JP5320264B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP5320264B2 JP5320264B2 JP2009255037A JP2009255037A JP5320264B2 JP 5320264 B2 JP5320264 B2 JP 5320264B2 JP 2009255037 A JP2009255037 A JP 2009255037A JP 2009255037 A JP2009255037 A JP 2009255037A JP 5320264 B2 JP5320264 B2 JP 5320264B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- semiconductor device
- core
- resin core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009255037A JP5320264B2 (ja) | 2009-11-06 | 2009-11-06 | 半導体装置の製造方法 |
CN201010537188.5A CN102082104B (zh) | 2009-11-06 | 2010-11-05 | 用于制造半导体器件的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009255037A JP5320264B2 (ja) | 2009-11-06 | 2009-11-06 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011100873A JP2011100873A (ja) | 2011-05-19 |
JP5320264B2 true JP5320264B2 (ja) | 2013-10-23 |
Family
ID=44087981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009255037A Expired - Fee Related JP5320264B2 (ja) | 2009-11-06 | 2009-11-06 | 半導体装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5320264B2 (zh) |
CN (1) | CN102082104B (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3526529B2 (ja) * | 1998-03-03 | 2004-05-17 | 松下電器産業株式会社 | 半導体装置の製造方法 |
JP3998014B2 (ja) * | 2004-09-29 | 2007-10-24 | セイコーエプソン株式会社 | 半導体装置、実装構造体、電気光学装置、電気光学装置の製造方法及び電子機器 |
JP2006202882A (ja) * | 2005-01-19 | 2006-08-03 | Fujikura Ltd | 半導体装置およびその製造方法 |
JP2007165744A (ja) * | 2005-12-16 | 2007-06-28 | Epson Imaging Devices Corp | 半導体装置、実装構造体、電気光学装置、半導体装置の製造方法、実装構造体の製造方法、電気光学装置の製造方法、及び、電子機器 |
-
2009
- 2009-11-06 JP JP2009255037A patent/JP5320264B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-05 CN CN201010537188.5A patent/CN102082104B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102082104B (zh) | 2014-12-10 |
CN102082104A (zh) | 2011-06-01 |
JP2011100873A (ja) | 2011-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100652395B1 (ko) | 다이-휨이 억제된 반도체 소자 및 그 제조방법 | |
KR100583966B1 (ko) | 재배치된 금속 배선들을 갖는 집적회로 패키지들 및 그제조방법들 | |
WO2017221589A1 (ja) | 半導体チップパッケージ | |
JP2012069585A (ja) | 半導体装置およびその製造方法 | |
JP2013110151A (ja) | 半導体チップ及び半導体装置 | |
JP2006032556A (ja) | 半導体装置及びその製造方法 | |
JP5507783B2 (ja) | 再配置されたパターンを有する半導体パッケージ及びその製造方法 | |
JP2010192747A (ja) | 半導体装置 | |
JP4726744B2 (ja) | 半導体装置およびその製造方法 | |
JP5320264B2 (ja) | 半導体装置の製造方法 | |
JP2006287094A (ja) | 半導体装置及びその製造方法 | |
JP2007123578A (ja) | 半導体装置及びその製造方法 | |
KR20180021955A (ko) | 수직 적층된 칩들을 포함하는 팬 아웃 패키지 및 제조 방법 | |
JP2004349611A (ja) | 半導体基板、半導体基板の製造方法および半導体素子の製造方法 | |
JP2004022653A (ja) | 半導体装置 | |
JP2011061035A (ja) | 半導体装置の製造方法及びマスク | |
KR950001298B1 (ko) | 와이어 본딩 패드 형성방법 | |
US20240170367A1 (en) | Semiconductor device | |
US20240170432A1 (en) | Semiconductor device | |
JP5386302B2 (ja) | 半導体装置及び半導体装置の製造方法 | |
KR100763758B1 (ko) | 정렬 키 어셈블리의 제조 방법 | |
JP4987910B2 (ja) | 半導体素子の半田層の製造方法、半導体素子のマークの製造方法及び半導体素子のダイシング方法 | |
JP2018163919A (ja) | 半導体装置及びその製造方法 | |
KR20240039123A (ko) | 반도체 장치 및 그 제조 방법 | |
JP5464338B2 (ja) | 半導体装置、電子モジュール及びそれらの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120718 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130108 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130123 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130709 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130712 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |