JP5293326B2 - 絶縁物被覆軟磁性粉末、造粒粉、絶縁物被覆軟磁性粉末の製造方法、圧粉磁心および磁性素子 - Google Patents

絶縁物被覆軟磁性粉末、造粒粉、絶縁物被覆軟磁性粉末の製造方法、圧粉磁心および磁性素子 Download PDF

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JP5293326B2
JP5293326B2 JP2009075206A JP2009075206A JP5293326B2 JP 5293326 B2 JP5293326 B2 JP 5293326B2 JP 2009075206 A JP2009075206 A JP 2009075206A JP 2009075206 A JP2009075206 A JP 2009075206A JP 5293326 B2 JP5293326 B2 JP 5293326B2
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core
soft magnetic
powder
insulating material
insulator
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JP2010232224A5 (enExample
JP2010232224A (ja
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勇 大塚
篤 渡邉
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Seiko Epson Corp
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Seiko Epson Corp
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JP2009075206A 2009-03-25 2009-03-25 絶縁物被覆軟磁性粉末、造粒粉、絶縁物被覆軟磁性粉末の製造方法、圧粉磁心および磁性素子 Active JP5293326B2 (ja)

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KR101503104B1 (ko) * 2011-08-01 2015-03-16 삼성전기주식회사 금속 자성 분말, 상기 금속 자성 분말을 포함하는 자성층 재료, 및 자성층 재료를 이용한 자성층을 포함하는 적층형 칩 부품
JP6322886B2 (ja) 2012-11-20 2018-05-16 セイコーエプソン株式会社 複合粒子、複合粒子の製造方法、圧粉磁心、磁性素子および携帯型電子機器
CN104759619B (zh) * 2015-01-16 2016-10-05 横店集团东磁股份有限公司 一种金属磁粉绝缘处理及制备金属磁粉芯的方法
KR102118493B1 (ko) * 2015-03-19 2020-06-03 삼성전기주식회사 자성 분말, 그 제조방법 및 이를 포함하는 코일 전자부품
KR102105390B1 (ko) 2015-07-31 2020-04-28 삼성전기주식회사 자성 분말 및 이를 포함하는 코일 전자부품
KR102335425B1 (ko) * 2020-01-09 2021-12-06 삼성전기주식회사 자성 분말 및 자성 분말을 포함하는 코일 부품
DE112021000925T5 (de) * 2020-03-31 2022-11-17 Murata Manufacturing Co., Ltd. Beschichteter weichmagnetischer legierungspartikel, massekern, magnetisches beaufschlagungsbauteil und verfahren zur herstellung des beschichteten weichen magnetischen legierungspartikels
JP7767019B2 (ja) * 2021-03-26 2025-11-11 Tdk株式会社 軟磁性粉末、磁性体コアおよび磁性部品
CN115206622A (zh) * 2022-06-02 2022-10-18 深圳市信维通信股份有限公司 一种软磁合金粉末及其制备方法
CN118645353B (zh) * 2024-05-22 2025-07-22 山东恒瑞磁电股份有限公司 一种合金磁粉的包覆方法及其包覆装置

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Publication number Priority date Publication date Assignee Title
JPH10212503A (ja) * 1996-11-26 1998-08-11 Kubota Corp 非晶質軟磁性合金粉末成形体及びその製造方法
JP2002105502A (ja) * 2000-09-26 2002-04-10 Kubota Corp 軟質磁性金属粉末および粉末集合体並びに圧縮成形体
JP4701797B2 (ja) * 2005-04-04 2011-06-15 Ｊｆｅスチール株式会社 圧粉磁芯用被覆鉄基粉末および圧粉磁芯
JP5067544B2 (ja) * 2007-09-11 2012-11-07 住友電気工業株式会社 リアクトル用コアとその製造方法およびリアクトル

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