及びled光源の製造方法 - Google Patents
Led光源及びled光源の製造方法 Download PDFInfo
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- JP5322728B2 JP5322728B2 JP2009080026A JP2009080026A JP5322728B2 JP 5322728 B2 JP5322728 B2 JP 5322728B2 JP 2009080026 A JP2009080026 A JP 2009080026A JP 2009080026 A JP2009080026 A JP 2009080026A JP 5322728 B2 JP5322728 B2 JP 5322728B2
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- Prior art keywords
- chromaticity
- light source
- led light
- phosphor
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 229920005989 resin Polymers 0.000 claims description 135
- 239000011347 resin Substances 0.000 claims description 135
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 133
- 239000003566 sealing material Substances 0.000 claims description 58
- 238000005520 cutting process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 6
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 47
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 47
- 238000010586 diagram Methods 0.000 description 24
- 238000009826 distribution Methods 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- -1 nitride compound Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Led Device Packages (AREA)
Description
2 封止材
3、41、131、151、152 色度調整用樹脂
4 パッケージ枠
5 基板
10、40、130、150 色度調整済みLED光源
11 色度調整前LED光源
13 凹部
14 凹凸部
Claims (12)
- LED素子、前記LED素子からの発光の一部を吸収し波長変換して発光する蛍光体を含み前記LED素子の周囲に配置された封止材を有するLED光源を提供し、
前記封止材を切削して凹部を形成し、
前記凹部全体に前記封止材とは異なる色度調整用樹脂を充填する、
ステップを有することを特徴とするLED光源の製造方法。 - 前記色度調整用樹脂は、蛍光体を含まない透明樹脂である、請求項1に記載のLED光源の製造方法。
- 前記色度調整用樹脂は、前記封止材に含まれる前記蛍光体の濃度とは異なる濃度の前記蛍光体を含む、請求項1に記載のLED光源の製造方法。
- 前記色度調整用樹脂は、前記蛍光体とは異なる種類の蛍光体を含む、請求項1に記載のLED光源の製造方法。
- 前記凹部を、色度調整量に応じて、前記LED素子の直上からずらして形成する、請求項1〜4の何れか一項に記載のLED光源の製造方法。
- 前記凹部を形成するための切削量を、色度調整量に応じて可変する、請求項1〜4の何れか一項に記載のLED光源の製造方法。
- 前記色度調整用樹脂は、複数の種類の蛍光体を含む、請求項1に記載のLED光源の製造方法。
- LED素子と、
前記LED素子からの発光の一部を吸収し波長変換して発光する蛍光体を含み前記LED素子の周囲に配置された封止材と、
前記封止材を切削して形成された凹部と、
前記凹部全体に充填された前記封止材とは異なる色度調整用樹脂と、
を有することを特徴とするLED光源。 - 前記色度調整用樹脂は、蛍光体を含まない透明樹脂である、請求項8に記載のLED光源。
- 前記色度調整用樹脂は、前記封止材に含まれる前記蛍光体の濃度とは異なる濃度の前記蛍光体を含む、請求項8に記載のLED光源。
- 前記充填樹脂は、前記蛍光体とは異なる種類の蛍光体を含む、請求項8に記載のLED光源の製造方法。
- 前記色度調整用樹脂は、複数の種類の蛍光体を含む、請求項8に記載のLED光源の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009080026A JP5322728B2 (ja) | 2009-03-27 | 2009-03-27 | Led光源及びled光源の製造方法 |
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JP2009080026A JP5322728B2 (ja) | 2009-03-27 | 2009-03-27 | Led光源及びled光源の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2010232525A JP2010232525A (ja) | 2010-10-14 |
JP5322728B2 true JP5322728B2 (ja) | 2013-10-23 |
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JP2009080026A Active JP5322728B2 (ja) | 2009-03-27 | 2009-03-27 | Led光源及びled光源の製造方法 |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5762044B2 (ja) * | 2011-02-23 | 2015-08-12 | 三菱電機株式会社 | 発光装置及び発光装置群及び製造方法 |
JP2014041863A (ja) * | 2012-08-21 | 2014-03-06 | Citizen Holdings Co Ltd | 半導体発光装置及びその製造方法 |
US9761763B2 (en) * | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
JP5819335B2 (ja) | 2013-02-18 | 2015-11-24 | 株式会社東芝 | 半導体発光装置およびその製造方法 |
JP2015053361A (ja) * | 2013-09-06 | 2015-03-19 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP6303805B2 (ja) * | 2014-05-21 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
WO2016143261A1 (ja) * | 2015-03-11 | 2016-09-15 | パナソニックIpマネジメント株式会社 | 発光装置、発光装置の製造方法 |
JP2016171146A (ja) * | 2015-03-11 | 2016-09-23 | パナソニックIpマネジメント株式会社 | 発光装置、発光装置の製造方法 |
US9985182B2 (en) | 2015-12-25 | 2018-05-29 | Citizen Electronics Co., Ltd. | Light-emitting apparatus and color-matching apparatus |
JP7260828B2 (ja) * | 2019-01-11 | 2023-04-19 | 日亜化学工業株式会社 | 発光装置 |
TWI807401B (zh) | 2020-08-31 | 2023-07-01 | 日商日亞化學工業股份有限公司 | 發光模組之製造方法 |
Family Cites Families (1)
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JP4692059B2 (ja) * | 2005-04-25 | 2011-06-01 | パナソニック電工株式会社 | 発光装置の製造方法 |
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