JP5284004B2 - 基板の処理装置 - Google Patents

基板の処理装置 Download PDF

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Publication number
JP5284004B2
JP5284004B2 JP2008212054A JP2008212054A JP5284004B2 JP 5284004 B2 JP5284004 B2 JP 5284004B2 JP 2008212054 A JP2008212054 A JP 2008212054A JP 2008212054 A JP2008212054 A JP 2008212054A JP 5284004 B2 JP5284004 B2 JP 5284004B2
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substrate
processing liquid
processing
liquid
semiconductor wafer
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JP2008212054A
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Japanese (ja)
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JP2010050226A5 (enrdf_load_stackoverflow
JP2010050226A (ja
Inventor
勉 菊池
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2008212054A priority Critical patent/JP5284004B2/ja
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  • Cleaning Or Drying Semiconductors (AREA)
JP2008212054A 2008-08-20 2008-08-20 基板の処理装置 Active JP5284004B2 (ja)

Priority Applications (1)

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JP2008212054A JP5284004B2 (ja) 2008-08-20 2008-08-20 基板の処理装置

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JP2008212054A JP5284004B2 (ja) 2008-08-20 2008-08-20 基板の処理装置

Publications (3)

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JP2010050226A JP2010050226A (ja) 2010-03-04
JP2010050226A5 JP2010050226A5 (enrdf_load_stackoverflow) 2011-10-06
JP5284004B2 true JP5284004B2 (ja) 2013-09-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11322346B2 (en) 2020-09-18 2022-05-03 Samsung Electronics Co., Ltd. Cleaning substrate method and method of processing substrate using the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5829082B2 (ja) * 2011-09-09 2015-12-09 オリンパス株式会社 洗浄装置
KR101355917B1 (ko) * 2011-10-11 2014-01-29 세메스 주식회사 분사유닛, 이를 가지는 기판처리장치
KR101330319B1 (ko) * 2011-10-11 2013-11-14 세메스 주식회사 분사유닛 및 이를 가지는 기판처리장치
US8849453B2 (en) 2012-02-29 2014-09-30 GM Global Technology Operations LLC Human grasp assist device with exoskeleton
US9355835B2 (en) * 2012-06-29 2016-05-31 Semes Co., Ltd. Method and apparatus for processing substrate
JP5936535B2 (ja) * 2012-12-28 2016-06-22 東京エレクトロン株式会社 液処理装置及び液処理方法
KR102375437B1 (ko) * 2014-11-28 2022-03-18 세메스 주식회사 기판 처리 장치 및 방법
JP6478692B2 (ja) * 2015-02-18 2019-03-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10332761B2 (en) 2015-02-18 2019-06-25 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP6404189B2 (ja) * 2015-08-07 2018-10-10 東京エレクトロン株式会社 基板液処理装置、基板液処理方法及び記憶媒体
JP6784546B2 (ja) * 2016-09-08 2020-11-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6831134B2 (ja) * 2016-10-25 2021-02-17 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体基板に対する湿式工程の装置および方法
TWI774756B (zh) * 2018-04-24 2022-08-21 大陸商盛美半導體設備（上海）股份有限公司 對半導體基板進行濕處理的裝置和方法
CN110896041B (zh) * 2018-09-13 2022-05-10 辛耘企业股份有限公司 基板处理设备及其流体供应装置
JP7504573B2 (ja) * 2019-09-30 2024-06-24 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834542B2 (ja) * 2001-11-01 2006-10-18 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
JP2006086415A (ja) * 2004-09-17 2006-03-30 Dainippon Screen Mfg Co Ltd 基板洗浄装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11322346B2 (en) 2020-09-18 2022-05-03 Samsung Electronics Co., Ltd. Cleaning substrate method and method of processing substrate using the same

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JP2010050226A (ja) 2010-03-04

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