JP5312033B2 - ワークピースの継ぎ目箇所を評価するための方法および装置 - Google Patents

ワークピースの継ぎ目箇所を評価するための方法および装置 Download PDF

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Publication number
JP5312033B2
JP5312033B2 JP2008540423A JP2008540423A JP5312033B2 JP 5312033 B2 JP5312033 B2 JP 5312033B2 JP 2008540423 A JP2008540423 A JP 2008540423A JP 2008540423 A JP2008540423 A JP 2008540423A JP 5312033 B2 JP5312033 B2 JP 5312033B2
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sensor
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JP2008540423A
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Japanese (ja)
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JP2009515705A5 (enExample
JP2009515705A (ja
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シュヴァルツ ヨアヒム
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Precitec Vision & CoKg GmbH
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Precitec Vision & CoKg GmbH
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044—Seam tracking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/12—Automatic feeding or moving of electrodes or work for spot or seam welding or cutting
    • B23K9/127—Means for tracking lines during arc welding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/12—Automatic feeding or moving of electrodes or work for spot or seam welding or cutting
    • B23K9/127—Means for tracking lines during arc welding or cutting
    • B23K9/1272—Geometry oriented, e.g. beam optical trading
    • B23K9/1274—Using non-contact, optical means, e.g. laser means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Geometry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2008540423A 2005-11-14 2006-11-10 ワークピースの継ぎ目箇所を評価するための方法および装置 Expired - Fee Related JP5312033B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH18232005 2005-11-14
CH1823/05 2005-11-14
PCT/CH2006/000634 WO2007053973A1 (de) 2005-11-14 2006-11-10 Verfahren und vorrichtung zur bewertung von fügestellen von werkstücken

Publications (3)

Publication Number Publication Date
JP2009515705A JP2009515705A (ja) 2009-04-16
JP2009515705A5 JP2009515705A5 (enExample) 2012-08-30
JP5312033B2 true JP5312033B2 (ja) 2013-10-09

Family

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JP2008540423A Expired - Fee Related JP5312033B2 (ja) 2005-11-14 2006-11-10 ワークピースの継ぎ目箇所を評価するための方法および装置

Country Status (9)

Country Link
US (1) US7983470B2 (enExample)
EP (1) EP1949026B1 (enExample)
JP (1) JP5312033B2 (enExample)
KR (1) KR101362006B1 (enExample)
CN (1) CN101479566B (enExample)
AT (1) ATE454604T1 (enExample)
CA (1) CA2628129C (enExample)
DE (1) DE502006005886D1 (enExample)
WO (1) WO2007053973A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2061621B1 (de) * 2006-09-06 2011-10-26 Precitec Vision GmbH & Co. KG Verfahren und vorrichtung zur optischen beurteilung der schweissqualität beim schweissen
DE102009042986B3 (de) 2009-09-25 2011-03-03 Precitec Kg Schweißkopf und Verfahren zum Fügen eines Werkstücks
EP2618958B1 (de) * 2010-09-24 2017-01-18 Universität Stuttgart Nutzung der polarisation der wärmestrahlung zur detektion von 3d-strukturen
JP5648600B2 (ja) * 2011-06-17 2015-01-07 株式会社デンソー 画像処理装置
DE102011104550B4 (de) * 2011-06-17 2014-04-30 Precitec Kg Optische Messvorrichtung zur Überwachung einer Fügenaht, Fügekopf und Laserschweißkopf mit der selben
DE102012108902B4 (de) 2012-09-21 2019-03-28 SmartRay GmbH Optischer Kopf sowie Düsenkopf mit einem optischen Kopf und Verfahren für deren Betrieb
CN103846539A (zh) * 2012-11-29 2014-06-11 上海航天设备制造总厂 图像识别方法
CN103846538A (zh) * 2012-11-29 2014-06-11 上海航天设备制造总厂 图像识别装置及利用所述装置的电池阵焊接系统
DE102013017795C5 (de) * 2013-10-25 2018-01-04 Lessmüller Lasertechnik GmbH Prozessüberwachungsverfahren und -vorrichtung
DE102016102492B4 (de) 2016-02-12 2021-10-07 Precitec Gmbh & Co. Kg Verfahren und Vorrichtung zum Überwachen einer Fügenaht sowie Laserbearbeitungskopf
DE102017102762B4 (de) 2017-02-13 2023-06-15 Precitec Gmbh & Co. Kg Verfahren zum Erkennen von Fügepositionen von Werkstücken und Laserbearbeitungskopf mit einer Vorrichtung zur Durchführung dieses Verfahrens
DE102017126867A1 (de) * 2017-11-15 2019-05-16 Precitec Gmbh & Co. Kg Laserbearbeitungssystem und Verfahren zur Laserbearbeitung
US11150622B2 (en) * 2017-11-16 2021-10-19 Bentley Systems, Incorporated Quality control isometric for inspection of field welds and flange bolt-up connections
WO2019110114A1 (en) * 2017-12-07 2019-06-13 Bystronic Laser Ag Device for monitoring beam treatment of a workpiece and use thereof, device for beam treatment of a workpiece and use thereof, method for monitoring beam treatment of a workpiece, method for beam treatment of a workpiece
US11394879B2 (en) * 2018-04-04 2022-07-19 Sri International Methods for enhanced imaging based on semantic processing and dynamic scene modeling
WO2020042031A1 (zh) * 2018-08-29 2020-03-05 深圳配天智能技术研究院有限公司 视觉焊接系统的缝隙检测方法以及系统
DE102018217919A1 (de) * 2018-10-19 2020-04-23 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Ermitteln einer korrigierten Bearbeitungskopf-Position und Bearbeitungsmaschine
WO2020246416A1 (ja) * 2019-06-06 2020-12-10 パナソニックＩｐマネジメント株式会社 溶接条件設定支援装置
EP3756702B1 (de) * 2019-06-27 2025-04-30 SCHOTT Pharma AG & Co. KGaA Verpackung und verfahren zum sterilen verpacken von objekten für medizinische, pharmazeutische oder kosmetische anwendungen
JP7382762B2 (ja) * 2019-08-27 2023-11-17 株式会社ディスコ レーザー加工装置の加工結果の良否判定方法
DE102020122924A1 (de) 2020-09-02 2022-03-03 Precitec Gmbh & Co. Kg Verfahren zum Analysieren einer Werkstückoberfläche für einen Laserbearbeitungsprozess und eine Analysevorrichtung zum Analysieren einer Werkstückoberfläche
CN112347674B (zh) * 2020-11-09 2024-10-01 西安热工研究院有限公司 一种狭小空间分块固定配重块的动力特性评估系统及方法
CN114850741B (zh) * 2022-06-10 2023-06-27 东南大学 一种适用于平板对接焊缝的焊缝识别装置及识别方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154771A (ja) * 1984-12-27 1986-07-14 Hitachi Ltd 溶接位置検出装置
JPS6233064A (ja) * 1985-08-05 1987-02-13 Mitsubishi Heavy Ind Ltd 自動多層溶接装置
DE4312241A1 (de) * 1993-04-15 1994-10-20 Deutsche Aerospace Verfahren zur Nahtvermessung
JP2000271743A (ja) * 1999-03-26 2000-10-03 Hitachi Metals Ltd 溶接部検査方法並びに検査装置及び配管用溶接管
DE50215016D1 (de) * 2001-11-15 2011-06-01 Precitec Vision Gmbh & Co Kg Verfahren und Vorrichtung zur Erfassung der Nahtqualität einer Schweißnaht bei der Schweißung von Werkstücken
US6931149B2 (en) * 2002-04-19 2005-08-16 Norsk Elektro Optikk A/S Pipeline internal inspection device and method
US7257248B2 (en) * 2003-03-27 2007-08-14 General Electric Company Non-contact measurement system and method
JP4403881B2 (ja) * 2004-05-28 2010-01-27 株式会社Ｉｈｉ 溶接部可視化装置

Also Published As

Publication number Publication date
KR20080068840A (ko) 2008-07-24
CA2628129C (en) 2012-05-01
ATE454604T1 (de) 2010-01-15
CA2628129A1 (en) 2007-05-18
CN101479566A (zh) 2009-07-08
KR101362006B1 (ko) 2014-02-11
WO2007053973A1 (de) 2007-05-18
EP1949026B1 (de) 2010-01-06
DE502006005886D1 (de) 2010-02-25
US7983470B2 (en) 2011-07-19
CN101479566B (zh) 2012-05-30
JP2009515705A (ja) 2009-04-16
EP1949026A1 (de) 2008-07-30
US20080232677A1 (en) 2008-09-25

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