JP5293594B2 - 電子部品装置及びリードフレーム - Google Patents

電子部品装置及びリードフレーム Download PDF

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Publication number
JP5293594B2
JP5293594B2 JP2009297830A JP2009297830A JP5293594B2 JP 5293594 B2 JP5293594 B2 JP 5293594B2 JP 2009297830 A JP2009297830 A JP 2009297830A JP 2009297830 A JP2009297830 A JP 2009297830A JP 5293594 B2 JP5293594 B2 JP 5293594B2
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JP
Japan
Prior art keywords
terminal
electronic component
shield case
package body
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009297830A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011138921A (ja
Inventor
浩仁 林
政利 有城
邦夫 畑中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2009297830A priority Critical patent/JP5293594B2/ja
Priority to DE201010063813 priority patent/DE102010063813A1/de
Priority to CN2010106231001A priority patent/CN102110670A/zh
Publication of JP2011138921A publication Critical patent/JP2011138921A/ja
Application granted granted Critical
Publication of JP5293594B2 publication Critical patent/JP5293594B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73151—Location prior to the connecting process on different surfaces
    • H01L2224/73153—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)
JP2009297830A 2009-12-28 2009-12-28 電子部品装置及びリードフレーム Active JP5293594B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009297830A JP5293594B2 (ja) 2009-12-28 2009-12-28 電子部品装置及びリードフレーム
DE201010063813 DE102010063813A1 (de) 2009-12-28 2010-12-21 Elektronikkomponentenvorrichtung und Leitungsrahmen
CN2010106231001A CN102110670A (zh) 2009-12-28 2010-12-27 电子部件装置及引线框

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009297830A JP5293594B2 (ja) 2009-12-28 2009-12-28 電子部品装置及びリードフレーム

Publications (2)

Publication Number Publication Date
JP2011138921A JP2011138921A (ja) 2011-07-14
JP5293594B2 true JP5293594B2 (ja) 2013-09-18

Family

ID=44174784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009297830A Active JP5293594B2 (ja) 2009-12-28 2009-12-28 電子部品装置及びリードフレーム

Country Status (3)

Country Link
JP (1) JP5293594B2 (zh)
CN (1) CN102110670A (zh)
DE (1) DE102010063813A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093418A (ja) 2011-10-25 2013-05-16 Japan Aviation Electronics Industry Ltd 半導体装置用パッケージの集合体、半導体装置の集合体、半導体装置の製造方法
CN113091921A (zh) * 2021-03-26 2021-07-09 瓷金科技(河南)有限公司 贴片式传感器用封装管壳及使用该管壳的贴片式传感器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05831Y2 (zh) * 1987-01-26 1993-01-11
JPH0428446U (zh) * 1990-06-29 1992-03-06
JPH07288332A (ja) * 1994-02-25 1995-10-31 Fujitsu Ltd 光素子組立体とその製造方法
JPH10335867A (ja) * 1997-05-30 1998-12-18 Ando Electric Co Ltd 組立式シ−ルドケ−ス
JP4433050B2 (ja) * 2005-05-26 2010-03-17 株式会社村田製作所 電子部品用パッケージの製造方法、及び電子部品の製造方法
JP2009038077A (ja) * 2007-07-31 2009-02-19 Yamaha Corp プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ

Also Published As

Publication number Publication date
JP2011138921A (ja) 2011-07-14
CN102110670A (zh) 2011-06-29
DE102010063813A1 (de) 2011-06-30

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