JP5301589B2 - ウエハー容器をパージする方法 - Google Patents
ウエハー容器をパージする方法 Download PDFInfo
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- JP5301589B2 JP5301589B2 JP2011042017A JP2011042017A JP5301589B2 JP 5301589 B2 JP5301589 B2 JP 5301589B2 JP 2011042017 A JP2011042017 A JP 2011042017A JP 2011042017 A JP2011042017 A JP 2011042017A JP 5301589 B2 JP5301589 B2 JP 5301589B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packages (AREA)
- Check Valves (AREA)
- Devices For Use In Laboratory Experiments (AREA)
Description
通常、搬送容器はシリコンウエハや磁性ディスクの加工の前、間及び後において一括して該ウエハーやディスクを搬送及び/又は貯蔵するのに利用される。前記ウエハーは集積回路へと加工され、ディスクはコンピュータ用の磁性記憶ディスクへと加工されることができる。ウエハー、ディスク、基板といった用語はこの記載中においては置換可能に用いられており、これらの用語はいずれも他に特に示されていないかぎり、半導体ウエハー、磁性ディスク、フラットパネル基板や他の同様な基板を推し得る。
図1Aは、ウエハー容器102、底部104及び囲み部106を有するウエハー容器組立体100の一例を図示している。底部104はウエハー容器102を外気108から隔離することができる内部空間を形成するために囲み部106と密封的に係合するためのものである。図1に示すように、ウエハー容器102はその内部に複数のシリコンウエハを保持し、位置を決めるための複数の構成部材110を有することができる。通常、構成部材110は隣接するウエハーとの接触が最小となるようシリコンウエハを保持し位置決めし、これによって、シリコンウエハの加工及び/または輸送中に起こり得るウエハーの損傷を減らすことができる。図1Bは、開口した前部104、前部ドア105、及び囲み部107を有しFOUPsまたはFOSBとして知られる他の形状のウエハー容器組立体103を図示している。ウエハーWは開口した前部から水平方向に取り出すことができる。内部側に形成されたスロットはウエハーを保持する。シールを備えた前部ドア105は、外気から隔離された内部空間を形成するために囲み部107と密封的に係合する。ウエハー容器の構造は、参照によってここに導入する、例えばバートら(Bhatt et al. )の複合基板キャリヤ(Composite Substrate Carrier)という名称の米国特許第6,428,729号に記載されている。加えて、前開口部及びそこに係止するドアを有し、FOUPsまたはFOSBsとして知られるウエハー搬送容器は本出願の出願人によって所有され、参照によってここに導入する、例えば米国特許第6,354,601号、同5,788,082号、同6,010,008号に記載されている。グロメット124、125用の受容構造109が囲み部の底壁中にあり得る。
Claims (10)
- ウエハー容器をパージする方法であって、
穴を形成する内向面を有するグロメットと、前記穴の中に少なくとも部分的に配置された作動部材と、を有するウエハー容器を選択する段階、ここで、前記グロメットは弾性材料で作られており、前記穴は流路を形成しており、前記作動部材は前記穴の内向面において弾性材料とシール係合しており、前記グロメットはウエハー容器の外側に露出した弾性部を有しており、前記弾性部は着座面を提供しており、
前記弾性部の着座面をパージ用ノズルに接触させる段階、
前記ノズルからの力で前記弾性部を圧縮することによって、前記グロメットをパージ源と連結する段階、及び
パージガスをウエハー容器に導入する段階
を有することを特徴とする方法。 - 前記ウエハー容器がドアと下向きの面を有するグロメットとを有しており、
前記ウエハー容器の下から前記グロメットを前記ノズルと係合する段階を含むことを特徴とする請求項1に記載の方法。 - 前記グロメットの軸に対して垂直である前記グロメットの一面に前記ノズルを係合する段階を有することを特徴とする請求項1に記載の方法。
- 前記ノズルの接触部は、前記グロメットの穴の周囲であり且つ該穴から径方向に離間していることを特徴とする請求項1に記載の方法。
- ウエハー容器をパージする方法であって、
ドアを有する開閉式の容器とグロメットとを備えるウエハー容器を選択する段階、ここで、前記グロメットは弾性材料で作られており、前記グロメットは軸と一面と内部を貫通する開口部とを有し、前記グロメットは前記容器の外部から内部への流路を提供しており、前記グロメットの一面は前記軸に垂直な平面であり且つ前記流路の周囲に位置しており、
前記グロメットの一面をパージ用ガス源に連結する段階、
ノズルからの力で前記グロメットの弾性材料を前記グロメットの平面上に軸方向に圧縮することによって、前記流路の径方向外側において前記グロメットと前記ノズルとの間をシールする段階、及び
前記容器の内部にある少なくとも一部のガスを前記パージ用ガス源からのガスで置換する段階
を有することを特徴とする方法。 - 前記容器の内部にあるガスを置換する段階は、真空によって前記ウエハー容器の内部にあるガスを吸い出すことによって行われることを特徴とする請求項5に記載の方法。
- 前記ノズルの接触箇所は、前記グロメットの穴の周囲であり且つ該穴から径方向に離間していることを特徴とする請求項5に記載の方法。
- 前記グロメットの軸に垂直な前記グロメットの平面に前記ノズルを係合する段階を含むことを特徴とする請求項5に記載の方法。
- 前記作動部材は逆止弁であることを特徴とする請求項1に記載の方法。
- 前記グロメット内の逆止弁によってパージ用ガスの流れを制御する段階を含むことを特徴とする請求項8に記載の方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56352804P | 2004-04-18 | 2004-04-18 | |
US60/563,528 | 2004-04-18 | ||
US11/108,619 US7328727B2 (en) | 2004-04-18 | 2005-04-17 | Substrate container with fluid-sealing flow passageway |
US11/108,619 | 2005-04-17 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007508637A Division JP5213440B2 (ja) | 2004-04-18 | 2005-04-18 | 基板容器及び基板容器用の作動サブアッセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011181930A JP2011181930A (ja) | 2011-09-15 |
JP5301589B2 true JP5301589B2 (ja) | 2013-09-25 |
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ID=35197529
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007508637A Active JP5213440B2 (ja) | 2004-04-18 | 2005-04-18 | 基板容器及び基板容器用の作動サブアッセンブリ |
JP2011042017A Active JP5301589B2 (ja) | 2004-04-18 | 2011-02-28 | ウエハー容器をパージする方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007508637A Active JP5213440B2 (ja) | 2004-04-18 | 2005-04-18 | 基板容器及び基板容器用の作動サブアッセンブリ |
Country Status (6)
Country | Link |
---|---|
US (3) | US7328727B2 (ja) |
EP (1) | EP1737763A2 (ja) |
JP (2) | JP5213440B2 (ja) |
KR (1) | KR101213311B1 (ja) |
CN (1) | CN101683650B (ja) |
WO (1) | WO2005102872A2 (ja) |
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-
2005
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- 2005-04-18 JP JP2007508637A patent/JP5213440B2/ja active Active
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WO2005102872A2 (en) | 2005-11-03 |
US7328727B2 (en) | 2008-02-12 |
KR101213311B1 (ko) | 2012-12-17 |
US20050252827A1 (en) | 2005-11-17 |
JP2011181930A (ja) | 2011-09-15 |
EP1737763A2 (en) | 2007-01-03 |
US8727125B2 (en) | 2014-05-20 |
US20080121560A1 (en) | 2008-05-29 |
US20150041359A1 (en) | 2015-02-12 |
KR20070007936A (ko) | 2007-01-16 |
WO2005102872A3 (en) | 2006-12-21 |
CN101683650B (zh) | 2011-12-21 |
JP2007533166A (ja) | 2007-11-15 |
CN101683650A (zh) | 2010-03-31 |
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