JP5293594B2 - 電子部品装置及びリードフレーム - Google Patents
電子部品装置及びリードフレーム Download PDFInfo
- Publication number
- JP5293594B2 JP5293594B2 JP2009297830A JP2009297830A JP5293594B2 JP 5293594 B2 JP5293594 B2 JP 5293594B2 JP 2009297830 A JP2009297830 A JP 2009297830A JP 2009297830 A JP2009297830 A JP 2009297830A JP 5293594 B2 JP5293594 B2 JP 5293594B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electronic component
- shield case
- package body
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73151—Location prior to the connecting process on different surfaces
- H01L2224/73153—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/166—Material
- H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Aerials (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009297830A JP5293594B2 (ja) | 2009-12-28 | 2009-12-28 | 電子部品装置及びリードフレーム |
DE201010063813 DE102010063813A1 (de) | 2009-12-28 | 2010-12-21 | Elektronikkomponentenvorrichtung und Leitungsrahmen |
CN2010106231001A CN102110670A (zh) | 2009-12-28 | 2010-12-27 | 电子部件装置及引线框 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009297830A JP5293594B2 (ja) | 2009-12-28 | 2009-12-28 | 電子部品装置及びリードフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011138921A JP2011138921A (ja) | 2011-07-14 |
JP5293594B2 true JP5293594B2 (ja) | 2013-09-18 |
Family
ID=44174784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009297830A Active JP5293594B2 (ja) | 2009-12-28 | 2009-12-28 | 電子部品装置及びリードフレーム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5293594B2 (zh) |
CN (1) | CN102110670A (zh) |
DE (1) | DE102010063813A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013093418A (ja) | 2011-10-25 | 2013-05-16 | Japan Aviation Electronics Industry Ltd | 半導体装置用パッケージの集合体、半導体装置の集合体、半導体装置の製造方法 |
CN113091921A (zh) * | 2021-03-26 | 2021-07-09 | 瓷金科技(河南)有限公司 | 贴片式传感器用封装管壳及使用该管壳的贴片式传感器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05831Y2 (zh) * | 1987-01-26 | 1993-01-11 | ||
JPH0428446U (zh) * | 1990-06-29 | 1992-03-06 | ||
JPH07288332A (ja) * | 1994-02-25 | 1995-10-31 | Fujitsu Ltd | 光素子組立体とその製造方法 |
JPH10335867A (ja) * | 1997-05-30 | 1998-12-18 | Ando Electric Co Ltd | 組立式シ−ルドケ−ス |
JP4433050B2 (ja) * | 2005-05-26 | 2010-03-17 | 株式会社村田製作所 | 電子部品用パッケージの製造方法、及び電子部品の製造方法 |
JP2009038077A (ja) * | 2007-07-31 | 2009-02-19 | Yamaha Corp | プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ |
-
2009
- 2009-12-28 JP JP2009297830A patent/JP5293594B2/ja active Active
-
2010
- 2010-12-21 DE DE201010063813 patent/DE102010063813A1/de not_active Withdrawn
- 2010-12-27 CN CN2010106231001A patent/CN102110670A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN102110670A (zh) | 2011-06-29 |
DE102010063813A1 (de) | 2011-06-30 |
JP2011138921A (ja) | 2011-07-14 |
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