JP5293326B2 - 絶縁物被覆軟磁性粉末、造粒粉、絶縁物被覆軟磁性粉末の製造方法、圧粉磁心および磁性素子 - Google Patents
絶縁物被覆軟磁性粉末、造粒粉、絶縁物被覆軟磁性粉末の製造方法、圧粉磁心および磁性素子 Download PDFInfo
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- JP5293326B2 JP5293326B2 JP2009075206A JP2009075206A JP5293326B2 JP 5293326 B2 JP5293326 B2 JP 5293326B2 JP 2009075206 A JP2009075206 A JP 2009075206A JP 2009075206 A JP2009075206 A JP 2009075206A JP 5293326 B2 JP5293326 B2 JP 5293326B2
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KR101503104B1 (ko) * | 2011-08-01 | 2015-03-16 | 삼성전기주식회사 | 금속 자성 분말, 상기 금속 자성 분말을 포함하는 자성층 재료, 및 자성층 재료를 이용한 자성층을 포함하는 적층형 칩 부품 |
JP6322886B2 (ja) | 2012-11-20 | 2018-05-16 | セイコーエプソン株式会社 | 複合粒子、複合粒子の製造方法、圧粉磁心、磁性素子および携帯型電子機器 |
CN104759619B (zh) * | 2015-01-16 | 2016-10-05 | 横店集团东磁股份有限公司 | 一种金属磁粉绝缘处理及制备金属磁粉芯的方法 |
KR102118493B1 (ko) * | 2015-03-19 | 2020-06-03 | 삼성전기주식회사 | 자성 분말, 그 제조방법 및 이를 포함하는 코일 전자부품 |
KR102105390B1 (ko) | 2015-07-31 | 2020-04-28 | 삼성전기주식회사 | 자성 분말 및 이를 포함하는 코일 전자부품 |
KR102335425B1 (ko) * | 2020-01-09 | 2021-12-06 | 삼성전기주식회사 | 자성 분말 및 자성 분말을 포함하는 코일 부품 |
DE112021000925T5 (de) * | 2020-03-31 | 2022-11-17 | Murata Manufacturing Co., Ltd. | Beschichteter weichmagnetischer legierungspartikel, massekern, magnetisches beaufschlagungsbauteil und verfahren zur herstellung des beschichteten weichen magnetischen legierungspartikels |
JP2022150492A (ja) * | 2021-03-26 | 2022-10-07 | Tdk株式会社 | 軟磁性粉末、磁性体コアおよび磁性部品 |
CN115206622A (zh) * | 2022-06-02 | 2022-10-18 | 深圳市信维通信股份有限公司 | 一种软磁合金粉末及其制备方法 |
CN118645353B (zh) * | 2024-05-22 | 2025-07-22 | 山东恒瑞磁电股份有限公司 | 一种合金磁粉的包覆方法及其包覆装置 |
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JPH10212503A (ja) * | 1996-11-26 | 1998-08-11 | Kubota Corp | 非晶質軟磁性合金粉末成形体及びその製造方法 |
JP2002105502A (ja) * | 2000-09-26 | 2002-04-10 | Kubota Corp | 軟質磁性金属粉末および粉末集合体並びに圧縮成形体 |
JP4701797B2 (ja) * | 2005-04-04 | 2011-06-15 | Jfeスチール株式会社 | 圧粉磁芯用被覆鉄基粉末および圧粉磁芯 |
JP5067544B2 (ja) * | 2007-09-11 | 2012-11-07 | 住友電気工業株式会社 | リアクトル用コアとその製造方法およびリアクトル |
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