JP5282405B2 - コイル及び半導体装置 - Google Patents

コイル及び半導体装置 Download PDF

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Publication number
JP5282405B2
JP5282405B2 JP2008014573A JP2008014573A JP5282405B2 JP 5282405 B2 JP5282405 B2 JP 5282405B2 JP 2008014573 A JP2008014573 A JP 2008014573A JP 2008014573 A JP2008014573 A JP 2008014573A JP 5282405 B2 JP5282405 B2 JP 5282405B2
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Japan
Prior art keywords
winding
coil
windings
width
smaller
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JP2008014573A
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Japanese (ja)
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JP2009176986A (ja
JP2009176986A5 (https=
Inventor
修平 新池
範夫 浜
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Seiko Epson Corp
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Seiko Epson Corp
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JP2008014573A 2008-01-25 2008-01-25 コイル及び半導体装置 Expired - Fee Related JP5282405B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008014573A JP5282405B2 (ja) 2008-01-25 2008-01-25 コイル及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008014573A JP5282405B2 (ja) 2008-01-25 2008-01-25 コイル及び半導体装置

Publications (3)

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JP2009176986A JP2009176986A (ja) 2009-08-06
JP2009176986A5 JP2009176986A5 (https=) 2011-02-03
JP5282405B2 true JP5282405B2 (ja) 2013-09-04

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ID=41031765

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JP2008014573A Expired - Fee Related JP5282405B2 (ja) 2008-01-25 2008-01-25 コイル及び半導体装置

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JP (1) JP5282405B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6639296B2 (ja) * 2016-03-23 2020-02-05 株式会社ジャパンディスプレイ 表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307723A (ja) * 1998-04-17 1999-11-05 Matsushita Electric Ind Co Ltd 平面トランス
US6396362B1 (en) * 2000-01-10 2002-05-28 International Business Machines Corporation Compact multilayer BALUN for RF integrated circuits
JP5683765B2 (ja) * 2001-09-04 2015-03-11 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 集積回路チップ及びその形成方法

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JP2009176986A (ja) 2009-08-06

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