JP5286383B2 - トグル式位置合わせプラットフォーム - Google Patents
トグル式位置合わせプラットフォーム Download PDFInfo
- Publication number
- JP5286383B2 JP5286383B2 JP2011095363A JP2011095363A JP5286383B2 JP 5286383 B2 JP5286383 B2 JP 5286383B2 JP 2011095363 A JP2011095363 A JP 2011095363A JP 2011095363 A JP2011095363 A JP 2011095363A JP 5286383 B2 JP5286383 B2 JP 5286383B2
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- work platform
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000033001 locomotion Effects 0.000 description 28
- 230000007246 mechanism Effects 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000037396 body weight Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/18—Mechanical movements
- Y10T74/18568—Reciprocating or oscillating to or from alternating rotary
- Y10T74/18576—Reciprocating or oscillating to or from alternating rotary including screw and nut
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20341—Power elements as controlling elements
- Y10T74/20354—Planar surface with orthogonal movement only
Description
シングルトグル式機構の運動分解能は、下記式2になる。
結果は、図4に示す。
ダブルトグル式機構の運動分解能は、下記式3になる。
式3で示す分解能の演算式は、二つのトグルリンク夾角が対称であると仮定した簡単化式である。それは、実際との差が小さいため、式3で示すことにした。
結果は、図5に示す。
110 モーター
112 スクリュー
120 リンク
130 ガイド
132 玉軸受
150 作業プラットフォーム
200 基部
210 モーター
212 スクリュー
220 第一リンク
222 第二リンク
230 第一直線性制限ユニット
232 玉軸受
234 第二直線性制限ユニット
250 作業プラットフォーム
612 基部
614 作業プラットフォーム
622 第一夾角
624 第二夾角
626 第三夾角
632 ボールスクリュー
634 第一リンク
636 第二リンク
638 第三リンク
642 スライド
644 直線性軸受
646 モーター
648 基部
650 支持架
652 玉軸受およびボルト
654 所定の経路
702 基部
704 モーター
706 支持架
708 直線性軸受
710 ボールスクリュー
712 L字形支持架
714 第一リンク
716 第二リンク
718 第三リンク
720 作業プラットフォーム
722 スライド
724 ピンおよびCクリップ
726 所定の経路
728 回転固定軸
Claims (2)
- 基部と、
該基部上に配置されているスクリューと、
該基部上に位置され、該スクリューを回転させる回転部品と、
該基部上に位置され、両端部を有する第一リンクであって、該第一リンクの第一端部は、該スクリューの方向に対して垂直な方向に移動しないように、該スクリューに連結されており、該スクリューの回転により該第一リンクの第一端部が該スクリューの方向に沿って往復運動する該第一リンクと、
両端部を有する第二リンクであって、該第二リンクの第一端部が該第一リンクの第二端部に連結され、該第二リンクの第二端部が該基部に固定される第二リンクと、
該第二リンクの一部に連結されており、両端部を有する第三リンクであって、該第三リンクの第一端部が該第二リンクの第一端部と第二端部の間に連結されている該第三リンクと、
該基部上に位置され、該第三リンクの第二端部に連結されている作業プラットフォームと、
該基部上に位置される直線性制限ユニットであって、該作業プラットフォームが該直線性制限ユニットの直線方向に沿って往復運動するように制限する直線性制限ユニットとを含むことを特徴とするトグル式位置合わせプラットフォーム。 - 該直線性制限ユニットは、玉軸受を含むことを特徴とする請求項1に記載のダブルトグル式位置合わせプラットフォーム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099112763 | 2010-04-23 | ||
TW099112763A TWI395633B (zh) | 2010-04-23 | 2010-04-23 | 肘節式定位平台 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011230283A JP2011230283A (ja) | 2011-11-17 |
JP5286383B2 true JP5286383B2 (ja) | 2013-09-11 |
Family
ID=44454770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011095363A Expired - Fee Related JP5286383B2 (ja) | 2010-04-23 | 2011-04-21 | トグル式位置合わせプラットフォーム |
Country Status (4)
Country | Link |
---|---|
US (1) | US8342055B2 (ja) |
EP (1) | EP2381468B1 (ja) |
JP (1) | JP5286383B2 (ja) |
TW (1) | TWI395633B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012112138A1 (en) * | 2011-02-15 | 2012-08-23 | Nanotronics Imaging, Llc | Continuously scanning xy translation stage |
PL2579234T3 (pl) * | 2011-10-07 | 2019-03-29 | E2M Technologies B.V. | Układ platformy ruchomej |
TWI472397B (zh) * | 2012-02-10 | 2015-02-11 | 中原大學 | Two - legged mobile platform structure |
JP5903930B2 (ja) * | 2012-02-27 | 2016-04-13 | 日新イオン機器株式会社 | 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 |
US9835235B2 (en) * | 2013-03-13 | 2017-12-05 | Asco Power Technologies, L.P. | Lead screw operated rack-in mechanism |
US9682454B2 (en) * | 2014-04-21 | 2017-06-20 | Robert James Suhling | Micro-adjustable flip-away work stop for strut systems |
US20170067548A1 (en) * | 2015-08-17 | 2017-03-09 | Peter Neuhaus | Linkage Actuator |
CN107953128A (zh) * | 2017-12-29 | 2018-04-24 | 苏州宝特威机电有限公司 | 汽车转向节夹持装置 |
US11383336B2 (en) | 2020-06-18 | 2022-07-12 | Robert James Suhling | Reversible flip-away work stop for strut systems |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5522484A (en) * | 1978-11-21 | 1980-02-18 | Nakayama Shiki Zairyo Kk | Driving apparatus for cutter blade folding machine |
JPS6288527A (ja) * | 1985-10-14 | 1987-04-23 | Shigeo Shimizu | ボ−ルガイド装置 |
KR0129662B1 (ko) * | 1987-10-30 | 1998-04-07 | 고다까 토시오 | 이동 테이블 장치 |
US4972574A (en) * | 1988-06-08 | 1990-11-27 | Mamiya Denshi Co., Ltd. | Table driving apparatus |
DK0427872T3 (da) * | 1989-06-08 | 1997-09-29 | Yoshiki Kogyo Kk | Vippearm med et langs en translationsakse bevægeligt vippeled, samt et mekanisk apparat, hvori den anvendes |
JP2798829B2 (ja) * | 1991-10-17 | 1998-09-17 | 健 柳沢 | 2次元運動機構 |
JP3346838B2 (ja) * | 1993-06-29 | 2002-11-18 | 有限会社創造庵 | 回転運動機構 |
JPH0768437A (ja) * | 1993-09-03 | 1995-03-14 | Souzouan:Kk | 2次元運動機構 |
US5440943A (en) * | 1993-09-15 | 1995-08-15 | Intest Corporation | Electronic test head manipulator |
JP3596187B2 (ja) * | 1996-09-20 | 2004-12-02 | 日立工機株式会社 | アクチュエータ機構及びアクチュエータ機構を有する遠心機 |
US5724893A (en) * | 1996-10-15 | 1998-03-10 | Taichung Machinery Works Co. Ltd. | Servo-type shaking table assembly |
US5903125A (en) * | 1997-02-06 | 1999-05-11 | Speedline Technologies, Inc. | Positioning system |
US6271657B1 (en) * | 1997-07-25 | 2001-08-07 | Advantest Corporation | Test head positioner for semiconductor device testing apparatus |
US5982132A (en) * | 1997-10-09 | 1999-11-09 | Electroglas, Inc. | Rotary wafer positioning system and method |
EP0916446B1 (de) * | 1997-10-20 | 2002-05-02 | Hüller Hille GmbH | Werkzeugmaschine zur 3-achsigen Bearbeitung von Werkstücken |
JP3880226B2 (ja) * | 1998-10-22 | 2007-02-14 | キヤノン株式会社 | 頭部装着型画像表示装置 |
DE19858428C2 (de) * | 1998-12-17 | 2002-09-12 | Leica Microsystems | Koordinaten-Messanordnung |
DE10206414A1 (de) * | 2001-03-16 | 2002-10-02 | Siemens Ag | Vorrichtung zur Positionierung eines Werkzeugs innerhalb eines vorgegebenen Arbeitsbereichs |
JP2002292708A (ja) * | 2001-03-30 | 2002-10-09 | Nissei Plastics Ind Co | 射出成形機の駆動装置 |
JP3930795B2 (ja) * | 2002-11-07 | 2007-06-13 | 日精樹脂工業株式会社 | トグルリンク式型締装置の型厚検出装置 |
JP2004223647A (ja) * | 2003-01-22 | 2004-08-12 | Nsk Ltd | 位置決め装置 |
JP4291709B2 (ja) * | 2003-04-16 | 2009-07-08 | 株式会社ダイヘン | 直線移動機構およびこれを用いた搬送ロボット |
TWI302862B (en) * | 2006-05-18 | 2008-11-11 | Univ Chung Yuan Christian | Toggle-type positioning platform and toggle-type machine center |
TWI367144B (en) * | 2009-05-05 | 2012-07-01 | Univ Chung Yuan Christian | Three-link toggle type positioning platform |
JP4860732B2 (ja) * | 2009-08-06 | 2012-01-25 | 住友重機械工業株式会社 | 型厚調整方法 |
-
2010
- 2010-04-23 TW TW099112763A patent/TWI395633B/zh active
-
2011
- 2011-04-21 EP EP11163432.5A patent/EP2381468B1/en not_active Not-in-force
- 2011-04-21 JP JP2011095363A patent/JP5286383B2/ja not_active Expired - Fee Related
- 2011-04-25 US US13/093,101 patent/US8342055B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201136697A (en) | 2011-11-01 |
US8342055B2 (en) | 2013-01-01 |
US20110259139A1 (en) | 2011-10-27 |
TWI395633B (zh) | 2013-05-11 |
JP2011230283A (ja) | 2011-11-17 |
EP2381468A1 (en) | 2011-10-26 |
EP2381468B1 (en) | 2013-08-07 |
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